Hui C. Huang

Person

Taoyuan, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Composition and method for polishing and integrated circuit
- Patent number 12,359,090
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bevel edge removal methods, tools, and systems
- Patent number 12,362,201
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Chi Huang
- B08 - CLEANING
Information Patent Grant
Chemical mechanical polish slurry and method of manufacture
- Patent number 12,327,734
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chemical mechanical polishing method
- Patent number 12,300,508
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Tung-Kai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry composition and method for polishing and integrated circuit
- Patent number 12,297,375
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ji Cui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device structure with an interconnect structure in a...
- Patent number 12,249,542
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial source/drain recess formation with metal-comprising maski...
- Patent number 12,243,783
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,237,320
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and package structure
- Patent number 12,224,221
- Issue date Feb 11, 2025
- Harvatek Corporation
- Chin-Jui Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical cleaning tool for wafer polishing tool system
- Patent number 12,128,455
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Grant
Redundant system and method for providing power to devices
- Patent number 12,088,141
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hui-Huan Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Self-healing polishing pad
- Patent number 12,087,590
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hao Kung
- B24 - GRINDING POLISHING
Information Patent Grant
Double-sided flexible circuit board
- Patent number 12,089,326
- Issue date Sep 10, 2024
- Chipbond Technology Corporation
- Yin-Chen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure
- Patent number 12,068,303
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mega-sonic vibration assisted chemical mechanical planarization
- Patent number 12,036,636
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical planarization tool
- Patent number 12,030,159
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Kai Chen
- B24 - GRINDING POLISHING
Information Patent Grant
System and method for predicting diabetic retinopathy progression
- Patent number 12,027,272
- Issue date Jul 2, 2024
- TECHEVERST CO., LTD.
- Hui-Yang Huang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Packages including multiple encapsulated substrate blocks and overl...
- Patent number 12,027,435
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 12,015,002
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D package structure and methods of forming same
- Patent number 12,009,345
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 11,990,440
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 11,964,358
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for forming a package structure
- Patent number 11,961,817
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lactic acid bacteria and its applications
- Patent number 11,938,156
- Issue date Mar 26, 2024
- BENED BIOMEDICAL CO., LTD.
- Ying-Chieh Tsai
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
Semiconductor package system and method
- Patent number 11,901,319
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die including stress-resistant bonding structures and...
- Patent number 11,887,955
- Issue date Jan 30, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tissue repair device and method for using the same
- Patent number 11,850,143
- Issue date Dec 26, 2023
- Industrial Technology Research Institute
- Chih-Chieh Huang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 11,854,964
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic slurry for highly efficiency CMP
- Patent number 11,854,827
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Ting Chen
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device structure with interconnect structure and meth...
- Patent number 11,854,872
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TISSUE SCAFFOLD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250205038
- Publication date Jun 26, 2025
- Industrial Technology Research Institute
- Chih-Chieh Huang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Use of Lactobacillus reuteri Y7 strain for prevention or treatment...
- Publication number 20250099517
- Publication date Mar 27, 2025
- TAIPEI MEDICAL UNIVERSITY
- Hui-Yu Huang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
GATE HEIGHT OPTIMIZATION
- Publication number 20250031426
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Heng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...
- Publication number 20240404839
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING TOOL AND METHOD
- Publication number 20240395537
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-hsiang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISH SLURRY AND METHOD OF MANUFACTURE
- Publication number 20240395562
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Kung
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
REDUNDANT SYSTEM AND METHOD FOR PROVIDING POWER TO DEVICES
- Publication number 20240388124
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Huan HUANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Source/Drain Regions and Methods of Forming Same
- Publication number 20240379454
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240367202
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B24 - GRINDING POLISHING
Information Patent Application
SELF-HEALING POLISHING PAD
- Publication number 20240371648
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Kung
- B24 - GRINDING POLISHING
Information Patent Application
WAFER EDGE TRIMMING PROCESS AND METHODS THEREOF
- Publication number 20240339326
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-I Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240332235
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Blade Trimming and Dressing Tool
- Publication number 20240326195
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-I Chen
- B24 - GRINDING POLISHING
Information Patent Application
PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS
- Publication number 20240321661
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Common source transistor apparatus
- Publication number 20240282769
- Publication date Aug 22, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- HUI-MIN HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
- Publication number 20240258259
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20240217054
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yu Wang
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR PROCESS FOR SOLVING CONTACT PIPING DEFECT
- Publication number 20240196605
- Publication date Jun 13, 2024
- Powerchip Semiconductor Manufacturing Corporation
- Hui-Chin Huang
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM AND METHOD
- Publication number 20240153896
- Publication date May 9, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240128148
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...
- Publication number 20240128219
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
- Publication number 20240096787
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Structure with Interconnect Structure and Meth...
- Publication number 20240087951
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240088119
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING SYSTEM AND POSITIONING METHOD BASED ON RADIO FREQUENCY...
- Publication number 20240073660
- Publication date Feb 29, 2024
- Institute for Information Industry
- YAO-SHUN YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240050995
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240038752
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Hui C. Huang

Person

Patents Grantslast 30 patents

Composition and method for polishing and integrated circuit

Bevel edge removal methods, tools, and systems

Chemical mechanical polish slurry and method of manufacture

Chemical mechanical polishing method

Slurry composition and method for polishing and integrated circuit

Semiconductor device structure with an interconnect structure in a...

Epitaxial source/drain recess formation with metal-comprising maski...

Package structure and method of forming the same

Packaging method and package structure

Electrical cleaning tool for wafer polishing tool system

Redundant system and method for providing power to devices

Self-healing polishing pad

Double-sided flexible circuit board

Package structure

Mega-sonic vibration assisted chemical mechanical planarization

Chemical mechanical planarization tool

System and method for predicting diabetic retinopathy progression

Packages including multiple encapsulated substrate blocks and overl...

Chip structure and method for forming the same

3D package structure and methods of forming same

Structure and formation method of semiconductor device with conduct...

Chemical mechanical polishing apparatus and method

Apparatus and method for forming a package structure

Lactic acid bacteria and its applications

Semiconductor package system and method

Semiconductor die including stress-resistant bonding structures and...

Tissue repair device and method for using the same

Structure and formation method of semiconductor device with conduct...

Magnetic slurry for highly efficiency CMP

Semiconductor device structure with interconnect structure and meth...

Patents Applicationslast 30 patents

TISSUE SCAFFOLD AND METHOD OF MANUFACTURING THE SAME

Use of Lactobacillus reuteri Y7 strain for prevention or treatment...

GATE HEIGHT OPTIMIZATION

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

PROCESSING TOOL AND METHOD

CHEMICAL MECHANICAL POLISH SLURRY AND METHOD OF MANUFACTURE

REDUNDANT SYSTEM AND METHOD FOR PROVIDING POWER TO DEVICES

Source/Drain Regions and Methods of Forming Same

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

SELF-HEALING POLISHING PAD

WAFER EDGE TRIMMING PROCESS AND METHODS THEREOF

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

Multi-Blade Trimming and Dressing Tool

PACKAGES WITH MULTIPLE ENCAPSULATED SUBSTRATE BLOCKS

Common source transistor apparatus

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS

METHOD FOR FORMING A PACKAGE STRUCTURE

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

SEMICONDUCTOR PROCESS FOR SOLVING CONTACT PIPING DEFECT

SEMICONDUCTOR PACKAGE SYSTEM AND METHOD

Integrated Circuit Packages and Methods of Forming the Same

SEMICONDUCTOR DIE INCLUDING STRESS-RESISTANT BONDING STRUCTURES AND...

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS

Semiconductor Device Structure with Interconnect Structure and Meth...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

POSITIONING SYSTEM AND POSITIONING METHOD BASED ON RADIO FREQUENCY...

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

PACKAGE STRUCTURE