Jacob R. Mauermann

Person

Marion, IA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit (IC) package with cantilever multi-chip module (...
- Patent number 11,948,855
- Issue date Apr 2, 2024
- Rockwell Collins, Inc.
- Bret W. Simon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer including integrated circuit die mechanically i...
- Patent number 11,605,570
- Issue date Mar 14, 2023
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted wafer including mold material with recessed conductiv...
- Patent number 11,515,225
- Issue date Nov 29, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled warping of shadow mask tooling for improved reliability...
- Patent number 11,326,246
- Issue date May 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Controlled induced warping of electronic substrates via electroplating
- Patent number 11,236,436
- Issue date Feb 1, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled induced warping of electronic substrates
- Patent number 11,239,182
- Issue date Feb 1, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAPACITOR STRUCTURE INTEGRATED WITH CONTACT PAD STRUCTURE
- Publication number 20250006779
- Publication date Jan 2, 2025
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLINE RESISTOR INTEGRATED WITH CONDUCTIVE CONTACT PAD STRUCTURE
- Publication number 20240413111
- Publication date Dec 12, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESILIENT CONDUCTIVE BUMP FOR MICROELECTRONIC TESTING
- Publication number 20240339365
- Publication date Oct 10, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE LEVEL CAVITY HEAT SINK
- Publication number 20230163040
- Publication date May 25, 2023
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Alan P. Boone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE HEAT SINK
- Publication number 20230163041
- Publication date May 25, 2023
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Jacob R. Mauermann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER INCLUDING INTEGRATED CIRCUIT DIE MECHANICALLY I...
- Publication number 20220077016
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...
- Publication number 20220077015
- Publication date Mar 10, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Controlled Warping of Shadow Mask Tooling for Improved Reliability...
- Publication number 20220025506
- Publication date Jan 27, 2022
- Rockwell Collins, Inc.
- Richard Korneisel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Controlled Induced Warping of Electronic Substrates via Electroplating
- Publication number 20210230765
- Publication date Jul 29, 2021
- Rockwell Collins, Inc.
- Richard Korneisel
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Controlled Induced Warping of Electronic Substrates
- Publication number 20210233866
- Publication date Jul 29, 2021
- Rockwell Collins, Inc.
- Richard Korneisel
- H01 - BASIC ELECTRIC ELEMENTS

Jacob R. Mauermann

Person

Patents Grantslast 30 patents

Integrated circuit (IC) package with cantilever multi-chip module (...

Reconstituted wafer including integrated circuit die mechanically i...

Reconstituted wafer including mold material with recessed conductiv...

Controlled warping of shadow mask tooling for improved reliability...

Controlled induced warping of electronic substrates via electroplating

Controlled induced warping of electronic substrates

Patents Applicationslast 30 patents

CAPACITOR STRUCTURE INTEGRATED WITH CONTACT PAD STRUCTURE

INLINE RESISTOR INTEGRATED WITH CONDUCTIVE CONTACT PAD STRUCTURE

RESILIENT CONDUCTIVE BUMP FOR MICROELECTRONIC TESTING

DIE LEVEL CAVITY HEAT SINK

SELECTIVE HEAT SINK

RECONSTITUTED WAFER INCLUDING INTEGRATED CIRCUIT DIE MECHANICALLY I...

RECONSTITUTED WAFER INCLUDING MOLD MATERIAL WITH RECESSED CONDUCTIV...

Controlled Warping of Shadow Mask Tooling for Improved Reliability...

Controlled Induced Warping of Electronic Substrates via Electroplating

Controlled Induced Warping of Electronic Substrates