Itsuo Watanabe

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit connecting material, film-form circuit connecting material...
- Patent number 8,501,045
- Issue date Aug 6, 2013
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,273,458
- Issue date Sep 25, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,273,457
- Issue date Sep 25, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 8,252,419
- Issue date Aug 28, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connecting material, film-form circuit connecting material...
- Patent number 8,202,622
- Issue date Jun 19, 2012
- Hitachi Chemical Co., Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 8,142,605
- Issue date Mar 27, 2012
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring terminal-connecting adhesive
- Patent number 8,120,189
- Issue date Feb 21, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive, method of connecting wiring terminals and wiring structure
- Patent number 8,115,322
- Issue date Feb 14, 2012
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connecting material, film-like circuit connecting material...
- Patent number 8,043,709
- Issue date Oct 25, 2011
- Hitachi Chemical Co., Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,968,196
- Issue date Jun 28, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,967,943
- Issue date Jun 28, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for bonding circuit members, circuit board and process for...
- Patent number 7,879,445
- Issue date Feb 1, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,879,956
- Issue date Feb 1, 2011
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive film for circuit connection, and circuit connection structure
- Patent number 7,785,708
- Issue date Aug 31, 2010
- Hitachi Chemical Co., Ltd.
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring structure having a wiring-terminal-connecting adhesive compr...
- Patent number 7,777,335
- Issue date Aug 17, 2010
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive film for circuit connection, and circuit connection structure
- Patent number 7,776,438
- Issue date Aug 17, 2010
- Hitachi Chemical Co., Ltd.
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,629,050
- Issue date Dec 8, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,629,056
- Issue date Dec 8, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,618,713
- Issue date Nov 17, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic circuit including circuit-connecting material
- Patent number 7,604,868
- Issue date Oct 20, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit-connecting material and circuit terminal connected structur...
- Patent number 7,553,890
- Issue date Jun 30, 2009
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive for bonding circuit members, circuit board, and method of...
- Patent number 7,247,381
- Issue date Jul 24, 2007
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive, method of connecting wiring terminals and wiring structure
- Patent number 7,241,644
- Issue date Jul 10, 2007
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring-connecting material and wiring-connected board production pr...
- Patent number 7,141,645
- Issue date Nov 28, 2006
- Hitachi Chemical Company, Ltd.
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive agent, method of connecting wiring terminals and wiring st...
- Patent number 6,939,913
- Issue date Sep 6, 2005
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for repairing circuit connection part, and structure and met...
- Patent number 6,818,086
- Issue date Nov 16, 2004
- Hitachi Chemical Co., Ltd.
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit connecting material, and structure and method of connecting...
- Patent number 6,777,464
- Issue date Aug 17, 2004
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Wiring-connecting material and process for producing circuit board...
- Patent number 6,762,249
- Issue date Jul 13, 2004
- Hitachi Chemical Company, Ltd.
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for the fabrication of wiring board for electrical tests
- Patent number 6,568,073
- Issue date May 27, 2003
- Hitachi Chemical Company, Ltd.
- Naoki Fukutomi
- G01 - MEASURING TESTING
Information Patent Grant
Connection sheet and electrode connection structure for electricall...
- Patent number 6,338,195
- Issue date Jan 15, 2002
- Hitachi Chemical Company, Ltd.
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247867
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20110247870
- Publication date Oct 13, 2011
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247874
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20110247873
- Publication date Oct 13, 2011
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20110247757
- Publication date Oct 13, 2011
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20110114893
- Publication date May 19, 2011
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE
- Publication number 20100330364
- Publication date Dec 30, 2010
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE
- Publication number 20100326596
- Publication date Dec 30, 2010
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PR...
- Publication number 20100265685
- Publication date Oct 21, 2010
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuit connection material, film-shaped circuit connection materia...
- Publication number 20100025089
- Publication date Feb 4, 2010
- Jun Taketatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20090321116
- Publication date Dec 31, 2009
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...
- Publication number 20090314533
- Publication date Dec 24, 2009
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE
- Publication number 20090101279
- Publication date Apr 23, 2009
- Motohiro Arifuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive film for circuit connection, and circuit connection structure
- Publication number 20080064849
- Publication date Mar 13, 2008
- HITACHI CHEMICAL CO., Ltd.
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20080064233
- Publication date Mar 13, 2008
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20080054225
- Publication date Mar 6, 2008
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20080057742
- Publication date Mar 6, 2008
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...
- Publication number 20070299172
- Publication date Dec 27, 2007
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive for bonding circuit members, circuit board and process for...
- Publication number 20070137887
- Publication date Jun 21, 2007
- Itsuo Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring-connecting material and wiring-connected board production pr...
- Publication number 20060252843
- Publication date Nov 9, 2006
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuit connecting material, film-like circuit connecting material...
- Publication number 20060100314
- Publication date May 11, 2006
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic circuit including circuit-connecting material
- Publication number 20060060969
- Publication date Mar 23, 2006
- Hitachi Chemical Co., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuit-connecting material and circuit terminal connected structur...
- Publication number 20060063366
- Publication date Mar 23, 2006
- HITACHI CHEMICAL CO., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuit-connecting material and circuit terminal connected structur...
- Publication number 20060014860
- Publication date Jan 19, 2006
- Hitachi Chemical Co., Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive, method of connecting wiring terminals and wiring structure
- Publication number 20050178502
- Publication date Aug 18, 2005
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive, method of connecting wiring terminals and wiring structure
- Publication number 20050176882
- Publication date Aug 11, 2005
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive film for circuit connection, and circuit connection structure
- Publication number 20050151271
- Publication date Jul 14, 2005
- Takashi Tatsuzawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit-connecting material and circuit terminal connected structur...
- Publication number 20040222408
- Publication date Nov 11, 2004
- Hitachi Chemical Company, Ltd.
- Itsuo Watanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Wiring-connecting material and wiring-connected board production pr...
- Publication number 20040214979
- Publication date Oct 28, 2004
- Tohru Fujinawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for repairing circuit connection part, and structure and met...
- Publication number 20030101580
- Publication date Jun 5, 2003
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Itsuo Watanabe

Person

Patents Grantslast 30 patents

Circuit connecting material, film-form circuit connecting material...

Adhesive for bonding circuit members, circuit board and process for...

Adhesive for bonding circuit members, circuit board and process for...

Adhesive for bonding circuit members, circuit board and process for...

Circuit connecting material, film-form circuit connecting material...

Circuit-connecting material and circuit terminal connected structur...

Wiring terminal-connecting adhesive

Adhesive, method of connecting wiring terminals and wiring structure

Circuit connecting material, film-like circuit connecting material...

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Adhesive for bonding circuit members, circuit board and process for...

Circuit-connecting material and circuit terminal connected structur...

Adhesive film for circuit connection, and circuit connection structure

Wiring structure having a wiring-terminal-connecting adhesive compr...

Adhesive film for circuit connection, and circuit connection structure

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Electronic circuit including circuit-connecting material

Circuit-connecting material and circuit terminal connected structur...

Adhesive for bonding circuit members, circuit board, and method of...

Adhesive, method of connecting wiring terminals and wiring structure

Wiring-connecting material and wiring-connected board production pr...

Adhesive agent, method of connecting wiring terminals and wiring st...

Method for repairing circuit connection part, and structure and met...

Circuit connecting material, and structure and method of connecting...

Wiring-connecting material and process for producing circuit board...

Process for the fabrication of wiring board for electrical tests

Connection sheet and electrode connection structure for electricall...

Patents Applicationslast 30 patents

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE

ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE

WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PR...

Circuit connection material, film-shaped circuit connection materia...

CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR...

ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE

Adhesive film for circuit connection, and circuit connection structure

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTUR...

Adhesive for bonding circuit members, circuit board and process for...

Wiring-connecting material and wiring-connected board production pr...

Circuit connecting material, film-like circuit connecting material...

Electronic circuit including circuit-connecting material

Circuit-connecting material and circuit terminal connected structur...

Circuit-connecting material and circuit terminal connected structur...

Adhesive, method of connecting wiring terminals and wiring structure

Adhesive, method of connecting wiring terminals and wiring structure

Adhesive film for circuit connection, and circuit connection structure

Circuit-connecting material and circuit terminal connected structur...

Wiring-connecting material and wiring-connected board production pr...

Method for repairing circuit connection part, and structure and met...