Hyeong Ryeol Hur

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
System for semiconductor package with stacked dies
- Patent number 6,833,287
- Issue date Dec 21, 2004
- ST Assembly Test Services Inc.
- Hyeong Ryeol Hur
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Under bump metallurgy in integrated circuits
- Publication number 20060160267
- Publication date Jul 20, 2006
- STATS ChipPAC Ltd.
- Hyeong Ryeol Hur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package with keep-out zone overlapping undercut...
- Publication number 20050194698
- Publication date Sep 8, 2005
- ST ASSEMBLY TEST SERVICE LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR SEMICONDUCTOR PACKAGE WITH STACKED DIES
- Publication number 20040251526
- Publication date Dec 16, 2004
- ST ASSEMBLY TEST SERVICES LTD.
- Hyeong Ryeol Hur
- H01 - BASIC ELECTRIC ELEMENTS