1. Field of the Invention
The present invention relates to a circuit tape for packaging, and more particularly, the invention relates to a tape for a tape carrier package.
2. Description of the Prior Art
In the field of integrated circuit chip packaging, tape carrier package (TCP) is one of the common methods. It employs a flexible tape with a device hole and a plurality leads as the chip substrate, and it is the most widely utilized as carrier packages for a semiconductor device for driving a liquid crystal display panel.
Referring to
However, as shown in
Accordingly, the present invention provides a tape for a tape carrier package that solves the problems mentioned above.
For achieving the objective and for solving the defects discussed above, the invention provides a tape for a tape carrier package.
According to a first preferred embodiment of the present invention, the tape of the tape carrier package includes a flexible insulating film. The flexible insulating film is divided into a plurality of units arranged successively, and each of the units has a device hole and a plurality of leads. The device hole has a plurality of corners formed in a form of a notch. The leads are formed on the flexible insulating film and protrude to the device hole.
A tape carrier package (TCP) structure, according to a preferred embodiment of the invention, includes a tape and a semiconductor die. The tape includes a flexible insulating film and a plurality of leads. The flexible insulating film has a device hole thereon, and the device hole has a plurality of corners formed in a form of a notch. The leads are formed on the flexible insulating film and protrude to the device hole. The semiconductor die has an active surface and a plurality of bumps, formed on the active surface; each of the bumps connects to one of the leads.
The tape of the tape carrier package of the invention improves the shape of the corners, so as to reduce the stress caused by the temperature change during the packaging process. Meanwhile, the improvement of the shape of the corners also increases the flexibility of the tape, disperses the concentration of the stress, and lowers the stress concentration factor at the corners to reduce the possibility of breaking the leads and to increase the reliability of the tape carrier package.
The advantage and spirit of the invention may be understood by the following recitations together with the appended drawings.
The invention provides a tape for a tape carrier package. According to a preferred embodiment of the invention, the tape includes a flexible insulating film. The flexible insulating film is divided into a plurality of units arranged successively, and each of the units has a device hole and a plurality of leads. The device hole has a plurality of corners formed in a form of a notch. The leads are formed on the flexible insulating film and protrude to the device hole.
Please refer to
The tape 30 is divided into a plurality of units arranged successively, and each of the units has a flexible insulating film 32 and a plurality of leads 34. The flexible insulating film 32 is made of polyimide, polyester or the like and has flexibility. The flexible insulating film 32 has a device hole 38 passing vertically through the flexible insulating film 32 of the tape 30. The device hole 38 is substantially rectangular and has four corners 31 formed in a form of a notch. A plurality of equidistant sprocket holes 33 are formed on the two sides of the flexible insulating film 32 for transportation and orientation. The leads 34 are strip-shaped and protrude to the device hole 38 for connecting with the semiconductor die 10. In the embodiment, the notch is substantially oblong. The semiconductor die 10 has an active surface and a plurality of bumps 12, formed on the active surface; each of the bumps 12 connects to one of the leads 34.
In the practical packaging process, the tape 30 has to go through packaging steps with different temperatures. First, an inner lead bonding (ILB) process is performed on the tape carrier package, in which the bumps 12 of the semiconductor die 10 are connected to the leads 34 in a high temperature machine. The temperature is then lowered to perform a potting step, and the adhesive is then cured at a high temperature. Because the device hole 38 of the tape 30 has the corners 31 in the form of the notch, contractions caused by the temperature can be lessened, and the stress concentration factor at the corners can also be reduced, so as to reduce the possibility of the breaking of the leads 34. Besides, the corners 31 in the form of the notch can also raise the flexibility of the tape.
In an embodiment, the tape carrier package structure further includes a resin coated thereon, so as to cover the leads and the bumps of the semiconductor die.
In an embodiment, the tape carrier package structure further includes a protection layer covering the portions of the leads disposed on the flexible insulating film.
Please refer to
With the example and explanations above, the features and spirits of the invention will be hopefully well described. Those skilled in the art will readily observe that numerous modifications and alterations of the device may be made while retaining the teaching of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.
Number | Date | Country | Kind |
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093141417 | Dec 2004 | TW | national |