Claims
- 1. A method for fabricating an apparatus which includes first and second dielectric layers laminated together, said first dielectric layer including a through hole terminating in a first electrically conductive land and said second dielectric layer including a second electrically conductive land, which method comprises the steps of:
- laminating said first and second dielectric layers together using one or more lamination temperatures; and
- forming an electrical connection between said first and second lands including a region of material which is essentially free of flux and has a melting point which is higher than the peak lamination temperature used during said laminating step.
- 2. The method of claim 1, further comprising the step of mounting a semiconductor device on the laminated first and second dielectric layers.
- 3. The method of claim 1, wherein said region of material includes gold.
- 4. The method of claim 1, wherein said region of material includes tin.
- 5. The method of claim 1, wherein said apparatus is a printed circuit board.
- 6. A method for fabricating an apparatus which includes first and second dielectric layers laminated together, said first dielectric layer including a first electrically conductive land and said second dielectric layer including a second electrically conductive land, which method comprises the steps of:
- laminating said first and second dielectric layers together using one or more lamination temperatures; and
- forming an electrical connection between said first and second lands including a region of material which is essentially free of flux and has a melting point which is higher than the peak lamination temperature used during said laminating step.
Parent Case Info
This is a divisional of application Ser. No. 07/536,145, filed on Jun. 11, 1990, now U.S. Pat. No. 5,280,414.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
3648357 |
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Mar 1972 |
|
3993238 |
Brook et al. |
Nov 1976 |
|
5038996 |
Wilcox et al. |
Aug 1991 |
|
Non-Patent Literature Citations (2)
Entry |
Miller et al., IBM Tech. Discl. Bulletin, vol. 24, No. 12, May 1992, pp. 6430-6431. |
L. Berstein, Journal of The Electrochemical Society, , vol. 113, No. 12, Dec. 1966, pp. 1282-1288. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
536145 |
Jun 1990 |
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