Inki Kim

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Workpiece carrier with segmented and floating retaining elements
- Patent number 6,290,584
- Issue date Sep 18, 2001
- SpeedFam-IPEC Corporation
- Inki Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for improving die planarity and global uniform...
- Patent number 6,113,465
- Issue date Sep 5, 2000
- SpeedFam-IPEC Corporation
- Inki Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for improved semiconductor wafer polishing
- Patent number 6,102,779
- Issue date Aug 15, 2000
- Speedfam-IPEC, Inc.
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing carrier and ring extension therefor
- Patent number 6,089,961
- Issue date Jul 18, 2000
- SpeedFam-IPEC Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for improved semiconductor wafer polishing
- Patent number 5,993,293
- Issue date Nov 30, 1999
- Speedram Corporation
- Joseph V. Cesna
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece carrier with monopiece pressure plate and low gimbal point
- Patent number 5,989,104
- Issue date Nov 23, 1999
- SpeedFam-IPEC Corporation
- Inki Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for distributing a polishing agent onto a poli...
- Patent number 5,921,849
- Issue date Jul 13, 1999
- Speedfam Corporation
- Inki Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing device with improved handling of fluid polishing media
- Patent number 5,695,392
- Issue date Dec 9, 1997
- Speedfam Corporation
- Inki Kim
- B24 - GRINDING POLISHING

Person

Patents Grantslast 30 patents

Workpiece carrier with segmented and floating retaining elements

Method and apparatus for improving die planarity and global uniform...

Method and apparatus for improved semiconductor wafer polishing

Wafer polishing carrier and ring extension therefor

Method and apparatus for improved semiconductor wafer polishing

Workpiece carrier with monopiece pressure plate and low gimbal point

Method and apparatus for distributing a polishing agent onto a poli...

Polishing device with improved handling of fluid polishing media