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Isoroku Ono
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of manufacturing semiconductor wafer
Patent number
8,283,252
Issue date
Oct 9, 2012
Sumitomo Mitsubishi Silicon Corporation
Toru Taniguchi
B24 - GRINDING POLISHING
Information
Patent Grant
Wafer and method of producing the same
Patent number
7,951,716
Issue date
May 31, 2011
Sumco Corporation
Etsurou Morita
B24 - GRINDING POLISHING
Information
Patent Grant
Method for manufacturing direct bonded SOI wafer and direct bonded...
Patent number
7,855,129
Issue date
Dec 21, 2010
Sumco Corporation
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for regeneration of a layer transferred wafer and regenerat...
Patent number
7,829,436
Issue date
Nov 9, 2010
Sumco Corporation
Etsurou Morita
B24 - GRINDING POLISHING
Information
Patent Grant
Method for manufacturing direct bonded SOI wafer and direct bonded...
Patent number
7,781,309
Issue date
Aug 24, 2010
Sumco Corporation
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded wafer and method of producing the same
Patent number
7,718,507
Issue date
May 18, 2010
Sumco Corporation
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing bonded wafer
Patent number
7,713,842
Issue date
May 11, 2010
Sumco Corporation
Hideki Nishihata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor wafer
Patent number
7,589,023
Issue date
Sep 15, 2009
Sumitomo Mitsubishi Silicon Corporation
Toru Taniguchi
B24 - GRINDING POLISHING
Information
Patent Grant
Method of polishing semiconductor wafers by using double-sided poli...
Patent number
7,470,169
Issue date
Dec 30, 2008
Sumitomo Mitsubishi Silicon Corporation
Toru Taniguchi
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR MANUFACTURING DIRECT BONDED SOI WAFER AND DIRECT BONDED...
Publication number
20100219500
Publication date
Sep 2, 2010
SUMCO CORPORATION
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing semiconductor wafer
Publication number
20100009605
Publication date
Jan 14, 2010
Toru Taniguchi
B24 - GRINDING POLISHING
Information
Patent Application
Method for producing bonded wafer
Publication number
20090098707
Publication date
Apr 16, 2009
SUMCO CORPORATION
Hideki Nishihata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonded wafer and method of producing the same
Publication number
20070243694
Publication date
Oct 18, 2007
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer and method of producing the same
Publication number
20070197035
Publication date
Aug 23, 2007
SUMCO CORPORATION
Etsurou Morita
B24 - GRINDING POLISHING
Information
Patent Application
Method for Manufacturing Direct Bonded SOI Wafer and Direct Bonded...
Publication number
20070148912
Publication date
Jun 28, 2007
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process for Regeneration of a Layer Transferred Wafer and Regenerat...
Publication number
20070148914
Publication date
Jun 28, 2007
Etsurou Morita
B24 - GRINDING POLISHING
Information
Patent Application
Process for Regeneration of a Layer Transferred Wafer and Regenerat...
Publication number
20070148917
Publication date
Jun 28, 2007
SUMCO CORPORATION
Etsurou Morita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of polishing semiconductor wafers by using double-sided poli...
Publication number
20030181141
Publication date
Sep 25, 2003
Toru Taniguchi
B24 - GRINDING POLISHING
Information
Patent Application
Method of manufacturing semiconductor wafer
Publication number
20030104698
Publication date
Jun 5, 2003
Toru Taniguchi
B24 - GRINDING POLISHING