Hung-Jung Tu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer debonding and cleaning apparatus
- Patent number 11,264,262
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer debonding and cleaning apparatus and method
- Patent number 10,381,254
- Issue date Aug 13, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using a wafer cassette to charge an electrostatic carrier
- Patent number 10,068,789
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 9,806,062
- Issue date Oct 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cassette with electrostatic carrier charging scheme
- Patent number 9,570,331
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 9,406,650
- Issue date Aug 2, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer debonding and cleaning apparatus and method of use
- Patent number 9,390,949
- Issue date Jul 12, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin wafer handling method
- Patent number 9,305,769
- Issue date Apr 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Selective curing method of adhesive on substrate
- Patent number 9,093,489
- Issue date Jul 28, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tu-Hao Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Approach for bonding dies onto interposers
- Patent number 8,759,150
- Issue date Jun 24, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust TSV structure
- Patent number 8,749,027
- Issue date Jun 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component stacking using pre-formed adhesive films
- Patent number 8,664,749
- Issue date Mar 4, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner formation in 3DIC structures
- Patent number 8,629,066
- Issue date Jan 14, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuits with protection layers
- Patent number 8,405,225
- Issue date Mar 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Approach for bonding dies onto interposers
- Patent number 8,319,349
- Issue date Nov 27, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner formation in 3DIC structures
- Patent number 8,264,066
- Issue date Sep 11, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuits with protection layers
- Patent number 8,148,826
- Issue date Apr 3, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Approach for bonding dies onto interposers
- Patent number 8,105,875
- Issue date Jan 31, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuits with protection layers
- Patent number 8,053,277
- Issue date Nov 8, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure and method for stacked wafer fabrication
- Patent number 7,955,895
- Issue date Jun 7, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ku-Feng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component stacking using pre-formed adhesive films
- Patent number 7,943,421
- Issue date May 17, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuits with protection layers
- Patent number 7,812,459
- Issue date Oct 12, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor contact structure
- Patent number 7,466,028
- Issue date Dec 16, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification of a porous organic material through the use o...
- Patent number 7,354,623
- Issue date Apr 8, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER DEBONDING AND CLEANING APPARATUS
- Publication number 20190304828
- Publication date Oct 3, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF USING A WAFER CASSETTE TO CHARGE AN ELECTROSTATIC CARRIER
- Publication number 20170103910
- Publication date Apr 13, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Packaging Semiconductor Devices and Packaged Semiconduct...
- Publication number 20160329302
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Cassette with Electrostatic Carrier Charging Scheme
- Publication number 20160035609
- Publication date Feb 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Packaging Semiconductor Devices and Packaged Semiconduct...
- Publication number 20150221611
- Publication date Aug 6, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DEBONDING AND CLEANING APPARATUS AND METHOD
- Publication number 20140374031
- Publication date Dec 25, 2014
- Wen-Chih CHIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Curing Method of Adhesive on Substrate
- Publication number 20140261997
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tu-Hao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN WAFER HANDLING METHOD
- Publication number 20140130962
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DEBONDING AND CLEANING APPARATUS AND METHOD OF USE
- Publication number 20130133688
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih CHIOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liner Formation in 3DIC Structures
- Publication number 20120289062
- Publication date Nov 15, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Approach for Bonding Dies onto Interposers
- Publication number 20120238057
- Publication date Sep 20, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuits with Protection Layers
- Publication number 20120187576
- Publication date Jul 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Approach for Bonding Dies onto Interposers
- Publication number 20120104578
- Publication date May 3, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUITS WITH PROTECTION LAYERS
- Publication number 20120032348
- Publication date Feb 9, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Stacking Using Pre-Formed Adhesive Films
- Publication number 20110186967
- Publication date Aug 4, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liner Formation in 3DIC Structures
- Publication number 20110006428
- Publication date Jan 13, 2011
- Ching-Yu Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuits with Protection Layers
- Publication number 20100330743
- Publication date Dec 30, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust TSV structure
- Publication number 20100171203
- Publication date Jul 8, 2010
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Stacking Using Pre-Formed Adhesive Films
- Publication number 20100140767
- Publication date Jun 10, 2010
- Weng-Jin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR STACKED WAFER FABRICATION
- Publication number 20100117226
- Publication date May 13, 2010
- Ku-Feng YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional integrated circuits with protection layers
- Publication number 20080142990
- Publication date Jun 19, 2008
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface modification of a porous organic material through the use o...
- Publication number 20050260402
- Publication date Nov 24, 2005
- Ching-Ya Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of integrating post-etching cleaning process with deposition...
- Publication number 20050158664
- Publication date Jul 21, 2005
- Joshua Tseng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Hung-Jung Tu

Person

Patents Grantslast 30 patents

Wafer debonding and cleaning apparatus

Wafer debonding and cleaning apparatus and method

Method of using a wafer cassette to charge an electrostatic carrier

Methods of packaging semiconductor devices and packaged semiconduct...

Wafer cassette with electrostatic carrier charging scheme

Methods of packaging semiconductor devices and packaged semiconduct...

Wafer debonding and cleaning apparatus and method of use

Thin wafer handling method

Selective curing method of adhesive on substrate

Approach for bonding dies onto interposers

Robust TSV structure

Component stacking using pre-formed adhesive films

Liner formation in 3DIC structures

Three-dimensional integrated circuits with protection layers

Approach for bonding dies onto interposers

Liner formation in 3DIC structures

Three-dimensional integrated circuits with protection layers

Approach for bonding dies onto interposers

Three-dimensional integrated circuits with protection layers

Structure and method for stacked wafer fabrication

Component stacking using pre-formed adhesive films

Three-dimensional integrated circuits with protection layers

Semiconductor contact structure

Surface modification of a porous organic material through the use o...

Patents Applicationslast 30 patents

WAFER DEBONDING AND CLEANING APPARATUS

METHOD OF USING A WAFER CASSETTE TO CHARGE AN ELECTROSTATIC CARRIER

Methods of Packaging Semiconductor Devices and Packaged Semiconduct...

Wafer Cassette with Electrostatic Carrier Charging Scheme

Methods of Packaging Semiconductor Devices and Packaged Semiconduct...

WAFER DEBONDING AND CLEANING APPARATUS AND METHOD

Selective Curing Method of Adhesive on Substrate

THIN WAFER HANDLING METHOD

WAFER DEBONDING AND CLEANING APPARATUS AND METHOD OF USE

Liner Formation in 3DIC Structures

Approach for Bonding Dies onto Interposers

Three-Dimensional Integrated Circuits with Protection Layers

Approach for Bonding Dies onto Interposers

THREE-DIMENSIONAL INTEGRATED CIRCUITS WITH PROTECTION LAYERS

Component Stacking Using Pre-Formed Adhesive Films

Liner Formation in 3DIC Structures

Three-Dimensional Integrated Circuits with Protection Layers

Robust TSV structure

Component Stacking Using Pre-Formed Adhesive Films

STRUCTURE AND METHOD FOR STACKED WAFER FABRICATION

Three-dimensional integrated circuits with protection layers

Surface modification of a porous organic material through the use o...

Method of integrating post-etching cleaning process with deposition...