Hung-Ming Chang

Person

Taichung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bluetooth communication system capable of avoiding voice interrupti...
- Patent number 12,177,638
- Issue date Dec 24, 2024
- Realtek Semiconductor Corp.
- Qing Gu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,142,485
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of forming
- Patent number 12,119,401
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interface device and signal transceiving method thereof
- Patent number 12,117,864
- Issue date Oct 15, 2024
- Global Unichip Corporation
- Bi-Yang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bluetooth communication system capable of avoiding voice interrupti...
- Patent number 12,101,614
- Issue date Sep 24, 2024
- Realtek Semiconductor Corp.
- Qing Gu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bluetooth communication system capable of avoiding voice interrupti...
- Patent number 12,096,192
- Issue date Sep 17, 2024
- Realtek Semiconductor Corp.
- Qing Gu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Resin composition
- Patent number 12,077,667
- Issue date Sep 3, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of forming a multi-layer epitaxial source/drain region havin...
- Patent number 12,068,322
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Han-Yu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-application optical sensing apparatus and method thereof
- Patent number 12,007,280
- Issue date Jun 11, 2024
- Artilux, Inc.
- Chih-Wei Yeh
- G01 - MEASURING TESTING
Information Patent Grant
Resource integration system and resource integration method
- Patent number 11,995,471
- Issue date May 28, 2024
- Acer Incorporated
- Kuan-Ju Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Post-treatment processes for ion beam etching of magnetic tunnel ju...
- Patent number 11,991,932
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hung-Yu Chang
- G11 - INFORMATION STORAGE
Information Patent Grant
Microphone front chamber structure and voice reception device
- Patent number 11,950,038
- Issue date Apr 2, 2024
- Merry Electronics(Shenzhen) Co., Ltd.
- Kuei-Yuan Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for fabricating nickel-cerium dioxide-aluminum oxide hybrid...
- Patent number 11,944,960
- Issue date Apr 2, 2024
- National Tsing Hua University
- De-Hao Tsai
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
NAND block architecture for in-memory multiply-and-accumulate opera...
- Patent number 11,934,480
- Issue date Mar 19, 2024
- Macronix International Co., Ltd.
- Hang-Ting Lue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rubber resin material with high dielectric constant
- Patent number 11,920,036
- Issue date Mar 5, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Gaming system and operation method of gaming server thereof
- Patent number 11,918,892
- Issue date Mar 5, 2024
- Acer Incorporated
- Kuan-Ju Chen
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Data storage for artificial intelligence-based applications
- Patent number 11,914,860
- Issue date Feb 27, 2024
- Macronix International Co., Ltd.
- Chun-Hung Lai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling fan and noise sensor
- Patent number 11,914,436
- Issue date Feb 27, 2024
- Hewlett-Packard Development Company, L.P.
- Hung-Wen Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional measuring device and robotic arm calibration meth...
- Patent number 11,904,464
- Issue date Feb 20, 2024
- Delta Electronics, Inc.
- Chi-Huan Shao
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Audio processing device and audio processing method
- Patent number 11,900,953
- Issue date Feb 13, 2024
- Realtek Semiconductor Corporation
- Chun-Chang Liu
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Fluoride-based resin prepreg and circuit substrate using the same
- Patent number 11,903,127
- Issue date Feb 13, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Prepreg and metallic clad laminate
- Patent number 11,890,832
- Issue date Feb 6, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Interposer routing structure and semiconductor package
- Patent number 11,869,846
- Issue date Jan 9, 2024
- Global Unichip Corporation
- Sheng-Fan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-dielectric rubber resin material and low-dielectric metal subst...
- Patent number 11,859,083
- Issue date Jan 2, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Etch profile control of interconnect structures
- Patent number 11,854,873
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu Lun Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,810,846
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ching Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-member bluetooth device capable of reducing complexity of upd...
- Patent number 11,770,784
- Issue date Sep 26, 2023
- Realtek Semiconductor Corp.
- Yi-Cheng Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Multi-member bluetooth device capable of synchronizing audio playba...
- Patent number 11,751,153
- Issue date Sep 5, 2023
- Realtek Semiconductor Corp.
- Hung-Chuan Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Biodegradable polyester
- Patent number 11,746,174
- Issue date Sep 5, 2023
- Industrial Technology Research Institute
- Shu-Jiuan Huang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and method
- Patent number 11,688,639
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE PACKAGE WITH HETEROGENEOUS DIE STRUCTURES AND METHODS OF FOR...
- Publication number 20240421111
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES
- Publication number 20240421077
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE DETECTING APPARATUS AND STRUCTURE DETECTING KIT APPLYING...
- Publication number 20240419569
- Publication date Dec 19, 2024
- Industrial Technology Research Institute
- Hung-Chih CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RESIN COMPOSITION
- Publication number 20240417557
- Publication date Dec 19, 2024
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413097
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20240413101
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF
- Publication number 20240413102
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION AND MANUFACTURING METHOD THEREOF
- Publication number 20240400734
- Publication date Dec 5, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD AND APPARATUS TO ENHANCE SEMICONDUCTOR DEVICE MANUFACTURING
- Publication number 20240387601
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Ren KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379482
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379374
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING
- Publication number 20240371996
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Tai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE FOR ETCH-BACK SILICON-ON-INSULATOR PROCESS
- Publication number 20240355902
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Chang CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging of Dies Including TSVs using Sacrificial Carrier
- Publication number 20240339370
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufactoring Co., Ltd.
- Chien-Fu Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Application Optical Sensing Apparatus and Method Thereof
- Publication number 20240280407
- Publication date Aug 22, 2024
- Artilux, Inc.
- Chih-Wei Yeh
- G01 - MEASURING TESTING
Information Patent Application
RESOURCE CONTROL METHOD, FRAME RATE CONTROL METHOD AND CONTROLLER F...
- Publication number 20240274100
- Publication date Aug 15, 2024
- MEDIATEK INC.
- Chung-Yang CHEN
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
RESIN COMPOSITION
- Publication number 20240228755
- Publication date Jul 11, 2024
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20240228779
- Publication date Jul 11, 2024
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20240228705
- Publication date Jul 11, 2024
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20240228767
- Publication date Jul 11, 2024
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240213129
- Publication date Jun 27, 2024
- Global Unichip Corporation
- Hao-Yu TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION
- Publication number 20240174779
- Publication date May 30, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MODIFIED MALEIMIDE RESIN
- Publication number 20240174810
- Publication date May 30, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20240174849
- Publication date May 30, 2024
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PORTABLE CONTROLLER WITH REPLACEABLE MODULE
- Publication number 20240179855
- Publication date May 30, 2024
- HUNG-YI CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODIFIED DICYCLOPENTADIENE-BASED RESIN
- Publication number 20240166788
- Publication date May 23, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20240166817
- Publication date May 23, 2024
- Nan Ya Plastics Corporation
- Te-Chao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20240166859
- Publication date May 23, 2024
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20240166866
- Publication date May 23, 2024
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND USE THEREOF
- Publication number 20240166844
- Publication date May 23, 2024
- Nan Ya Plastics Corporation
- TE-CHAO LIAO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Hung-Ming Chang

Person

Patents Grantslast 30 patents

Bluetooth communication system capable of avoiding voice interrupti...

Semiconductor structure and manufacturing method thereof

Semiconductor device and methods of forming

Interface device and signal transceiving method thereof

Bluetooth communication system capable of avoiding voice interrupti...

Bluetooth communication system capable of avoiding voice interrupti...

Resin composition

Method of forming a multi-layer epitaxial source/drain region havin...

Multi-application optical sensing apparatus and method thereof

Resource integration system and resource integration method

Post-treatment processes for ion beam etching of magnetic tunnel ju...

Microphone front chamber structure and voice reception device

Method for fabricating nickel-cerium dioxide-aluminum oxide hybrid...

NAND block architecture for in-memory multiply-and-accumulate opera...

Rubber resin material with high dielectric constant

Gaming system and operation method of gaming server thereof

Data storage for artificial intelligence-based applications

Cooling fan and noise sensor

Three-dimensional measuring device and robotic arm calibration meth...

Audio processing device and audio processing method

Fluoride-based resin prepreg and circuit substrate using the same

Prepreg and metallic clad laminate

Interposer routing structure and semiconductor package

Low-dielectric rubber resin material and low-dielectric metal subst...

Etch profile control of interconnect structures

Semiconductor device and method of manufacture

Multi-member bluetooth device capable of reducing complexity of upd...

Multi-member bluetooth device capable of synchronizing audio playba...

Biodegradable polyester

Semiconductor device and method

Patents Applicationslast 30 patents

DEVICE PACKAGE WITH HETEROGENEOUS DIE STRUCTURES AND METHODS OF FOR...

DIE STITCHING FOR STACKING ARCHITECTURE IN SEMICONDUCTOR PACKAGES

STRUCTURE DETECTING APPARATUS AND STRUCTURE DETECTING KIT APPLYING...

RESIN COMPOSITION

STRESS BUFFER IN INTEGRATED CIRCUIT PACKAGE AND METHOD

SEAL RINGS IN INTEGRATED CIRCUIT PACKAGE AND METHOD

FORMING SHALLOW TRENCH FOR DICING AND STRUCTURES THEREOF

RESIN COMPOSITION AND MANUFACTURING METHOD THEREOF

METHOD AND APPARATUS TO ENHANCE SEMICONDUCTOR DEVICE MANUFACTURING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHODS OF FORMING

CARRIER STRUCTURE FOR ETCH-BACK SILICON-ON-INSULATOR PROCESS

Packaging of Dies Including TSVs using Sacrificial Carrier

Multi-Application Optical Sensing Apparatus and Method Thereof

RESOURCE CONTROL METHOD, FRAME RATE CONTROL METHOD AND CONTROLLER F...

RESIN COMPOSITION

RESIN COMPOSITION

RESIN COMPOSITION

RESIN COMPOSITION

INTERPOSER DEVICE AND SEMICONDUCTOR PACKAGE STRUCTURE

RESIN COMPOSITION

MODIFIED MALEIMIDE RESIN

RESIN COMPOSITION

PORTABLE CONTROLLER WITH REPLACEABLE MODULE

MODIFIED DICYCLOPENTADIENE-BASED RESIN

RESIN COMPOSITION

RESIN COMPOSITION

RESIN COMPOSITION

RESIN COMPOSITION AND USE THEREOF