Jae Dong Kim

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Tempe, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Embedded phase noise measurement system
- Patent number 7,952,408
- Issue date May 31, 2011
- University of Florida Research Foundation, Inc.
- William Richard Eisenstadt
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wire bonding method for a semiconductor package
- Patent number 6,803,254
- Issue date Oct 12, 2004
- Amkor Technology, Inc.
- Young Kuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and semiconductor package manufactured using th...
- Patent number 6,642,610
- Issue date Nov 4, 2003
- Amkor Technology, Inc.
- Young Kuk Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED PHASE NOISE MEASUREMENT SYSTEM
- Publication number 20100327940
- Publication date Dec 30, 2010
- WILLIAM RICHARD EISENSTADT
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Wire bonding method for a semiconductor package
- Publication number 20030199118
- Publication date Oct 23, 2003
- Amkor Technology, Inc.
- Young Kuk Park
- H01 - BASIC ELECTRIC ELEMENTS