Jack Monjay Yao

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San Diego, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Statistical integrated circuit package modeling for analysis at the...
- Patent number 8,225,258
- Issue date Jul 17, 2012
- QUALCOMM Incorporated
- Xiaoming Chen
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Statistical Integrated Circuit Package Modeling For Analysis At The...
- Publication number 20100318955
- Publication date Dec 16, 2010
- QUALCOMM Incorporated
- Xiaoming Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Floating Metal Elements in a Package Substrate
- Publication number 20100270061
- Publication date Oct 28, 2010
- QUALCOMM Incorporated
- Jack M. Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Floating Metal Elements in a Package Substrate
- Publication number 20100263914
- Publication date Oct 21, 2010
- QUALCOMM Incorporated
- Jack M. Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR