Hyo-Dong Ban

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Memory devices and methods of manufacturing the same
- Patent number 11,574,912
- Issue date Feb 7, 2023
- Samsung Electronics Co., Ltd.
- Augustin Jinwoo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing devices including a buried gate cell and a...
- Patent number 10,886,277
- Issue date Jan 5, 2021
- Samsung Electronics Co., Ltd.
- Augustin Jinwoo Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip having anti-moisture-absorption film at edg...
- Patent number RE46549
- Issue date Sep 12, 2017
- Conversant Intellectual Property Management Inc.
- Eun-Young Minn
Information Patent Grant
Semiconductor devices including guard ring structures
- Patent number 8,928,073
- Issue date Jan 6, 2015
- Samsung Electronics Co., Ltd.
- Se-myeong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer chip, method of manufacturing the interposer chip, and m...
- Patent number 7,667,331
- Issue date Feb 23, 2010
- Samsung Electronics Co., Ltd.
- Jong-Seok Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices having dual capping layer patterns and method...
- Patent number 7,339,223
- Issue date Mar 4, 2008
- Samsung Electronics Co., Ltd.
- Hoo-Ouk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having dual capping layer patterns and method...
- Patent number 7,081,389
- Issue date Jul 25, 2006
- Samsung Electronics Co., Ltd.
- Ho-Ouk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse area structure including protection film on sidewall of fuse o...
- Patent number 6,835,998
- Issue date Dec 28, 2004
- Samsung Electronics Co., Ltd.
- Chi-hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip having anti-moisture-absorption film at edg...
- Patent number 6,696,353
- Issue date Feb 24, 2004
- Samsung Electronics Co., Ltd.
- Eun-young Minn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buried contact structure in semiconductor device and method of maki...
- Patent number 6,589,837
- Issue date Jul 8, 2003
- Samsung Electronics Co., Ltd.
- Hyo-Dong Ban
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip having anti-moisture-absorption film at edg...
- Patent number 6,566,735
- Issue date May 20, 2003
- Samsung Electronics Co., Ltd.
- Eun-young Minn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact forming method for semiconductor device
- Patent number 6,555,450
- Issue date Apr 29, 2003
- Samsung Electronics Co., Ltd.
- Young-Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming fuse area structure including protection film on...
- Patent number 6,448,113
- Issue date Sep 10, 2002
- Samsung Electronics Co., Ltd.
- Chi-hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit memory devices having self-aligned contact
- Patent number 6,316,803
- Issue date Nov 13, 2001
- Samsung Electronics Co., Ltd.
- Hyo-dong Ban
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having self-aligned c...
- Patent number 6,071,802
- Issue date Jun 6, 2000
- Samsung Electronics Co., Ltd.
- Hyo-dong Ban
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING DEVICES INCLUDING A BURIED GATE CELL AND A...
- Publication number 20210091086
- Publication date Mar 25, 2021
- Samsung Electronics Co., Ltd.
- Augustin Jinwoo HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20190139963
- Publication date May 9, 2019
- Samsung Electronics Co., Ltd.
- Augustin Jinwoo HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices Including Guard Ring Structures
- Publication number 20130248997
- Publication date Sep 26, 2013
- Samsung Electronics Co., Ltd.
- Se-myeong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interposer chip, method of manufacturing the interposer chip, and m...
- Publication number 20090014895
- Publication date Jan 15, 2009
- SAMSUNG ELECTRONICS CO,. LTD.
- Jong-Seok Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES HAVING DUAL CAPPING LAYER PATTERNS AND METHOD...
- Publication number 20060231903
- Publication date Oct 19, 2006
- Samsung Electronics Co., Ltd.
- Hoo-Ouk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices having dual capping layer patterns and method...
- Publication number 20040183101
- Publication date Sep 23, 2004
- Ho-Ouk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit chip having anti-moisture-absorption film at edg...
- Publication number 20030181045
- Publication date Sep 25, 2003
- Eun-Young Minn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fuse area structure including protection film on sidewall of fuse o...
- Publication number 20020179998
- Publication date Dec 5, 2002
- Chi-Hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact forming method for semiconductor device
- Publication number 20020068423
- Publication date Jun 6, 2002
- Young-Hoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fuse area structure including protection film on sidewall of fuse o...
- Publication number 20010005604
- Publication date Jun 28, 2001
- SAMSUNG ELECTRONICS CO., LTD.
- Chi-hoon Lee
- H01 - BASIC ELECTRIC ELEMENTS

Hyo-Dong Ban

Person

Patents Grantslast 30 patents

Memory devices and methods of manufacturing the same

Methods of manufacturing devices including a buried gate cell and a...

Integrated circuit chip having anti-moisture-absorption film at edg...

Semiconductor devices including guard ring structures

Interposer chip, method of manufacturing the interposer chip, and m...

Semiconductor devices having dual capping layer patterns and method...

Semiconductor devices having dual capping layer patterns and method...

Fuse area structure including protection film on sidewall of fuse o...

Integrated circuit chip having anti-moisture-absorption film at edg...

Buried contact structure in semiconductor device and method of maki...

Integrated circuit chip having anti-moisture-absorption film at edg...

Contact forming method for semiconductor device

Method of forming fuse area structure including protection film on...

Integrated circuit memory devices having self-aligned contact

Method for manufacturing semiconductor device having self-aligned c...

Patents Applicationslast 30 patents

METHODS OF MANUFACTURING DEVICES INCLUDING A BURIED GATE CELL AND A...

MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME

Semiconductor Devices Including Guard Ring Structures

Interposer chip, method of manufacturing the interposer chip, and m...

SEMICONDUCTOR DEVICES HAVING DUAL CAPPING LAYER PATTERNS AND METHOD...

Semiconductor devices having dual capping layer patterns and method...

Integrated circuit chip having anti-moisture-absorption film at edg...

Fuse area structure including protection film on sidewall of fuse o...

Contact forming method for semiconductor device

Fuse area structure including protection film on sidewall of fuse o...