Jacques Leibovitz

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and structure for uniform height solder bumps on a semicondu...
- Patent number 6,268,656
- Issue date Jul 31, 2001
- Agilent Technologies, Inc.
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for uniform height solder bumps on a semicondu...
- Patent number 6,146,984
- Issue date Nov 14, 2000
- Agilent Technologies Inc.
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder retention ring for improved solder bump formation
- Patent number 6,085,968
- Issue date Jul 11, 2000
- Hewlett-Packard Company
- Susan J. Swindlehurst
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redistribution layer and under bump material structure for converti...
- Patent number 6,011,314
- Issue date Jan 4, 2000
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reworkable die attachment to heat spreader
- Patent number 5,749,988
- Issue date May 12, 1998
- Jacques Leibovitz
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Low cost, high thermal performance package for flip chips with low...
- Patent number 5,621,615
- Issue date Apr 15, 1997
- Hewlett-Packard Company
- Peter F. Dawson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable low thermal resistance package for high power flip clip ICs
- Patent number 5,585,671
- Issue date Dec 17, 1996
- Voddarahalli K. Nagesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mounting pin grid arrays
- Patent number 5,484,964
- Issue date Jan 16, 1996
- Peter F. Dawson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer fabrication in integrated circuit systems
- Patent number 5,399,528
- Issue date Mar 21, 1995
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reworkable die attachment
- Patent number 5,268,048
- Issue date Dec 7, 1993
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled etching process for forming fine-geometry circuit lines...
- Patent number 5,221,421
- Issue date Jun 22, 1993
- Hewlett-Packard Company
- Jacques Leibovitz
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Heat pipe-electrical interconnect integration method for chip modules
- Patent number 5,199,165
- Issue date Apr 6, 1993
- Hewlett-Packard Company
- Robert K. Crawford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming high density multi-chip carriers
- Patent number 5,200,300
- Issue date Apr 6, 1993
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked solid via formation in integrated circuit systems
- Patent number 5,162,260
- Issue date Nov 10, 1992
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat pipe-electrical interconnect integration for chip modules
- Patent number 5,161,090
- Issue date Nov 3, 1992
- Hewlett-Packard Company
- Robert K. Crawford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape automated bonding system which facilitate repair
- Patent number 5,086,335
- Issue date Feb 4, 1992
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked solid via formation in integrated circuit systems
- Patent number 5,055,425
- Issue date Oct 8, 1991
- Hewlett-Packard Company
- Jacques Leibovitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hierarchical tape automated bonding method
- Patent number 5,029,386
- Issue date Jul 9, 1991
- Hewlett-Packard Company
- Clinton C. Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process using supercritical conditions for producing highly accurat...
- Patent number 5,011,819
- Issue date Apr 30, 1991
- Hewlett-Packard Company
- Jacques Leibovitz
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Jacques Leibovitz

Person

Patents Grantslast 30 patents

Method and structure for uniform height solder bumps on a semicondu...

Method and structure for uniform height solder bumps on a semicondu...

Solder retention ring for improved solder bump formation

Redistribution layer and under bump material structure for converti...

Reworkable die attachment to heat spreader

Low cost, high thermal performance package for flip chips with low...

Reliable low thermal resistance package for high power flip clip ICs

Surface mounting pin grid arrays

Multi-layer fabrication in integrated circuit systems

Reworkable die attachment

Controlled etching process for forming fine-geometry circuit lines...

Heat pipe-electrical interconnect integration method for chip modules

Methods for forming high density multi-chip carriers

Stacked solid via formation in integrated circuit systems

Heat pipe-electrical interconnect integration for chip modules

Tape automated bonding system which facilitate repair

Stacked solid via formation in integrated circuit systems

Hierarchical tape automated bonding method

Process using supercritical conditions for producing highly accurat...