Jae M. Park

Person

Binghamton, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Au-Sn transient liquid bonding in high performance laminates
- Patent number 5,421,507
- Issue date Jun 6, 1995
- International Business Machines Corporation
- Charles R. Davis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing a metal organic polymer combination
- Patent number 5,340,451
- Issue date Aug 23, 1994
- International Business Machines Corporation
- Leena P. Buchwalter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for producing ceramic circuit structures having conductive...
- Patent number 5,337,475
- Issue date Aug 16, 1994
- International Business Machines Corporation
- Farid Y. Aoude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of printed circuit boards using conducting polymer
- Patent number 5,300,208
- Issue date Apr 5, 1994
- International Business Machines Corporation
- Marie Angelopoulos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Via paste compositions and use thereof to form conductive vias in c...
- Patent number 5,283,104
- Issue date Feb 1, 1994
- International Business Machines Corporation
- Farid Y. Aoude
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Au-Sn transient liquid bonding in high performance laminates
- Patent number 5,280,414
- Issue date Jan 18, 1994
- International Business Machines Corp.
- Charles R. Davis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discrete fabrication of multi-layer thin film, wiring structures
- Patent number 5,232,548
- Issue date Aug 3, 1993
- International Business Machines Corporation
- Scott G. Ehrenberg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming a pattern on a substrate
- Patent number 5,173,392
- Issue date Dec 22, 1992
- International Business Machines, Corp.
- Ekkehard F. Miersch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a pattern on a substrate
- Patent number 5,122,439
- Issue date Jun 16, 1992
- International Business Machines Corp.
- Ekkehard F. Miersch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluorinated polymeric composition, fabrication thereof and use thereof
- Patent number 5,055,342
- Issue date Oct 8, 1991
- International Business Machines Corporation
- Voya Markovich
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Substrate of metal-complexed beta-diketone/thermosetting polymer re...
- Patent number 5,006,412
- Issue date Apr 9, 1991
- International Business Machines Corporation
- Susan A. Hodgson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Direct electroplating of through holes
- Patent number 4,969,979
- Issue date Nov 13, 1990
- International Business Machines Corporation
- Bernd K. Appelt
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for preparing substrates for deposition of metal seed from a...
- Patent number 4,869,930
- Issue date Sep 26, 1989
- International Business Machines Corporation
- Thomas C. Clarke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
.beta.-diketone-polymer reaction product
- Patent number 4,868,253
- Issue date Sep 19, 1989
- International Business Machines Corporation
- Susan A. Hodgson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Strengthening a ceramic by post sinter coating with a compressive s...
- Patent number 4,781,970
- Issue date Nov 1, 1988
- International Business Machines Corporation
- Steven G. Barbee
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Jae M. Park

Person

Patents Grantslast 30 patents

Au-Sn transient liquid bonding in high performance laminates

Process for producing a metal organic polymer combination

Process for producing ceramic circuit structures having conductive...

Fabrication of printed circuit boards using conducting polymer

Via paste compositions and use thereof to form conductive vias in c...

Au-Sn transient liquid bonding in high performance laminates

Discrete fabrication of multi-layer thin film, wiring structures

Forming a pattern on a substrate

Forming a pattern on a substrate

Fluorinated polymeric composition, fabrication thereof and use thereof

Substrate of metal-complexed beta-diketone/thermosetting polymer re...

Direct electroplating of through holes

Method for preparing substrates for deposition of metal seed from a...

.beta.-diketone-polymer reaction product

Strengthening a ceramic by post sinter coating with a compressive s...