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Hyunggil Baek
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Suwon-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Interposer and semiconductor package including the same
Patent number
11,688,656
Issue date
Jun 27, 2023
Samsung Electronics Co., Ltd.
Junyoung Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate, method of sawing substrate, and semiconductor device
Patent number
10,916,509
Issue date
Feb 9, 2021
Samsung Electronics Co., Ltd.
Yun-Rae Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding head and method for bonding semiconductor package, and semi...
Patent number
10,872,875
Issue date
Dec 22, 2020
Samsung Electronics Co., Ltd.
Sanghoon Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate, method of sawing substrate, and semiconductor device
Patent number
10,418,335
Issue date
Sep 17, 2019
Samsung Electronics Co., Ltd.
Yun-Rae Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip packages including extra memory chips to define addition...
Patent number
8,218,346
Issue date
Jul 10, 2012
Samsung Electronics Co., Ltd.
Hyunggil Baek
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20230411259
Publication date
Dec 21, 2023
Samsung Electronics Co., Ltd.
Sunchul Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230282533
Publication date
Sep 7, 2023
Samsung Electronics Co., Ltd.
Junyoung Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS
Publication number
20230260926
Publication date
Aug 17, 2023
Samsung Electronics Co., Ltd.
Yongkwan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Publication number
20230187285
Publication date
Jun 15, 2023
Samsung Electronics Co., Ltd.
SANG-WON LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
Publication number
20230180381
Publication date
Jun 8, 2023
Samsung Electronics Co., Ltd.
Kanggyune Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED PRODUCT FOR SEMICONDUCTOR STRIP AND METHOD OF MANUFACTURING...
Publication number
20230127641
Publication date
Apr 27, 2023
Samsung Electronics Co., Ltd.
Seunghwan KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DICING BLADE INCLUDING DIAMOND PARTICLES
Publication number
20230039736
Publication date
Feb 9, 2023
Samsung Electronics Co., Ltd.
Youngja KIM
C01 - INORGANIC CHEMISTRY
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE
Publication number
20220367416
Publication date
Nov 17, 2022
Samsung Electronics Co., Ltd.
Yongkwan Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20210320042
Publication date
Oct 14, 2021
Samsung Electronics Co., Ltd.
Junyoung Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING HEAD AND METHOD FOR BONDING SEMICONDUCTOR PACKAGE, AND SEMI...
Publication number
20200027855
Publication date
Jan 23, 2020
Samsung Electronics Co., Ltd.
Sanghoon LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE, METHOD OF SAWING SUBSTRATE, AND SEMICONDUCTOR DEVICE
Publication number
20190355671
Publication date
Nov 21, 2019
Samsung Electronics Co., Ltd.
Yun-Rae CHO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE, METHOD OF SAWING SUBSTRATE, AND SEMICONDUCTOR DEVICE
Publication number
20180261555
Publication date
Sep 13, 2018
Samsung Electronics Co., Ltd.
Yun-Rae CHO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND TEMPERATURE CONTROL METHOD THEREOF
Publication number
20130166093
Publication date
Jun 27, 2013
Samsung Electronics Co., Ltd.
Jae Choon Kim
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
MULTI-CHIP PACKAGES INCLUDING EXTRA MEMORY CHIPS TO DEFINE ADDITION...
Publication number
20100238696
Publication date
Sep 23, 2010
SAMSUNG ELECTRONICS CO., LTD.
Hyunggil Baek
H01 - BASIC ELECTRIC ELEMENTS