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Hung-Hsin Liu

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  • Tainan City, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    THERMALLY ENHANCED ELECTRONIC PACKAGE
    • Publication number 20110304991
    • Publication date Dec 15, 2011
    • CHIPMOS TECHNOLOGIES INC.
    • TZU HSIN HUANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Tape for tape carrier package
    • Publication number 20060145314
    • Publication date Jul 6, 2006
    • ChipMOS TECHNOLOGIES INC.
    • Hung-Che Shen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Flexible substrate for package
    • Publication number 20060145315
    • Publication date Jul 6, 2006
    • ChipMOS TECHNOLOGIES INC.
    • Hung-Che Shen
    • H01 - BASIC ELECTRIC ELEMENTS