Hung-Yi Hsu

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Control method and power controller for flyback power converter
- Patent number 12,308,747
- Issue date May 20, 2025
- LEADTREND TECHNOLOGY CORPORATION
- Hsin Hung Lu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Display device
- Patent number 12,295,191
- Issue date May 6, 2025
- VISIONLABS CORPORATION
- Hung-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of flip chip package structure
- Patent number 12,266,620
- Issue date Apr 1, 2025
- Amazing Cool Technology Corp
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and manufacturing process thereof
- Patent number 12,243,890
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Ping Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material processing apparatus using quasi-traveling microwave to co...
- Patent number 12,222,160
- Issue date Feb 11, 2025
- National Tsing Hua University
- Tsun-Hsu Chang
- F26 - DRYING
Information Patent Grant
Fan-out semiconductor package and method for manufacturing the same
- Patent number 12,154,863
- Issue date Nov 26, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image processing apparatus for evaluating cardiac images and ventri...
- Patent number 12,148,161
- Issue date Nov 19, 2024
- Acer Incorporated
- Hung-Sheng Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Diode array
- Patent number 12,136,686
- Issue date Nov 5, 2024
- VISIONLABS CORPORATION
- Hung-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method (and related apparatus) for forming a resistor over a semico...
- Patent number 12,132,075
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal compression flip chip bump for high performance and fine pitch
- Patent number 12,113,038
- Issue date Oct 8, 2024
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eye state assessment method and electronic device
- Patent number 12,106,472
- Issue date Oct 1, 2024
- Acer Incorporated
- Yi-Jin Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
By-site-compensated etch back for local planarization/topography ad...
- Patent number 12,046,477
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of switching operational modes of a power converter
- Patent number 12,034,374
- Issue date Jul 9, 2024
- Leadtrend Technology Corp.
- San-Yi Li
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Lithography exposure system with debris removing mechanism
- Patent number 12,001,143
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,990,494
- Issue date May 21, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,973,037
- Issue date Apr 30, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package structure and manufacturing method thereof
- Patent number 11,955,443
- Issue date Apr 9, 2024
- Amazing Cool Technology Corp
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BSI image sensor and method of forming same
- Patent number 11,916,091
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nozzle flow stirring pipe
- Patent number 11,911,782
- Issue date Feb 27, 2024
- Asia IC Mic-Process, Inc.
- Hung-Hsin Hsu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,916,035
- Issue date Feb 27, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer integration
- Patent number 11,916,043
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction box
- Patent number 11,901,686
- Issue date Feb 13, 2024
- Hung Sheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode array
- Patent number 11,881,540
- Issue date Jan 23, 2024
- VISIONLABS CORPORATION
- Hung-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for estimating ventricular volume
- Patent number 11,844,655
- Issue date Dec 19, 2023
- Acer Incorporated
- Yi-Jin Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Breathing airflow detecting device for a nebulizing device
- Patent number 11,819,604
- Issue date Nov 21, 2023
- Pu Yuan Biotech Co., Ltd.
- Hung Kuang Hsu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Systems and methods for phase change material based thermal assessment
- Patent number 11,812,674
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device
- Patent number 11,782,215
- Issue date Oct 10, 2023
- BROWAVE CORPORATION
- Jung-Tsung Chou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated chip inductor structure
- Patent number 11,784,211
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction box
- Patent number 11,784,422
- Issue date Oct 10, 2023
- Hung Sheng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,769,763
- Issue date Sep 26, 2023
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADVANCED SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20250226339
- Publication date Jul 10, 2025
- AMAZING COOL TECHNOLOGY CORPORATION
- Hsien-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250218948
- Publication date Jul 3, 2025
- AMAZING COOL TECHNOLOGY CORPORATION
- Hsien-Tsung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE DEVICE WITH INTERCONNECTED SUBSTRATES
- Publication number 20250210593
- Publication date Jun 26, 2025
- Powertech Technology Inc.
- HUNG HSIN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE DEVICE WITH INTERCONNECTED CONDUCTIVE BUMPS
- Publication number 20250210482
- Publication date Jun 26, 2025
- Powertech Technology Inc.
- HUNG HSIN HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM RESISTORS AND METHODS OF FORMING THE SAME
- Publication number 20250203886
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING PROCESS THEREOF
- Publication number 20250160022
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Ping Pan
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20250118695
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-WEI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA ACCURACY MEASUREMENT
- Publication number 20250079242
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hsuen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER
- Publication number 20250072013
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR HYBRID SOI SUBSTRATE
- Publication number 20250063821
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR EVALUATING AUTOREGULATORY PATTERN...
- Publication number 20250049340
- Publication date Feb 13, 2025
- Han-Hwa Hu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MODIFIED POLYPHENYLENE ETHER RESIN, PREPARATION METHOD THEREOF, AND...
- Publication number 20250043075
- Publication date Feb 6, 2025
- NAN YA PLASTICS CORPORATION
- Cheng-Chung Lee
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20250040276
- Publication date Jan 30, 2025
- Powertech Technology Inc.
- Hung-Hsin HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIODE ARRAY
- Publication number 20250040299
- Publication date Jan 30, 2025
- Visionlabs Corporation
- HUNG-CHENG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20250040213
- Publication date Jan 30, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Yi-Hsiang Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING MULTI-LAYER INTERCONNECT PILLAR
- Publication number 20240413112
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240387394
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJ...
- Publication number 20240387185
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming Chyi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STILTED PAD STRUCTURE
- Publication number 20240379716
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sin-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240379543
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jen Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240379759
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICO...
- Publication number 20240371918
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Wen Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF EVALUATING RISK ASSESSMENT OF CEREB...
- Publication number 20240306924
- Publication date Sep 19, 2024
- Han-Hwa Hu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
A PHAGE-DISPLAYED SINGLE-CHAIN VARIABLE FRAGMENT LIBRARY FOR SELECT...
- Publication number 20240277865
- Publication date Aug 22, 2024
- Academia Sinica
- An-Suei YANG
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD FOR ANALYZING SIGNAL WAVEFORM, ELECTRONIC APPARATUS, AND COM...
- Publication number 20240268767
- Publication date Aug 15, 2024
- Han-Hwa Hu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MANUFACTURING METHOD OF FLIP CHIP PACKAGE STRUCTURE
- Publication number 20240203914
- Publication date Jun 20, 2024
- Amazing Cool Technology Corp
- Shiann-Tsong TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-WAFER INTEGRATION
- Publication number 20240194650
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240120325
- Publication date Apr 11, 2024
- Powertech Technology Inc.
- Pei-chun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL
- Publication number 20240088187
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih Cheng Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS
- Publication number 20240055383
- Publication date Feb 15, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS

Hung-Yi Hsu

Person

Patents Grantslast 30 patents

Control method and power controller for flyback power converter

Display device

Manufacturing method of flip chip package structure

Semiconductor device structure and manufacturing process thereof

Material processing apparatus using quasi-traveling microwave to co...

Fan-out semiconductor package and method for manufacturing the same

Image processing apparatus for evaluating cardiac images and ventri...

Diode array

Method (and related apparatus) for forming a resistor over a semico...

Thermal compression flip chip bump for high performance and fine pitch

Eye state assessment method and electronic device

By-site-compensated etch back for local planarization/topography ad...

Method of switching operational modes of a power converter

Lithography exposure system with debris removing mechanism

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Flip chip package structure and manufacturing method thereof

BSI image sensor and method of forming same

Nozzle flow stirring pipe

Package structure and manufacturing method thereof

Multi-wafer integration

Junction box

Diode array

Method for estimating ventricular volume

Breathing airflow detecting device for a nebulizing device

Systems and methods for phase change material based thermal assessment

Optical device

Integrated chip inductor structure

Junction box

Package structure and manufacturing method thereof

Patents Applicationslast 30 patents

ADVANCED SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR DEVICE

STACKED PACKAGE DEVICE WITH INTERCONNECTED SUBSTRATES

STACKED PACKAGE DEVICE WITH INTERCONNECTED CONDUCTIVE BUMPS

THIN FILM RESISTORS AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE AND MANUFACTURING PROCESS THEREOF

PACKAGE COMPONENT AND FORMING METHOD THEREOF

VIA ACCURACY MEASUREMENT

RESISTOR STRUCTURE WITH CAPPING STRUCTURE ON TFR LAYER

MANUFACTURING METHOD FOR HYBRID SOI SUBSTRATE

ELECTRONIC DEVICE AND METHOD FOR EVALUATING AUTOREGULATORY PATTERN...

MODIFIED POLYPHENYLENE ETHER RESIN, PREPARATION METHOD THEREOF, AND...

IMAGE SENSOR PACKAGE

DIODE ARRAY

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

INTEGRATED CIRCUIT DEVICE INCLUDING MULTI-LAYER INTERCONNECT PILLAR

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

BY-SITE-COMENSATED ETCH BACK FOR LOCAL PLANARIZATION/TOPOGRAPHY ADJ...

STILTED PAD STRUCTURE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

METHOD (AND RELATED APPARATUS) FOR FORMING A RESISTOR OVER A SEMICO...

ELECTRONIC DEVICE AND METHOD OF EVALUATING RISK ASSESSMENT OF CEREB...

A PHAGE-DISPLAYED SINGLE-CHAIN VARIABLE FRAGMENT LIBRARY FOR SELECT...

METHOD FOR ANALYZING SIGNAL WAVEFORM, ELECTRONIC APPARATUS, AND COM...

MANUFACTURING METHOD OF FLIP CHIP PACKAGE STRUCTURE

MULTI-WAFER INTEGRATION

STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

DEEP TRENCH ISOLATION STRUCTURE FOR HIGH RESOLUTION CIS PIXEL

BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS