J. Robert Reid

Person

Billerica, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated chip scale packages
- Patent number 10,553,511
- Issue date Feb 4, 2020
- Cubic Corporation
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for interconnects and associated alignment a...
- Patent number 10,361,471
- Issue date Jul 23, 2019
- NUVOTRONICS, INC.
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip scale packages
- Patent number 10,319,654
- Issue date Jun 11, 2019
- Cubic Corporation
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-free interconnected electronic mechanical structural systems
- Patent number 10,257,951
- Issue date Apr 9, 2019
- NUVOTRONICS, INC.
- Ian Hovey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for interconnects and associated alignment a...
- Patent number 10,193,203
- Issue date Jan 29, 2019
- NUVOTRONICS, INC.
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-free interconnected electronic mechanical structural systems
- Patent number 9,888,600
- Issue date Feb 6, 2018
- NUVOTRONICS, INC.
- Ian Hovey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked, switched filter banks
- Patent number 9,660,614
- Issue date May 23, 2017
- NUVOTRONICS, INC.
- J. Robert Reid
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Microstructure including microstructural waveguide elements and/or...
- Patent number 9,306,255
- Issue date Apr 5, 2016
- NUVOTRONICS, INC.
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate-free mechanical interconnection of electronic sub-systems...
- Patent number 9,306,254
- Issue date Apr 5, 2016
- NUVOTRONICS, INC.
- Ian Hovey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS
- Publication number 20200022277
- Publication date Jan 16, 2020
- Nuvotronics, INC
- Ian Hovey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT A...
- Publication number 20190393580
- Publication date Dec 26, 2019
- Nuvotronics, INC
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP SCALE PACKAGES
- Publication number 20190287869
- Publication date Sep 19, 2019
- Cubic Corporation
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CHIP SCALE PACKAGES
- Publication number 20190172764
- Publication date Jun 6, 2019
- Nuvotronics, INC
- J. Robert Reid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS
- Publication number 20180153055
- Publication date May 31, 2018
- Nuvotronics, INC
- Ian Hovey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT A...
- Publication number 20180123217
- Publication date May 3, 2018
- Nuvotronics, INC
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED, SWITCHED FILTER BANKS
- Publication number 20170033773
- Publication date Feb 2, 2017
- Nuvotronics, INC
- J. Robert Reid
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT A...
- Publication number 20160294035
- Publication date Oct 6, 2016
- Nuvotronics, INC
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS
- Publication number 20160198584
- Publication date Jul 7, 2016
- Nuvotronics, INC
- Ian Hovey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

J. Robert Reid

Person

Patents Grantslast 30 patents

Integrated chip scale packages

Structures and methods for interconnects and associated alignment a...

Integrated chip scale packages

Substrate-free interconnected electronic mechanical structural systems

Structures and methods for interconnects and associated alignment a...

Substrate-free interconnected electronic mechanical structural systems

Stacked, switched filter banks

Microstructure including microstructural waveguide elements and/or...

Substrate-free mechanical interconnection of electronic sub-systems...

Patents Applicationslast 30 patents

SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS

STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT A...

INTEGRATED CHIP SCALE PACKAGES

INTEGRATED CHIP SCALE PACKAGES

SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS

STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT A...

STACKED, SWITCHED FILTER BANKS

STRUCTURES AND METHODS FOR INTERCONNECTS AND ASSOCIATED ALIGNMENT A...

SUBSTRATE-FREE INTERCONNECTED ELECTRONIC MECHANICAL STRUCTURAL SYSTEMS