Hwan-Sik Lim

Person

Gunpo-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Bump structures having an extension
- Patent number 9,312,213
- Issue date Apr 12, 2016
- Samsung Electronics Co., Ltd.
- Moon Gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package and method of manufacturing the same
- Patent number 8,928,150
- Issue date Jan 6, 2015
- Samsung Electronics Co., Ltd.
- Moon-Gi Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 8,823,172
- Issue date Sep 2, 2014
- Samsung Electronics Co., Ltd.
- Hwan-Sik Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates, semiconductor packages having the same, and met...
- Patent number 8,759,221
- Issue date Jun 24, 2014
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 8,680,685
- Issue date Mar 25, 2014
- Samsung Electronics Co., Ltd.
- Hwan-Sik Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip, and semiconductor package and system each inclu...
- Patent number 8,519,470
- Issue date Aug 27, 2013
- Samsung Electronics Co., Ltd.
- Sun-won Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates and semiconductor packages having the same
- Patent number 8,497,569
- Issue date Jul 30, 2013
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230013061
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- Hyunchul LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140151877
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- HWAN-SIK LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURES, ELECTRICAL CONNECTION STRUCTURES, AND METHODS OF F...
- Publication number 20140084457
- Publication date Mar 27, 2014
- Moon Gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140015145
- Publication date Jan 16, 2014
- Samsung Electronics Co., Ltd.
- Moon-Gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE SAME, AND MET...
- Publication number 20130288431
- Publication date Oct 31, 2013
- Samsung Electronics Co., Ltd.
- Jin-Woo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130256876
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- Ui-hyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONNECTION BUMP OF SEMICONDUCTOR DEVICE
- Publication number 20130082090
- Publication date Apr 4, 2013
- Samsung Electronics Co., Ltd.
- Moon-gi CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME
- Publication number 20130009286
- Publication date Jan 10, 2013
- Samsung Electronics Co., Ltd.
- Young-lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PA...
- Publication number 20120129333
- Publication date May 24, 2012
- Samsung Electronics Co., Ltd.
- Ha-Young YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...
- Publication number 20110283034
- Publication date Nov 17, 2011
- Samsung Electronics Co., Ltd.
- Sun-won KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE SAME, AND MET...
- Publication number 20110215444
- Publication date Sep 8, 2011
- Samsung Electronics Co., Ltd.
- Jin-Woo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110095418
- Publication date Apr 28, 2011
- HWAN-SIK LIM
- H01 - BASIC ELECTRIC ELEMENTS

Hwan-Sik Lim

Person

Patents Grantslast 30 patents

Bump structures having an extension

Multi-chip package and method of manufacturing the same

Semiconductor package and method for fabricating the same

Package substrates, semiconductor packages having the same, and met...

Semiconductor package and method for fabricating the same

Semiconductor chip, and semiconductor package and system each inclu...

Package substrates and semiconductor packages having the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

BUMP STRUCTURES, ELECTRICAL CONNECTION STRUCTURES, AND METHODS OF F...

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE SAME, AND MET...

SEMICONDUCTOR PACKAGE

METHODS OF FORMING CONNECTION BUMP OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PA...

SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE AND SYSTEM EACH INCLU...

PACKAGE SUBSTRATES, SEMICONDUCTOR PACKAGES HAVING THE SAME, AND MET...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME