Ichiharu Kondo

Person

Nagoya, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Compact pressure sensor with high corrosion resistance and high acc...
- Patent number 7,242,065
- Issue date Jul 10, 2007
- Denso Corporation
- Ichiharu Kondo
- G01 - MEASURING TESTING
Information Patent Grant
Pressure sensor
- Patent number 7,176,541
- Issue date Feb 13, 2007
- Denso Corporation
- Hiroaki Tanaka
- G01 - MEASURING TESTING
Information Patent Grant
Compact pressure sensor with high corrosion resistance and high acc...
- Patent number 7,168,326
- Issue date Jan 30, 2007
- Denso Corporation
- Inao Toyoda
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device having aluminum and metal electrodes and metho...
- Patent number 7,030,496
- Issue date Apr 18, 2006
- Denso Corporation
- Keiji Shinyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming and patterning film
- Patent number 6,548,386
- Issue date Apr 15, 2003
- Denso Corporation
- Ichiharu Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputter-deposited nickel layer
- Patent number 5,876,861
- Issue date Mar 2, 1999
- Nippondenso Company, Ltd.
- Ichiharu Kondo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device with bump structure
- Patent number 5,656,858
- Issue date Aug 12, 1997
- Nippondenso Co., Ltd.
- Ichiharu Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treated structure for solder joint
- Patent number 5,635,764
- Issue date Jun 3, 1997
- Nippondenso Co., Ltd.
- Hisayoshi Fujikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,614,291
- Issue date Mar 25, 1997
- Nippondenso Co., Ltd.
- Ichiharu Kondo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming electrodes of semiconductor device
- Patent number 5,360,765
- Issue date Nov 1, 1994
- Nippondenso Co., Ltd.
- Ichiharu Kondo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device having aluminum electrode and metallic electrode
- Publication number 20060081996
- Publication date Apr 20, 2006
- DENSO CORPORATION
- Keiji Shinyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressure sensor
- Publication number 20050269654
- Publication date Dec 8, 2005
- DENSO Corporation
- Hiroaki Tanaka
- G01 - MEASURING TESTING
Information Patent Application
Compact pressure sensor with high corrosion resistance and high acc...
- Publication number 20050210993
- Publication date Sep 29, 2005
- Inao Toyoda
- B60 - VEHICLES IN GENERAL
Information Patent Application
Compact pressure sensor with high corrosion resistance and high acc...
- Publication number 20050205950
- Publication date Sep 22, 2005
- Ichiharu Kondo
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor sensor and method of plating semiconductor devices
- Publication number 20050034526
- Publication date Feb 17, 2005
- DENSO Corporation
- Keiji Shinyama
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device having aluminum and metal electrodes and metho...
- Publication number 20050006778
- Publication date Jan 13, 2005
- DENSO Corporation
- Keiji Shinyama
- H01 - BASIC ELECTRIC ELEMENTS

Ichiharu Kondo

Person

Patents Grantslast 30 patents

Compact pressure sensor with high corrosion resistance and high acc...

Pressure sensor

Compact pressure sensor with high corrosion resistance and high acc...

Semiconductor device having aluminum and metal electrodes and metho...

Method for forming and patterning film

Sputter-deposited nickel layer

Semiconductor device with bump structure

Surface treated structure for solder joint

Semiconductor device and method of manufacturing the same

Method of forming electrodes of semiconductor device

Patents Applicationslast 30 patents

Semiconductor device having aluminum electrode and metallic electrode

Pressure sensor

Compact pressure sensor with high corrosion resistance and high acc...

Compact pressure sensor with high corrosion resistance and high acc...

Semiconductor sensor and method of plating semiconductor devices

Semiconductor device having aluminum and metal electrodes and metho...