Jae Hyun Bae

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Gumi-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Wafer loading apparatus of wafer polishing equipment and method for...
- Patent number 10,068,785
- Issue date Sep 4, 2018
- SK SILTRON CO., LTD.
- Jae Hyun Bae
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry supply device and polishing apparatus including the same
- Patent number 9,358,666
- Issue date Jun 7, 2016
- LG SILTRON INCORPORATED
- Jae Hyun Bae
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
WAFER LOADING APPARATUS OF WAFER POLISHING EQUIPMENT AND METHOD FOR...
- Publication number 20170323814
- Publication date Nov 9, 2017
- LG SILTRON INCORPORATED
- Jae Hyun BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY SUPPLY DEVICE AND POLISHING APPARATUS INCLUDING THE SAME
- Publication number 20160045999
- Publication date Feb 18, 2016
- LG SILTRON INCORPORATED
- Jae Hyun Bae
- B24 - GRINDING POLISHING