TREA

Huat Kock Lee

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Patents Grantslast 30 patents

  • Information Patent Grant

    Stress-free lead frame
    • Patent number 7,786,554
    • Issue date Aug 31, 2010
    • Carsem (M) Sdn. Bhd.
    • Lee Kock Huat
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stress-free lead frame
    • Patent number 7,288,833
    • Issue date Oct 30, 2007
    • Carsem (M) Sdn. Bhd.
    • Lee Kock Huat
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stress-free lead frame
    • Patent number 6,867,483
    • Issue date Mar 15, 2005
    • Carsen Semiconductor SDN. BHD.
    • Lee Kock Huat
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for sawing a moulded leadframe package
    • Patent number 6,544,817
    • Issue date Apr 8, 2003
    • Carsem Semiconductor SDN. BHD.
    • Lee Kock Huat
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents