Ichiro Katayama

Person

Tsuchiura, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of truing chamfering grindstone and chamfering device
- Patent number 7,189,149
- Issue date Mar 13, 2007
- Tokyo Seimitsu Co., Ltd.
- Ichiro Katayama
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for chamfering wafer
- Patent number 6,431,961
- Issue date Aug 13, 2002
- Tokyo Seimitsu Co., Ltd.
- Ichiro Katayama
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for chamfering wafer
- Patent number 6,267,648
- Issue date Jul 31, 2001
- Tokyo Seimitsu Co. Ltd.
- Ichiro Katayama
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer cut method with wire saw apparatus and apparatus thereof
- Patent number 6,067,976
- Issue date May 30, 2000
- Tokyo Seimitsu Co., Ltd.
- Ichiro Katayama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Chamfer grinding system for wafer
- Patent number 5,769,695
- Issue date Jun 23, 1998
- Tokyo Seimitsu Co., Ltd.
- Ichiro Katayama
- B24 - GRINDING POLISHING
Information Patent Grant
Slicing machine employing an axial force to provide rigidity to a r...
- Patent number 5,287,843
- Issue date Feb 22, 1994
- Tokyo Seimitsu Co., Ltd.
- Ichiro Katayama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slicing machine and a slicing method by the same
- Patent number 5,174,270
- Issue date Dec 29, 1992
- Tokyo Seimitsu Co., Ltd.
- Ichiro Katayama
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Slicing method by a slicing machine
- Patent number 5,074,276
- Issue date Dec 24, 1991
- Tokyo Seimitsu Co., Ltd.
- Ichiro Katayama
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
Grinding wheel, grinding apparatus and grinding method
- Publication number 20060009134
- Publication date Jan 12, 2006
- TOKYO SEIMITSU CO., LTD.
- Ichiro Katayama
- B24 - GRINDING POLISHING
Information Patent Application
Method of truing chamfering grindstone and chamfering device
- Publication number 20050112999
- Publication date May 26, 2005
- Tokyo Seimitsu Co.
- Ichiro Katayama
- B24 - GRINDING POLISHING

Ichiro Katayama

Person

Patents Grantslast 30 patents

Method of truing chamfering grindstone and chamfering device

Apparatus and method for chamfering wafer

Apparatus and method for chamfering wafer

Wafer cut method with wire saw apparatus and apparatus thereof

Chamfer grinding system for wafer

Slicing machine employing an axial force to provide rigidity to a r...

Slicing machine and a slicing method by the same

Slicing method by a slicing machine

Patents Applicationslast 30 patents

Grinding wheel, grinding apparatus and grinding method

Method of truing chamfering grindstone and chamfering device