Ionut Radu

Person

Crolles, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 12,165,900
- Issue date Dec 10, 2024
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a temperature-compensated surface acoustic wave devic...
- Patent number 12,143,093
- Issue date Nov 12, 2024
- Soitec
- Marcel Broekaart
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Heterostructure and method of fabrication
- Patent number 12,101,080
- Issue date Sep 24, 2024
- SOITEC
- Arnaud Castex
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Structures for radiofrequency applications and related methods
- Patent number 11,923,239
- Issue date Mar 5, 2024
- Soitec
- Eric Desbonnets
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 11,742,233
- Issue date Aug 29, 2023
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a temperature-compensated surface acoustic wave devic...
- Patent number 11,711,065
- Issue date Jul 25, 2023
- Soitec
- Marcel Broekaart
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Surface acoustic wave device and associated production method
- Patent number 11,652,464
- Issue date May 16, 2023
- Soitec
- Pascal Guenard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterostructure and method of fabrication
- Patent number 11,637,542
- Issue date Apr 25, 2023
- Soitec
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a monocrystalline piezoelectric layer
- Patent number 11,600,766
- Issue date Mar 7, 2023
- Soitec
- Bruno Ghyselen
- C30 - CRYSTAL GROWTH
Information Patent Grant
Heterostructure and method of fabrication
- Patent number 11,595,020
- Issue date Feb 28, 2023
- Soitec
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for radiofrequency applications and related methods
- Patent number 11,367,650
- Issue date Jun 21, 2022
- Soitec
- Eric Desbonnets
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a structure for forming a tridimensional m...
- Patent number 11,205,702
- Issue date Dec 21, 2021
- Soitec
- Christophe Figuet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for locating devices
- Patent number 11,088,016
- Issue date Aug 10, 2021
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for radiofrequency applications
- Patent number 10,943,815
- Issue date Mar 9, 2021
- Soitec
- Eric Desbonnets
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for a temperature-compensated surface acoustic wave devic...
- Patent number 10,924,081
- Issue date Feb 16, 2021
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of mechanical separation for a double layer transfer
- Patent number 10,910,250
- Issue date Feb 2, 2021
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterostructure and method of fabrication
- Patent number 10,826,459
- Issue date Nov 3, 2020
- Soitec
- Arnaud Castex
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Substrate for a temperature-compensated surface acoustic wave devic...
- Patent number 10,608,610
- Issue date Mar 31, 2020
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structures including a high re...
- Patent number 10,276,492
- Issue date Apr 30, 2019
- SOITEC
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing composite structure with metal/metal bonding
- Patent number 9,905,531
- Issue date Feb 27, 2018
- Soitec
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for stabilizing a bonding interface, located within a struc...
- Patent number 9,659,777
- Issue date May 23, 2017
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,553,014
- Issue date Jan 24, 2017
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring a layer comprising a compressive stress lay...
- Patent number 9,548,237
- Issue date Jan 17, 2017
- Soitec
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor structures including transisto...
- Patent number 9,165,945
- Issue date Oct 20, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing semiconductor devices
- Patent number 9,138,980
- Issue date Sep 22, 2015
- Soitec
- Marcel Broekaart
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods of providing thin layers of crystalline semiconductor mater...
- Patent number 9,136,134
- Issue date Sep 15, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a semiconductor structure comprising a fu...
- Patent number 9,087,767
- Issue date Jul 21, 2015
- Soitec
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,041,214
- Issue date May 26, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for forming integrated semiconductor structures
- Patent number 9,034,727
- Issue date May 19, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for curing defects in a semiconductor layer
- Patent number 8,993,461
- Issue date Mar 31, 2015
- Soitec
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PHOTONIC-ELECTRONIC INTEGRATED-CIRCUIT CHIP AND PROCESS FOR FABRICA...
- Publication number 20250004196
- Publication date Jan 2, 2025
- SOITEC
- Ionut Radu
- G02 - OPTICS
Information Patent Application
METHOD FOR TRANSFERRING A MONOCRYSTALLINE SIC LAYER ONTO A POLYCRYS...
- Publication number 20240392476
- Publication date Nov 28, 2024
- SOITEC
- Ionut Radu
- C30 - CRYSTAL GROWTH
Information Patent Application
COMPOSITE STRUCTURE COMPRISING A USEFUL MONOCRYSTALLINE SIC LAYER O...
- Publication number 20240395603
- Publication date Nov 28, 2024
- SOITEC
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROSTRUCTURE AND METHOD OF FABRICATION
- Publication number 20240396520
- Publication date Nov 28, 2024
- SOITEC
- Arnaud Castex
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
NCFET TRANSISTOR COMPRISING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE
- Publication number 20240170577
- Publication date May 23, 2024
- SOITEC
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...
- Publication number 20240030033
- Publication date Jan 25, 2024
- Gweltaz Gaudin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
- Publication number 20240021461
- Publication date Jan 18, 2024
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...
- Publication number 20230378931
- Publication date Nov 23, 2023
- SOITEC
- Marcel Broekaart
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HETEROSTRUCTURE AND METHOD OF FABRICATION
- Publication number 20230275559
- Publication date Aug 31, 2023
- SOITEC
- Arnaud Castex
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER...
- Publication number 20230260841
- Publication date Aug 17, 2023
- SOITEC
- Ionut Radu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE AND ASSOCIATED PRODUCTION METHOD
- Publication number 20230253949
- Publication date Aug 10, 2023
- SOITEC
- Pascal Guenard
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
COMPOSITE SUBSTRATES INCLUDING EPITAXIAL MONOCRYSTALLINE PIEZOELECT...
- Publication number 20230217832
- Publication date Jul 6, 2023
- SOITEC
- Bruno Ghyselen
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...
- Publication number 20230160102
- Publication date May 25, 2023
- SOITEC
- Hugo Biard
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURES FOR RADIOFREQUENCY APPLICATIONS AND RELATED METHODS
- Publication number 20220277988
- Publication date Sep 1, 2022
- SOITEC
- Eric Desbonnets
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR RADIOFREQUENCY APPLICATIONS AND RELATED METHODS
- Publication number 20210143053
- Publication date May 13, 2021
- SOITEC
- Eric Desbonnets
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...
- Publication number 20210121103
- Publication date Apr 29, 2021
- SOITEC
- Marcel Broekaart
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
- Publication number 20210118717
- Publication date Apr 22, 2021
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROSTRUCTURE AND METHOD OF FABRICATION
- Publication number 20210058058
- Publication date Feb 25, 2021
- SOITEC
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A STRUCTURE FOR FORMING A TRIDIMENSIONAL M...
- Publication number 20200295138
- Publication date Sep 17, 2020
- Christophe Figuet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROSTRUCTURE AND METHOD OF FABRICATION
- Publication number 20200280298
- Publication date Sep 3, 2020
- SOITEC
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...
- Publication number 20200228088
- Publication date Jul 16, 2020
- Soitec
- Marcel Broekaart
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR LOCATING DEVICES
- Publication number 20200161172
- Publication date May 21, 2020
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR RADIOFREQUENCY APPLICATIONS
- Publication number 20190157137
- Publication date May 23, 2019
- Soitec
- Eric Desbonnets
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...
- Publication number 20190007024
- Publication date Jan 3, 2019
- SOITEC
- Marcel Broekaart
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR MANUFACTURING A MONOCRYSTALLINE PIEZOELECTRIC LAYER, AND...
- Publication number 20190006577
- Publication date Jan 3, 2019
- SOITEC
- Bruno Ghyselen
- C30 - CRYSTAL GROWTH
Information Patent Application
COMPOSITE STRUCTURE AND ASSOCIATED PRODUCTION METHOD
- Publication number 20180316329
- Publication date Nov 1, 2018
- SOITEC
- Pascal Guenard
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SURFACE ACOUSTIC WAVE DEVICE AND ASSOCIATED PRODUCTION METHOD
- Publication number 20180309426
- Publication date Oct 25, 2018
- SOITEC
- Pascal Guenard
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HETEROSTRUCTURE AND METHOD OF FABRICATION
- Publication number 20180159498
- Publication date Jun 7, 2018
- SOITEC
- Arnaud Castex
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING A HIGH RE...
- Publication number 20170207164
- Publication date Jul 20, 2017
- SOITEC
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER
- Publication number 20160358805
- Publication date Dec 8, 2016
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method of mechanical separation for a double layer transfer

Substrate for a temperature-compensated surface acoustic wave devic...

Heterostructure and method of fabrication

Structures for radiofrequency applications and related methods

Method of mechanical separation for a double layer transfer

Substrate for a temperature-compensated surface acoustic wave devic...

Surface acoustic wave device and associated production method

Heterostructure and method of fabrication

Method for manufacturing a monocrystalline piezoelectric layer

Heterostructure and method of fabrication

Structures for radiofrequency applications and related methods

Method for manufacturing a structure for forming a tridimensional m...

Method for locating devices

Structure for radiofrequency applications

Substrate for a temperature-compensated surface acoustic wave devic...

Method of mechanical separation for a double layer transfer

Heterostructure and method of fabrication

Substrate for a temperature-compensated surface acoustic wave devic...

Method for fabricating semiconductor structures including a high re...

Method for producing composite structure with metal/metal bonding

Process for stabilizing a bonding interface, located within a struc...

Bonded processed semiconductor structures and carriers

Method for transferring a layer comprising a compressive stress lay...

Method for fabricating semiconductor structures including transisto...

Apparatus for manufacturing semiconductor devices

Methods of providing thin layers of crystalline semiconductor mater...

Process for manufacturing a semiconductor structure comprising a fu...

Bonded processed semiconductor structures and carriers

Methods and structures for forming integrated semiconductor structures

Method for curing defects in a semiconductor layer

Patents Applicationslast 30 patents

PHOTONIC-ELECTRONIC INTEGRATED-CIRCUIT CHIP AND PROCESS FOR FABRICA...

METHOD FOR TRANSFERRING A MONOCRYSTALLINE SIC LAYER ONTO A POLYCRYS...

COMPOSITE STRUCTURE COMPRISING A USEFUL MONOCRYSTALLINE SIC LAYER O...

HETEROSTRUCTURE AND METHOD OF FABRICATION

NCFET TRANSISTOR COMPRISING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE

METHOD FOR PRODUCING A SEMICONDUCTOR STRUCTURE COMPRISING AN INTERF...

METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER

SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...

HETEROSTRUCTURE AND METHOD OF FABRICATION

METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN LAYER...

SURFACE ACOUSTIC WAVE DEVICE AND ASSOCIATED PRODUCTION METHOD

COMPOSITE SUBSTRATES INCLUDING EPITAXIAL MONOCRYSTALLINE PIEZOELECT...

METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A THIN LA...

STRUCTURES FOR RADIOFREQUENCY APPLICATIONS AND RELATED METHODS

STRUCTURES FOR RADIOFREQUENCY APPLICATIONS AND RELATED METHODS

SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...

METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER

HETEROSTRUCTURE AND METHOD OF FABRICATION

METHOD FOR MANUFACTURING A STRUCTURE FOR FORMING A TRIDIMENSIONAL M...

HETEROSTRUCTURE AND METHOD OF FABRICATION

SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...

METHOD FOR LOCATING DEVICES

STRUCTURE FOR RADIOFREQUENCY APPLICATIONS

SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVIC...

METHOD FOR MANUFACTURING A MONOCRYSTALLINE PIEZOELECTRIC LAYER, AND...

COMPOSITE STRUCTURE AND ASSOCIATED PRODUCTION METHOD

SURFACE ACOUSTIC WAVE DEVICE AND ASSOCIATED PRODUCTION METHOD

HETEROSTRUCTURE AND METHOD OF FABRICATION

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURES INCLUDING A HIGH RE...

METHOD OF MECHANICAL SEPARATION FOR A DOUBLE LAYER TRANSFER