Hyung Suk Yang

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Atlanta, GA, US

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Patents Grantslast 30 patents

Information Patent Grant
Maintaining alignment in a multi-chip module using a compressible s...
- Patent number 8,742,576
- Issue date Jun 3, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICALLY CURVED MECHANICALLY FLEXIBLE INTERCONNECTS, METHODS OF M...
- Publication number 20180294211
- Publication date Oct 11, 2018
- Georgia Tech Research Corporation
- MUHANNAD S. BAKIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAINTAINING ALIGNMENT IN A MULTI-CHIP MODULE USING A COMPRESSIBLE S...
- Publication number 20130207261
- Publication date Aug 15, 2013
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS