HunTeak Lee

Person

Ichon City, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Selective EMI shielding using preformed mask
- Patent number 11,990,424
- Issue date May 21, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
- Patent number 11,932,933
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor manufacturing equipment and method of providing suppo...
- Patent number 11,935,777
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- HyeonChul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming semiconductor package wi...
- Patent number 11,894,314
- Issue date Feb 6, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided partial molded SIP module
- Patent number 11,887,863
- Issue date Jan 30, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming discrete antenna modules
- Patent number 11,735,539
- Issue date Aug 22, 2023
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for reducing metal burrs when sawing semiconducto...
- Patent number 11,676,911
- Issue date Jun 13, 2023
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective EMI shielding using preformed mask
- Patent number 11,664,327
- Issue date May 30, 2023
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 11,652,088
- Issue date May 16, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 11,587,882
- Issue date Feb 21, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
- Patent number 11,434,561
- Issue date Sep 6, 2022
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of forming an integrated SiP module...
- Patent number 11,367,690
- Issue date Jun 21, 2022
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protrusion e-bar for 3D SiP
- Patent number 11,342,294
- Issue date May 24, 2022
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming SIP module over film layer
- Patent number 11,309,193
- Issue date Apr 19, 2022
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for reducing metal burrs when sawing semiconducto...
- Patent number 11,244,908
- Issue date Feb 8, 2022
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 11,189,598
- Issue date Nov 30, 2021
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded laser package with electromagnetic interference shield and m...
- Patent number 10,937,741
- Issue date Mar 2, 2021
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming SIP module over film layer
- Patent number 10,804,119
- Issue date Oct 13, 2020
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,797,039
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D integrated system-i...
- Patent number 10,790,268
- Issue date Sep 29, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an integrated SIP module...
- Patent number 10,700,011
- Issue date Jun 30, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming protrusion E-bar for 3D SIP
- Patent number 10,636,756
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D integrated system-i...
- Patent number 10,636,774
- Issue date Apr 28, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded die substrate,...
- Patent number 10,468,384
- Issue date Nov 5, 2019
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,388,637
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device and method of bonding semiconductor die to sub...
- Patent number 9,721,921
- Issue date Aug 1, 2017
- STATS ChipPAC Pte. Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of individual die bonding followed...
- Patent number 9,524,958
- Issue date Dec 20, 2016
- STATS ChipPAC Pte. Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of bonding semiconductor die to sub...
- Patent number 9,287,204
- Issue date Mar 15, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing flip chip semiconductor packages using dou...
- Patent number 9,252,130
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Double-Sided Partial Molded SiP Module
- Publication number 20240153783
- Publication date May 9, 2024
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Semiconductor Package wi...
- Publication number 20240128201
- Publication date Apr 18, 2024
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTIALLY SHIEDED SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20230402400
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Discrete Antenna Modules
- Publication number 20230343732
- Publication date Oct 26, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective EMI Shielding Using Preformed Mask
- Publication number 20230275034
- Publication date Aug 31, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Reducing Metal Burrs When Sawing Semiconducto...
- Publication number 20230268289
- Publication date Aug 24, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Manufacturing Equipment and Method of Providing Suppo...
- Publication number 20230170242
- Publication date Jun 1, 2023
- STATS ChipPAC Pte Ltd.
- HyeonChul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20230154864
- Publication date May 18, 2023
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Antenna-in-Package Devices and Methods of Making
- Publication number 20230140748
- Publication date May 4, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Semiconductor Package wi...
- Publication number 20230081706
- Publication date Mar 16, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-Sided Partial Molded SIP Module
- Publication number 20230074430
- Publication date Mar 9, 2023
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...
- Publication number 20220364222
- Publication date Nov 17, 2022
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Manufacturing Device and Method of Enhancing Mold Gat...
- Publication number 20220250296
- Publication date Aug 11, 2022
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective EMI Shielding Using Preformed Mask
- Publication number 20220157739
- Publication date May 19, 2022
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Discrete Antenna Modules
- Publication number 20220148983
- Publication date May 12, 2022
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Reducing Metal Burrs When Sawing Semiconducto...
- Publication number 20220115332
- Publication date Apr 14, 2022
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Die Substrate,...
- Publication number 20220052025
- Publication date Feb 17, 2022
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...
- Publication number 20210301390
- Publication date Sep 30, 2021
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20210151386
- Publication date May 20, 2021
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming SIP Module Over Film Layer
- Publication number 20200402817
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-i...
- Publication number 20200373289
- Publication date Nov 26, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Integrated SIP Module...
- Publication number 20200286835
- Publication date Sep 10, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
- Publication number 20200219835
- Publication date Jul 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Integrated System-i...
- Publication number 20200219859
- Publication date Jul 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20200161252
- Publication date May 21, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Reducing Metal Burrs When Sawing Semiconducto...
- Publication number 20200144198
- Publication date May 7, 2020
- STATS ChipPAC Pte Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP
- Publication number 20200013738
- Publication date Jan 9, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Die Substrate,...
- Publication number 20200006295
- Publication date Jan 2, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Die Substrate,...
- Publication number 20190088621
- Publication date Mar 21, 2019
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Integrated System-i...
- Publication number 20190074267
- Publication date Mar 7, 2019
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS

HunTeak Lee

Person

Patents Grantslast 30 patents

Selective EMI shielding using preformed mask

Cooling device and process for cooling double-sided SiP devices dur...

Semiconductor manufacturing equipment and method of providing suppo...

Semiconductor device and method of forming semiconductor package wi...

Double-sided partial molded SIP module

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor device and method of forming discrete antenna modules

Method and device for reducing metal burrs when sawing semiconducto...

Selective EMI shielding using preformed mask

Semiconductor device and method of forming embedded die substrate,...

Molded laser package with electromagnetic interference shield and m...

Cooling device and process for cooling double-sided SiP devices dur...

Semiconductor device and method of forming an integrated SiP module...

Semiconductor device and method of forming protrusion e-bar for 3D SiP

Semiconductor device and method of forming SIP module over film layer

Method and device for reducing metal burrs when sawing semiconducto...

Semiconductor device and method of forming embedded die substrate,...

Molded laser package with electromagnetic interference shield and m...

Method of forming SIP module over film layer

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor device and method of forming a 3D integrated system-i...

Semiconductor device and method of forming an integrated SIP module...

Semiconductor device and method of forming protrusion E-bar for 3D SIP

Semiconductor device and method of forming a 3D integrated system-i...

Semiconductor device and method of forming embedded die substrate,...

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor device and method of bonding semiconductor die to sub...

Semiconductor device and method of individual die bonding followed...

Semiconductor device and method of bonding semiconductor die to sub...

Methods of manufacturing flip chip semiconductor packages using dou...

Patents Applicationslast 30 patents

Double-Sided Partial Molded SiP Module

Semiconductor Device and Method of Forming Semiconductor Package wi...

PARTIALLY SHIEDED SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

Semiconductor Device and Method of Forming Discrete Antenna Modules

Selective EMI Shielding Using Preformed Mask

Method and Device for Reducing Metal Burrs When Sawing Semiconducto...

Semiconductor Manufacturing Equipment and Method of Providing Suppo...

Molded Laser Package with Electromagnetic Interference Shield and M...

Antenna-in-Package Devices and Methods of Making

Semiconductor Device and Method of Forming Semiconductor Package wi...

Double-Sided Partial Molded SIP Module

Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...

Semiconductor Manufacturing Device and Method of Enhancing Mold Gat...

Selective EMI Shielding Using Preformed Mask

Semiconductor Device and Method of Forming Discrete Antenna Modules

Method and Device for Reducing Metal Burrs When Sawing Semiconducto...

Semiconductor Device and Method of Forming Embedded Die Substrate,...

Cooling Device and Process for Cooling Double-Sided SiP Devices Dur...

Molded Laser Package with Electromagnetic Interference Shield and M...

Semiconductor Device and Method of Forming SIP Module Over Film Layer

Semiconductor Device and Method of Forming a 3D Interposer System-i...

Semiconductor Device and Method of Forming an Integrated SIP Module...

Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP

Semiconductor Device and Method of Forming a 3D Integrated System-i...

Molded Laser Package with Electromagnetic Interference Shield and M...

Method and Device for Reducing Metal Burrs When Sawing Semiconducto...

Semiconductor Device and Method of Forming Protrusion E-Bar for 3D SIP

Semiconductor Device and Method of Forming Embedded Die Substrate,...

Semiconductor Device and Method of Forming Embedded Die Substrate,...

Semiconductor Device and Method of Forming a 3D Integrated System-i...