Isamu Osawa

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Aichi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electroconductive bonding material
- Patent number 9,487,846
- Issue date Nov 8, 2016
- Senju Metal Industry Co., Ltd.
- Minoru Ueshima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
AUDIO SOLDER ALLOY
- Publication number 20140186208
- Publication date Jul 3, 2014
- SENJU METAL INDUSTRY CO., LTD.
- Ippei Akagi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...