Ian D. Melville

Person

Highland, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Photonics chips including cavities with non-right-angle internal co...
- Patent number 11,828,983
- Issue date Nov 28, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ian Melville
- G02 - OPTICS
Information Patent Grant
Multi-layered substrates of semiconductor devices
- Patent number 11,502,106
- Issue date Nov 15, 2022
- GLOBALFOUNDRIES U.S. Inc.
- Benjamin Vito Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad reliability of semiconductor devices
- Patent number 10,892,239
- Issue date Jan 12, 2021
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ionizing radiation blocking in IC chip to reduce soft errors
- Patent number 10,784,200
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-to-chip and chip-to-substrate interconnections in multi-chip s...
- Patent number 10,438,894
- Issue date Oct 8, 2019
- GLOBALFOUNDRIES Inc.
- Mukta Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split probe pad structure and method
- Patent number 10,276,461
- Issue date Apr 30, 2019
- GLOBALFOUNDRIES Inc.
- Ian D. W. Melville
- G01 - MEASURING TESTING
Information Patent Grant
Stress-resilient chip structure and dicing process
- Patent number 10,211,175
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure on two sides of substrate and method of forming
- Patent number 10,068,899
- Issue date Sep 4, 2018
- GLOBALFOUNDRIES Inc.
- Ian D. W. Melville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC structure including TSV having metal resistant to high temperatu...
- Patent number 10,049,979
- Issue date Aug 14, 2018
- GLOBALFOUNDRIES Inc.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-project wafer with IP protection by reticle mask pattern modi...
- Patent number 9,947,645
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Soon Yoeng Tan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Coaxial solder bump support structure
- Patent number 9,431,359
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IP protection
- Patent number 9,069,923
- Issue date Jun 30, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Soon Yoeng Tan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and method for making crack stop for 3D integrated circuits
- Patent number 9,059,167
- Issue date Jun 16, 2015
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ionizing radiation blocking in IC chip to reduce soft errors
- Patent number 8,999,764
- Issue date Apr 7, 2015
- International Business Machines Corporation
- Mukta G. Farooq
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device having a copper plug
- Patent number 8,922,019
- Issue date Dec 30, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for making crack stop for 3D integrated circuits
- Patent number 8,859,390
- Issue date Oct 14, 2014
- International Business Machines Corporation
- Mukta G Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer backside defectivity clean-up utilizing selective removal of...
- Patent number 8,835,289
- Issue date Sep 16, 2014
- International Business Machines Corporation
- Jennifer C. Clark
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Passivation layer surface topography modifications for improved int...
- Patent number 8,786,059
- Issue date Jul 22, 2014
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper plug
- Patent number 8,749,059
- Issue date Jun 10, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper plug
- Patent number 8,741,769
- Issue date Jun 3, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,674,506
- Issue date Mar 18, 2014
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a copper plug
- Patent number 8,610,283
- Issue date Dec 17, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial solder bump support structure
- Patent number 8,563,416
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Brian Michael Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer backside defectivity clean-up utilizing selective removal of...
- Patent number 8,486,814
- Issue date Jul 16, 2013
- International Business Machines Corporation
- Jennifer C. Clark
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Soft error rate mitigation by interconnect structure
- Patent number 8,445,374
- Issue date May 21, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to reduce maximum current density in a solde...
- Patent number 8,446,006
- Issue date May 21, 2013
- International Business Machines Corporation
- Raschid J. Bezama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer surface topography modifications for improved int...
- Patent number 8,236,615
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soft error rate mitigation by interconnect structure
- Patent number 8,120,175
- Issue date Feb 21, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for inhibiting back end of line damage from dicing and ch...
- Patent number 8,076,756
- Issue date Dec 13, 2011
- International Business Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underbump metallurgy for enhanced electromigration resistance
- Patent number 8,022,543
- Issue date Sep 20, 2011
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTONICS CHIPS INCLUDING CAVITIES WITH NON-RIGHT-ANGLE INTERNAL CO...
- Publication number 20230228940
- Publication date Jul 20, 2023
- GLOBALFOUNDRIES U.S. Inc.
- Ian Melville
- G02 - OPTICS
Information Patent Application
MULTI-LAYERED SUBSTRATES OF SEMICONDUCTOR DEVICES
- Publication number 20210249442
- Publication date Aug 12, 2021
- GLOBALFOUNDRIES U.S. Inc.
- BENJAMIN VITO FASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD RELIABILITY OF SEMICONDUCTOR DEVICES
- Publication number 20210013166
- Publication date Jan 14, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- RAMASAMY CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT PROBE PAD STRUCTURE AND METHOD
- Publication number 20190043769
- Publication date Feb 7, 2019
- GLOBALFOUNDRIES INC.
- Ian D.W. Melville
- G01 - MEASURING TESTING
Information Patent Application
IC STRUCTURE INCLUDING TSV HAVING METAL RESISTANT TO HIGH TEMPERATU...
- Publication number 20180337089
- Publication date Nov 22, 2018
- GLOBALFOUNDRIES INC.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE INCLUDING TSV HAVING METAL RESISTANT TO HIGH TEMPERATU...
- Publication number 20180108607
- Publication date Apr 19, 2018
- GLOBALFOUNDRIES INC.
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC STRUCTURE ON TWO SIDES OF SUBSTRATE AND METHOD OF FORMING
- Publication number 20180053743
- Publication date Feb 22, 2018
- GLOBALFOUNDRIES INC.
- Ian D. W. Melville
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER WITH NONSTICK SEAL REGION
- Publication number 20150303102
- Publication date Oct 22, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IP PROTECTION
- Publication number 20150294964
- Publication date Oct 15, 2015
- Soon Yoeng TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS
- Publication number 20150001714
- Publication date Jan 1, 2015
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS
- Publication number 20140339703
- Publication date Nov 20, 2014
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS
- Publication number 20140151879
- Publication date Jun 5, 2014
- Disco Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- Publication number 20140054778
- Publication date Feb 27, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL SOLDER BUMP SUPPORT STRUCTURE
- Publication number 20130320528
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BACKSIDE DEFECTIVITY CLEAN-UP UTILIZING SELECTIVE REMOVAL OF...
- Publication number 20130273743
- Publication date Oct 17, 2013
- Jennifer C. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20130234329
- Publication date Sep 12, 2013
- Intetnational Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...
- Publication number 20130161822
- Publication date Jun 27, 2013
- International Business Machines Corporation
- Stephane S. Barbeau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- Publication number 20130157458
- Publication date Jun 20, 2013
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL SOLDER BUMP SUPPORT STRUCTURE
- Publication number 20130026624
- Publication date Jan 31, 2013
- International Business Machines Corporation
- Brian Michael Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BACKSIDE DEFECTIVITY CLEAN-UP UTILIZING SLECTIVE REMOVAL OF S...
- Publication number 20130020682
- Publication date Jan 24, 2013
- International Business Machines Corporation
- Jennifer C. Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IP PROTECTION
- Publication number 20120319246
- Publication date Dec 20, 2012
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Soon Yoeng TAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...
- Publication number 20120228748
- Publication date Sep 13, 2012
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...
- Publication number 20120168956
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Stephane S. Barbeau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
- Publication number 20120168952
- Publication date Jul 5, 2012
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IONIZING RADIATION BLOCKING IN IC CHIP TO REDUCE SOFT ERRORS
- Publication number 20120161300
- Publication date Jun 28, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOFT ERROR RATE MITIGATION BY INTERCONNECT STRUCTURE
- Publication number 20120135564
- Publication date May 31, 2012
- International Business Machines Corporation
- Mukta G. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS
- Publication number 20110193197
- Publication date Aug 11, 2011
- International Business Machines Corporation
- MUKTA G. FAROOQ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...
- Publication number 20110147922
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Raschid J. BEZAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR INHIBITING BACK END OF LINE DAMAGE FROM DICING AND CH...
- Publication number 20110140245
- Publication date Jun 16, 2011
- International Business Machines Corporation
- Michael W. Lane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...
- Publication number 20110121469
- Publication date May 26, 2011
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS

Ian D. Melville

Person

Patents Grantslast 30 patents

Photonics chips including cavities with non-right-angle internal co...

Multi-layered substrates of semiconductor devices

Bond pad reliability of semiconductor devices

Ionizing radiation blocking in IC chip to reduce soft errors

Chip-to-chip and chip-to-substrate interconnections in multi-chip s...

Split probe pad structure and method

Stress-resilient chip structure and dicing process

IC structure on two sides of substrate and method of forming

IC structure including TSV having metal resistant to high temperatu...

Multi-project wafer with IP protection by reticle mask pattern modi...

Coaxial solder bump support structure

IP protection

Structure and method for making crack stop for 3D integrated circuits

Ionizing radiation blocking in IC chip to reduce soft errors

Semiconductor device having a copper plug

Structure and method for making crack stop for 3D integrated circuits

Wafer backside defectivity clean-up utilizing selective removal of...

Passivation layer surface topography modifications for improved int...

Semiconductor device having a copper plug

Semiconductor device having a copper plug

Structures and methods to reduce maximum current density in a solde...

Semiconductor device having a copper plug

Coaxial solder bump support structure

Wafer backside defectivity clean-up utilizing selective removal of...

Soft error rate mitigation by interconnect structure

Structures and methods to reduce maximum current density in a solde...

Passivation layer surface topography modifications for improved int...

Soft error rate mitigation by interconnect structure

Structure for inhibiting back end of line damage from dicing and ch...

Underbump metallurgy for enhanced electromigration resistance

Patents Applicationslast 30 patents

PHOTONICS CHIPS INCLUDING CAVITIES WITH NON-RIGHT-ANGLE INTERNAL CO...

MULTI-LAYERED SUBSTRATES OF SEMICONDUCTOR DEVICES

BOND PAD RELIABILITY OF SEMICONDUCTOR DEVICES

SPLIT PROBE PAD STRUCTURE AND METHOD

IC STRUCTURE INCLUDING TSV HAVING METAL RESISTANT TO HIGH TEMPERATU...

IC STRUCTURE INCLUDING TSV HAVING METAL RESISTANT TO HIGH TEMPERATU...

IC STRUCTURE ON TWO SIDES OF SUBSTRATE AND METHOD OF FORMING

SEMICONDUCTOR WAFER WITH NONSTICK SEAL REGION

IP PROTECTION

STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS

STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS

STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS

SEMICONDUCTOR DEVICE HAVING A COPPER PLUG

COAXIAL SOLDER BUMP SUPPORT STRUCTURE

WAFER BACKSIDE DEFECTIVITY CLEAN-UP UTILIZING SELECTIVE REMOVAL OF...

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...

SEMICONDUCTOR DEVICE HAVING A COPPER PLUG

COAXIAL SOLDER BUMP SUPPORT STRUCTURE

WAFER BACKSIDE DEFECTIVITY CLEAN-UP UTILIZING SLECTIVE REMOVAL OF S...

IP PROTECTION

PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...

CONTROLLING DENSITY OF PARTICLES WITHIN UNDERFILL SURROUNDING SOLDE...

SEMICONDUCTOR DEVICE HAVING A COPPER PLUG

IONIZING RADIATION BLOCKING IN IC CHIP TO REDUCE SOFT ERRORS

SOFT ERROR RATE MITIGATION BY INTERCONNECT STRUCTURE

STRUCTURE AND METHOD FOR MAKING CRACK STOP FOR 3D INTEGRATED CIRCUITS

STRUCTURES AND METHODS TO REDUCE MAXIMUM CURRENT DENSITY IN A SOLDE...

STRUCTURE FOR INHIBITING BACK END OF LINE DAMAGE FROM DICING AND CH...

PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...