Il Kwon Shim

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming an optical semiconductor...
- Patent number 12,302,657
- Issue date May 13, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,211,863
- Issue date Jan 28, 2025
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,166,050
- Issue date Dec 10, 2024
- UTAC HEADQUARTERS PTD. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 12,100,719
- Issue date Sep 24, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with integrated shielding
- Patent number 11,901,308
- Issue date Feb 13, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Saravuth Sirinorakul
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dams
- Patent number 11,881,494
- Issue date Jan 23, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,715,703
- Issue date Aug 1, 2023
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages for sensor chips
- Patent number 11,670,521
- Issue date Jun 6, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 11,488,933
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier to...
- Patent number 11,488,932
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,342,278
- Issue date May 24, 2022
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming MEMS package
- Patent number 11,319,207
- Issue date May 3, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 11,145,603
- Issue date Oct 12, 2021
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming double-sided fan-out waf...
- Patent number 11,127,668
- Issue date Sep 21, 2021
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
- Patent number 11,024,561
- Issue date Jun 1, 2021
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 11,024,585
- Issue date Jun 1, 2021
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 11,011,423
- Issue date May 18, 2021
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 10,804,217
- Issue date Oct 13, 2020
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,797,039
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of balancing surfaces of an embedde...
- Patent number 10,790,158
- Issue date Sep 29, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 10,777,528
- Issue date Sep 15, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming MEMS package
- Patent number 10,730,745
- Issue date Aug 4, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming a fan-out PoP device wit...
- Patent number 10,707,150
- Issue date Jul 7, 2020
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier to...
- Patent number 10,658,330
- Issue date May 19, 2020
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming double-sided fan-out waf...
- Patent number 10,453,785
- Issue date Oct 22, 2019
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,388,637
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device and method of forming electromagnetic (EM) shi...
- Patent number 10,388,612
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using substrate having base and...
- Patent number 10,242,948
- Issue date Mar 26, 2019
- STATS ChipPAC Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20250151447
- Publication date May 8, 2025
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Package w...
- Publication number 20250151421
- Publication date May 8, 2025
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTORS PACKAGES
- Publication number 20250126909
- Publication date Apr 17, 2025
- UTAC Headquarters Pte. Ltd.
- Il Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP IMAGE SENSOR SEMICONDUCTOR PACKAGE
- Publication number 20250120204
- Publication date Apr 10, 2025
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
Information Patent Application
RELIABLE OPTICAL SEMICONDUCTOR PACKAGES
- Publication number 20250089388
- Publication date Mar 13, 2025
- UTAC Headquarters Pte. Ltd.
- Roel ROBLES
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION
- Publication number 20250079261
- Publication date Mar 6, 2025
- UTAC Headquarters Pte. Ltd.
- IL Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS
- Publication number 20250038037
- Publication date Jan 30, 2025
- UTAC Headquarters Pte. Ltd.
- IL KWON SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20240421169
- Publication date Dec 19, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Optical Semiconductor...
- Publication number 20240339484
- Publication date Oct 10, 2024
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING FOR IMAGE SENSORS
- Publication number 20240186346
- Publication date Jun 6, 2024
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming RDL and Side and Back...
- Publication number 20230343668
- Publication date Oct 26, 2023
- UTAC Headquarters Pte. Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230274979
- Publication date Aug 31, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DICED WAFERS AND METHODS THEREOF
- Publication number 20230178413
- Publication date Jun 8, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd SHARIFF
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FRAME MASK FOR SINGULATING WAFERS BY PLASMA ETCHING
- Publication number 20230154795
- Publication date May 18, 2023
- UTAC Headquarters Pte. Ltd.
- Dzafir Bin Mohd Shariff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS
- Publication number 20230122384
- Publication date Apr 20, 2023
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS
- Publication number 20230098224
- Publication date Mar 30, 2023
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an Optical Semiconductor...
- Publication number 20230036239
- Publication date Feb 2, 2023
- UTAC Headquarters Pte. Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier to...
- Publication number 20230015504
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20230012958
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming an Optical Semiconductor...
- Publication number 20220384505
- Publication date Dec 1, 2022
- UTAC Headquarters Pte. Ltd.
- Emmanuel Espiritu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SEMICONDUCTOR PACKAGE WITH A LEADFRAME TO ENHANCE PACKAGE...
- Publication number 20220270942
- Publication date Aug 25, 2022
- UTAC Headquarters Pte. Ltd.
- Nataporn Charusabha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20220246541
- Publication date Aug 4, 2022
- STATS ChipPAC Pte Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH DAMS
- Publication number 20220093482
- Publication date Mar 24, 2022
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20220093664
- Publication date Mar 24, 2022
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH INTEGRATED SHIELDING
- Publication number 20220028798
- Publication date Jan 27, 2022
- UTAC Headquarters Pte. Ltd.
- Saravuth SIRINORAKUL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210399035
- Publication date Dec 23, 2021
- UTAC Headquarters Pte. Ltd.
- Jeffrey Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210366963
- Publication date Nov 25, 2021
- UTAC Headquarters Pte. Ltd.
- Il Kwon SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20210233815
- Publication date Jul 29, 2021
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20210193483
- Publication date Jun 24, 2021
- UTAC Headquarters Pte. Ltd.
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20200395312
- Publication date Dec 17, 2020
- STATS ChipPAC Pte Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS

Il Kwon Shim

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming an optical semiconductor...

Reliable semiconductor packages

Reliable semiconductor packages

Reliable semiconductor packages

Semiconductor device and method of making a wafer-level chip-scale...

Semiconductor packages with integrated shielding

Semiconductor package with dams

Semiconductor device and method of forming a 3D interposer system-i...

EMI shielding for flip chip package with exposed die backside

Reliable semiconductor packages for sensor chips

Semiconductor device and method of forming embedded wafer level chi...

Semiconductor device and method of using a standardized carrier to...

EMI shielding for flip chip package with exposed die backside

Semiconductor device and method of forming MEMS package

Integrated circuit packaging system with shielding and method of ma...

Semiconductor device and method of forming double-sided fan-out waf...

Semiconductor device and method of forming a fan-out PoP device wit...

Integrated circuit packaging system with shielding and method of ma...

Semiconductor device and method of using a standardized carrier in...

EMI shielding for flip chip package with exposed die backside

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor device and method of balancing surfaces of an embedde...

Semiconductor device and method of forming embedded wafer level chi...

Semiconductor device and method of forming MEMS package

Semiconductor device and method of forming a fan-out PoP device wit...

Semiconductor device and method of using a standardized carrier to...

Semiconductor device and method of forming double-sided fan-out waf...

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor device and method of forming electromagnetic (EM) shi...

Semiconductor device and method of using substrate having base and...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Making a Semiconductor Package w...

Semiconductor Device and Method of Making a Semiconductor Package w...

RELIABLE SEMICONDUCTORS PACKAGES

MULTI-CHIP IMAGE SENSOR SEMICONDUCTOR PACKAGE

RELIABLE OPTICAL SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES WITH THERMAL DISSIPATION

WAFER LAMINATION SYSTEMS AND METHODS THEREOF FOR SEMICONDUCTOR WAFERS

RELIABLE SEMICONDUCTOR PACKAGES

Semiconductor Device and Method of Making an Optical Semiconductor...

SEMICONDUCTOR PACKAGING FOR IMAGE SENSORS

Semiconductor Packages and Methods of Forming RDL and Side and Back...

PLASMA DICED WAFERS AND METHODS THEREOF

PLASMA DICED WAFERS AND METHODS THEREOF

FRAME MASK FOR SINGULATING WAFERS BY PLASMA ETCHING

SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS

SEMICONDUCTOR PACKAGES WITH RELIABLE COVERS

Semiconductor Device and Method of Making an Optical Semiconductor...

Semiconductor Device and Method of Using a Standardized Carrier to...

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Semiconductor Device and Method of Forming an Optical Semiconductor...

FLIP CHIP SEMICONDUCTOR PACKAGE WITH A LEADFRAME TO ENHANCE PACKAGE...

EMI Shielding for Flip Chip Package with Exposed Die Backside

SEMICONDUCTOR PACKAGE WITH DAMS

RELIABLE SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES WITH INTEGRATED SHIELDING

RELIABLE SEMICONDUCTOR PACKAGES

RELIABLE SEMICONDUCTOR PACKAGES

Semiconductor Device and Method of Using a Standardized Carrier in...

RELIABLE SEMICONDUCTOR PACKAGES

EMI Shielding for Flip Chip Package with Exposed Die Backside