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Itaru Matsuo
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Tokyo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of forming leads of a semiconductor device
Patent number
7,077,170
Issue date
Jul 18, 2006
Renesas Technology Corp.
Hidetaka Yamasaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Clamping apparatus
Patent number
6,830,446
Issue date
Dec 14, 2004
Mitsubishi Electric Engineering Company Limited
Hiroyoshi Harada
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Method of manufacturing a substrate with directionally anisotropic...
Patent number
6,479,318
Issue date
Nov 12, 2002
Mitsubishi Denki Kabushiki Kaisha
Itaru Matsuo
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Plastic molding device for a semiconductor element
Patent number
5,164,203
Issue date
Nov 17, 1992
Mitsubishi Denki Kabushiki Kaisha
Minoru Tanaka
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Plastic molding device for a semiconductor element
Patent number
4,904,173
Issue date
Feb 27, 1990
Mitsubishi Denki Kabushiki Kaisha
Minoru Tanaka
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Plastic molding device for a semiconductor element
Patent number
4,755,124
Issue date
Jul 5, 1988
Mitsubishi Denki Kabushiki Kaisha
Minoru Tanaka
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Patents Applications
last 30 patents
Information
Patent Application
Method of forming leads of a packaged semiconductor device
Publication number
20060237087
Publication date
Oct 26, 2006
Renesas Technology Corp.
Hidetaka Yamasaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Lead forming for a semiconductor device
Publication number
20050076967
Publication date
Apr 14, 2005
Renesas Technology Corp.
Hidetaka Yamasaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Resin molding apparatus
Publication number
20040022884
Publication date
Feb 5, 2004
Renesas Technology Corp.
Itaru Matsuo
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Method for manufacturing a semiconductor device and a resin sealing...
Publication number
20030180985
Publication date
Sep 25, 2003
Mitsubishi Denki Kabushiki Kaisha
Kiyoharu Katou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Clamping apparatus
Publication number
20030108636
Publication date
Jun 12, 2003
Mitsubishi Denki Kabushiki Kaisha
Hiroyoshi Harada
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Semiconductor device and apparatus for manufacturing same
Publication number
20030038363
Publication date
Feb 27, 2003
Mitsubishi Denki Kabushiki Kaisha
Itaru Matsuo
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Semiconductor device substrate and semiconductor device fabrication...
Publication number
20020064899
Publication date
May 30, 2002
Itaru Matsuo
H01 - BASIC ELECTRIC ELEMENTS