Ingo Ewert

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Berlin, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method to form solder deposits on substrates
- Patent number 8,871,631
- Issue date Oct 28, 2014
- Atotech Deutschland GmbH
- Sven Lamprecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to form solder deposits on substrates
- Patent number 8,507,376
- Issue date Aug 13, 2013
- Atotech Deutschland GmbH
- Ingo Ewert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to form solder alloy deposits on substrates
- Patent number 8,497,200
- Issue date Jul 30, 2013
- Atotech Deutschland GmbH
- Kai-Jens Matejat
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Aqueous Acidic Bath for Electrolytic Deposition of Copper
- Publication number 20140138252
- Publication date May 22, 2014
- Atotech Deutschland GmbH
- Nina Dambrowsky
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES
- Publication number 20130168438
- Publication date Jul 4, 2013
- Atotech Deutschland GmbH
- Sven Lamprecht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON S...
- Publication number 20130105329
- Publication date May 2, 2013
- Atotech Deutschland GmbH
- Kai-Jens Matejat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM SOLDER ALLOY DEPOSITS ON SUBSTRATES
- Publication number 20130082091
- Publication date Apr 4, 2013
- Atotech Deutschland GmbH
- Kai-Jens Matejat
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD TO FORM SOLDER DEPOSITS ON SUBSTRATES
- Publication number 20110189848
- Publication date Aug 4, 2011
- Ingo Ewert
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR