Ibrahim B. Bekar

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Chandler, AZ, US

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Patents Applicationslast 30 patents

Information Patent Application
HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH
- Publication number 20160260679
- Publication date Sep 8, 2016
- Intel Corporation
- Kabirkumar J. Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
No flow underfill device and method
- Publication number 20070026575
- Publication date Feb 1, 2007
- Sankara J. Subramanian
- H01 - BASIC ELECTRIC ELEMENTS