In P. Hong

Person

Kyungki, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a circuit board having metal bumps and a se...
- Patent number 6,245,490
- Issue date Jun 12, 2001
- Samsung Electronics Co., Ltd.
- Jin Hyun Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package of center pad type d...
- Patent number 6,207,478
- Issue date Mar 27, 2001
- Samsung Electronics Co., Ltd.
- Myung Kee Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip separation device and method
- Patent number 6,121,118
- Issue date Sep 19, 2000
- Samsung Electronics Co., Ltd.
- Ho Tae Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a circuit board having metal bumps and a se...
- Patent number 6,041,495
- Issue date Mar 28, 2000
- Samsung Electronics Co., Ltd.
- Jin Hyun Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package using improved tape mounting
- Patent number 5,684,328
- Issue date Nov 4, 1997
- SamSung Electronics Co., Ltd.
- Ho Tae Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing lead frame for semiconductor package
- Patent number 5,633,206
- Issue date May 27, 1997
- Samsung Electronics Co., Ltd.
- Sang H. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for tape-mounting a semiconductor device
- Patent number 5,432,380
- Issue date Jul 11, 1995
- Samsung Electronics Co., Ltd.
- Ho T. Jin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM AND METHOD FOR OPERATING REGION-ORIGINATING DEVELOPMENT PLAT...
- Publication number 20210027261
- Publication date Jan 28, 2021
- Incheon Metropolitan City
- Kwang Ho AN
- G06 - COMPUTING CALCULATING COUNTING

Person

Patents Grantslast 30 patents

Method of manufacturing a circuit board having metal bumps and a se...

Method for manufacturing semiconductor package of center pad type d...

Chip separation device and method

Method of manufacturing a circuit board having metal bumps and a se...

Semiconductor chip package using improved tape mounting

Process for manufacturing lead frame for semiconductor package

Apparatus for tape-mounting a semiconductor device

Patents Applicationslast 30 patents

SYSTEM AND METHOD FOR OPERATING REGION-ORIGINATING DEVELOPMENT PLAT...