Hui-Min Wu

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Pixel array package structure and display panel
- Patent number 11,778,845
- Issue date Oct 3, 2023
- Lextar Electronics Corporation
- Hui-Ru Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,552,222
- Issue date Jan 10, 2023
- Lextar Electronics Corporation
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pixel array package structure and display panel
- Patent number 11,367,849
- Issue date Jun 21, 2022
- Lextar Electronics Corporation
- Hui-Ru Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound and organic electronic device using the same
- Patent number 10,937,968
- Issue date Mar 2, 2021
- SHANGHAI NICHEM FINE CHEMICAL CO., LTD.
- Hui-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS structure with an etch stop layer buried within inter-dielectr...
- Patent number 10,927,000
- Issue date Feb 23, 2021
- United Microelectronics Corp.
- Li-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
RC tool accuracy time reduction
- Patent number 10,922,464
- Issue date Feb 16, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-I Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compound and organic electronic device using the same
- Patent number 10,693,077
- Issue date Jun 23, 2020
- SHANGHAI NICHEM FINE CHEMICAL CO., LTD.
- Hui-Ling Wu
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Compound and organic electronic device using the same
- Patent number 10,529,928
- Issue date Jan 7, 2020
- SHANGHAI NICHEM FINE CHEMICAL CO., LTD.
- Chi-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RC tool accuracy time reduction
- Patent number 10,515,172
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-I Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compound and organic electronic device using the same
- Patent number 10,510,962
- Issue date Dec 17, 2019
- SHANGHAI NICHEM FINE CHEMICAL CO., LTD.
- Liang-Di Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound and organic electronic device using the same
- Patent number 10,494,359
- Issue date Dec 3, 2019
- SHANGHAI NICHEM FINE CHEMICAL CO., LTD.
- Tai-Ni Lu
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Compound and organic electronic device using the same
- Patent number 10,483,468
- Issue date Nov 19, 2019
- SHANGHAI NICHEM FINE CHEMICAL CO., LTD.
- Hui-Ling Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Compound and organic electronic device using the same
- Patent number 10,476,006
- Issue date Nov 12, 2019
- SHANGHAI NICHEM FINE CHEMICAL CO., LTD.
- Liang-Di Liao
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Compound and organic electronic device using the same
- Patent number 10,396,292
- Issue date Aug 27, 2019
- SHANGHAI NICHEM FINE CHEMICAL CO., LTD.
- Hui-Ling Wu
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Light-enhancement device, and appliance having the same
- Patent number 10,386,629
- Issue date Aug 20, 2019
- Lextar Electronics Corporation
- Chih-Hao Lin
- F21 - LIGHTING
Information Patent Grant
Compound and organic electronic device using the same
- Patent number 10,312,459
- Issue date Jun 4, 2019
- NICHEM FINE TECHNOLOGY CO., LTD
- Liang-Di Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating integrated structure for MEMS device and semi...
- Patent number 9,988,264
- Issue date Jun 5, 2018
- United Microelectronics Corp.
- Bang-Chiang Lan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure of MEMS electroacoustic transducer
- Patent number 9,783,408
- Issue date Oct 10, 2017
- United Microelectronics Corp.
- Bang-Chiang Lan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming MEMS structure with an etch stop layer buried wi...
- Patent number 9,499,399
- Issue date Nov 22, 2016
- United Microelectronics Corp.
- Li-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for fabricating an integrated device
- Patent number 8,936,960
- Issue date Jan 20, 2015
- United Microelectronics Corp.
- Kuan-Yu Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated structure for MEMS device and semiconductor device and m...
- Patent number 8,872,287
- Issue date Oct 28, 2014
- United Microelectronics Corp.
- Bang-Chiang Lan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a MEMS microphone with trenches serving as ve...
- Patent number 8,865,500
- Issue date Oct 21, 2014
- United Microelectronics Corp.
- Chien-Hsin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of MEMS electroacoustic transducer and fabricating method...
- Patent number 8,798,291
- Issue date Aug 5, 2014
- United Microelectronics Corp.
- Bang-Chiang Lan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS structure and method for making the same
- Patent number 8,710,601
- Issue date Apr 29, 2014
- United Microelectronics Corp.
- Chien-Hsin Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit having microelectromechanical system device and...
- Patent number 8,642,986
- Issue date Feb 4, 2014
- United Microelectronics Corp.
- Tzung-Han Tan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit and fabricating method thereof
- Patent number 8,587,078
- Issue date Nov 19, 2013
- United Microelectronics Corp.
- Chien-Hsin Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor photodetector structure and the fabrication method th...
- Patent number 8,558,336
- Issue date Oct 15, 2013
- United Microelectronics Corp.
- Tzung-I Su
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Bond pad structure and fabricating method thereof
- Patent number 8,525,354
- Issue date Sep 3, 2013
- United Microelectronics Corporation
- Hui-Min Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS and protection structure thereof
- Patent number 8,502,382
- Issue date Aug 6, 2013
- United Microelectronics Corp.
- Bang-Chiang Lan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro projector
- Patent number D679311
- Issue date Apr 2, 2013
- Aiptek International Inc.
- Hui-Hsien Wu
- D16 - Photography and optical equipment

Patents Applicationslast 30 patents

Information Patent Application
PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL
- Publication number 20230413594
- Publication date Dec 21, 2023
- Lextar Electronics Corporation
- Hui-Ru WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE, DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230070973
- Publication date Mar 9, 2023
- Lextar Electronics Corporation
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL
- Publication number 20220271251
- Publication date Aug 25, 2022
- Lextar Electronics Corporation
- Hui-Ru WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20210367113
- Publication date Nov 25, 2021
- Lextar Electronics Corporation
- Chih-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RC Tool Accuracy Time Reduction
- Publication number 20200110913
- Publication date Apr 9, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-I Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL
- Publication number 20200067009
- Publication date Feb 27, 2020
- Lextar Electronics Corporation
- Hui-Ru WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME
- Publication number 20190341552
- Publication date Nov 7, 2019
- Shanghai Nichem Fine Chemical Co., Ltd.
- Hui-Ling WU
- C07 - ORGANIC CHEMISTRY
Information Patent Application
RC Tool Accuracy Time Reduction
- Publication number 20190121928
- Publication date Apr 25, 2019
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-I Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME
- Publication number 20190092745
- Publication date Mar 28, 2019
- NICHEM FINE TECHNOLOGY CO., LTD.
- Tai-Ni LU
- C07 - ORGANIC CHEMISTRY
Information Patent Application
COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME
- Publication number 20180277772
- Publication date Sep 27, 2018
- NICHEM FINE TECHNOLOGY CO., LTD.
- Hui-Ling Wu
- C07 - ORGANIC CHEMISTRY
Information Patent Application
COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME
- Publication number 20180159044
- Publication date Jun 7, 2018
- NICHEM FINE TECHNOLOGY CO., LTD.
- Liang-Di LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME
- Publication number 20180159045
- Publication date Jun 7, 2018
- NICHEM FINE TECHNOLOGY CO., LTD.
- Hui-Ling WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME
- Publication number 20180155312
- Publication date Jun 7, 2018
- NICHEM FINE TECHNOLOGY CO., LTD.
- Hui-Ling WU
- C07 - ORGANIC CHEMISTRY
Information Patent Application
LIGHT-ENHANCEMENT DEVICE, AND APPLIANCE HAVING THE SAME
- Publication number 20180106994
- Publication date Apr 19, 2018
- Lextar Electronics Corporation
- Chih-Hao LIN
- G02 - OPTICS
Information Patent Application
COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME
- Publication number 20180053899
- Publication date Feb 22, 2018
- NICHEM FINE TECHNOLOGY CO., LTD.
- Hui-Ling WU
- C07 - ORGANIC CHEMISTRY
Information Patent Application
COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME
- Publication number 20180047908
- Publication date Feb 15, 2018
- NICHEM FINE TECHNOLOGY CO., LTD.
- Liang-Di LIAO
- C07 - ORGANIC CHEMISTRY
Information Patent Application
COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME
- Publication number 20170279050
- Publication date Sep 28, 2017
- NICHEM FINE TECHNOLOGY CO., LTD.
- Chi-Chung CHEN
- C07 - ORGANIC CHEMISTRY
Information Patent Application
COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME
- Publication number 20170213978
- Publication date Jul 27, 2017
- Nichem Fine Technology Co., Ltd.
- Liang-Di LIAO
- C07 - ORGANIC CHEMISTRY
Information Patent Application
MEMS STRUCTURE WITH AN ETCH STOP LAYER BURIED WITHIN INTER-DIELECTR...
- Publication number 20170036905
- Publication date Feb 9, 2017
- UNITED MICROELECTRONICS CORP.
- Li-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FABRICATING AN INTEGRATED DEVICE
- Publication number 20150011035
- Publication date Jan 8, 2015
- UNITED MICROELECTRONICS CORP.
- Kuan-Yu Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING INTEGRATED STRUCTURE FOR MEMS DEVICE AND SEMI...
- Publication number 20150004732
- Publication date Jan 1, 2015
- UNITED MICROELECTRONICS CORP.
- Bang-Chiang Lan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS structure and method of forming the same
- Publication number 20140367805
- Publication date Dec 18, 2014
- Li-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE OF MEMS ELECTROACOUSTIC TRANSDUCER
- Publication number 20140291787
- Publication date Oct 2, 2014
- Bang-Chiang Lan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Mini-Projector Applied for Video Output Device
- Publication number 20130300947
- Publication date Nov 14, 2013
- AIPTEK International Inc.
- Hui Hsien Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Projection Application Device Working Through a Wireless Video Outp...
- Publication number 20130169887
- Publication date Jul 4, 2013
- AIPTEK INTERNATIONAL INC.
- Hui-Hsien WU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
BOND PAD STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20130093104
- Publication date Apr 18, 2013
- UNITED MICROELECTRONICS CORPORATION
- Hui-Min WU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS and Protection Structure Thereof
- Publication number 20120205808
- Publication date Aug 16, 2012
- Bang-Chiang Lan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE, WAFER STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120175778
- Publication date Jul 12, 2012
- Hui-Min Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer Level Package of MEMS Microphone and Manufacturing Method the...
- Publication number 20110248364
- Publication date Oct 13, 2011
- United Microelectronics Corporation
- Chien-Hsin Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Integrated Circuit and Fabricating Method thereof
- Publication number 20110241137
- Publication date Oct 6, 2011
- United Microelectronics Corporation
- Chien-Hsin HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Person

Patents Grantslast 30 patents

Pixel array package structure and display panel

Display device

Pixel array package structure and display panel

Compound and organic electronic device using the same

MEMS structure with an etch stop layer buried within inter-dielectr...

RC tool accuracy time reduction

Compound and organic electronic device using the same

Compound and organic electronic device using the same

RC tool accuracy time reduction

Compound and organic electronic device using the same

Compound and organic electronic device using the same

Compound and organic electronic device using the same

Compound and organic electronic device using the same

Compound and organic electronic device using the same

Light-enhancement device, and appliance having the same

Compound and organic electronic device using the same

Method of fabricating integrated structure for MEMS device and semi...

Structure of MEMS electroacoustic transducer

Method for forming MEMS structure with an etch stop layer buried wi...

Method for fabricating an integrated device

Integrated structure for MEMS device and semiconductor device and m...

Method of fabricating a MEMS microphone with trenches serving as ve...

Structure of MEMS electroacoustic transducer and fabricating method...

MEMS structure and method for making the same

Integrated circuit having microelectromechanical system device and...

Integrated circuit and fabricating method thereof

Semiconductor photodetector structure and the fabrication method th...

Bond pad structure and fabricating method thereof

MEMS and protection structure thereof

Micro projector

Patents Applicationslast 30 patents

PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL

PACKAGE STRUCTURE, DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL

DISPLAY DEVICE

RC Tool Accuracy Time Reduction

PIXEL ARRAY PACKAGE STRUCTURE AND DISPLAY PANEL

COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME

RC Tool Accuracy Time Reduction

COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME

COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME

COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME

COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME

COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME

LIGHT-ENHANCEMENT DEVICE, AND APPLIANCE HAVING THE SAME

COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME

COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME

COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME

COMPOUND AND ORGANIC ELECTRONIC DEVICE USING THE SAME

MEMS STRUCTURE WITH AN ETCH STOP LAYER BURIED WITHIN INTER-DIELECTR...

METHOD FOR FABRICATING AN INTEGRATED DEVICE

METHOD OF FABRICATING INTEGRATED STRUCTURE FOR MEMS DEVICE AND SEMI...

MEMS structure and method of forming the same

STRUCTURE OF MEMS ELECTROACOUSTIC TRANSDUCER

Mini-Projector Applied for Video Output Device

Projection Application Device Working Through a Wireless Video Outp...

BOND PAD STRUCTURE AND FABRICATING METHOD THEREOF

MEMS and Protection Structure Thereof

SEMICONDUCTOR DEVICE, WAFER STRUCTURE AND FABRICATION METHOD THEREOF

Wafer Level Package of MEMS Microphone and Manufacturing Method the...

Integrated Circuit and Fabricating Method thereof