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Ilseok Son
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Albany, NY, US
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last 30 patents
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Patent Application
WAFER BONDING OVERLAY MEASUREMENT SYSTEM
Publication number
20250233022
Publication date
Jul 17, 2025
TOKYO ELECTRON LIMITED
Ilseok SON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR PANEL POLISHING
Publication number
20250196283
Publication date
Jun 19, 2025
TOKYO ELECTRON LIMITED
Christopher NETZBAND
B24 - GRINDING POLISHING
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Patent Application
TORSIONAL SHEAR TESTING FOR SEMICONDUCTOR SURFACE BONDS
Publication number
20250180453
Publication date
Jun 5, 2025
TOKYO ELECTRON LIMITED
Christopher Michael Netzband
G01 - MEASURING TESTING
Information
Patent Application
METHODS FOR PROTECTING TO REUSE SILICON CARRIER WAFER BASED ON IR L...
Publication number
20250079166
Publication date
Mar 6, 2025
TOKYO ELECTRON LIMITED
Panupong JAIPAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Release Layer for IR Laser Lift-Off Process
Publication number
20250054904
Publication date
Feb 13, 2025
TOKYO ELECTRON LIMITED
Panupong JAIPAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR DEVICES
Publication number
20240243006
Publication date
Jul 18, 2024
TOKYO ELECTRON LIMITED
Scott Lefevre
H01 - BASIC ELECTRIC ELEMENTS