Jae-Phil Boo

Person

Seongnam-City, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Single type apparatus for drying a substrate and single type system...
- Patent number 9,620,392
- Issue date Apr 11, 2017
- Samsung Electronics Co., Ltd.
- Dong-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP apparatus
- Patent number 9,421,668
- Issue date Aug 23, 2016
- EHWA DIAMOND INDUSTRIAL CO., LTD.
- Seh Kwang Lee
- B24 - GRINDING POLISHING
Information Patent Grant
CMP pad conditioner, and method for producing the CMP pad conditioner
- Patent number 9,314,901
- Issue date Apr 19, 2016
- EHWA DIAMOND INDUSTRIAL CO., LTD.
- Seh Kwang Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing system
- Patent number 8,882,563
- Issue date Nov 11, 2014
- Samsung Electronics Co., Ltd.
- Jae Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus
- Patent number 8,790,158
- Issue date Jul 29, 2014
- Samsung Electronics Co., Ltd.
- One-Moon Chang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad for chemical mechanical polishing process and chemica...
- Patent number 8,734,206
- Issue date May 27, 2014
- Samsung Electronics Co., Ltd.
- One-Moon Chang
- B24 - GRINDING POLISHING
Information Patent Grant
Conditioner of chemical mechanical polishing apparatus
- Patent number 8,662,956
- Issue date Mar 4, 2014
- Samsung Electronics Co., Ltd.
- Keon Sik Seo
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier head of chemical mechanical polishing apparatus having barr...
- Patent number 7,303,466
- Issue date Dec 4, 2007
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing a semiconductor wafer
- Patent number 7,223,158
- Issue date May 29, 2007
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry for chemical mechanical polishing process and method of manu...
- Patent number 7,196,010
- Issue date Mar 27, 2007
- Samsung Electronics, Co., Ltd.
- Young-rae Park
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and method for treating substrates
- Patent number 7,196,011
- Issue date Mar 27, 2007
- Samsung Electronics Co., Ltd.
- Chan-Woo Cho
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing a semiconductor wafer
- Patent number 7,081,045
- Issue date Jul 25, 2006
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad for chemical mechanical polishing apparatus
- Patent number 7,052,368
- Issue date May 30, 2006
- Samsung Electronics Co., Ltd.
- Jin-Kook Kim
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head of chemical mechanical polishing apparatus and polis...
- Patent number 6,945,861
- Issue date Sep 20, 2005
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for polishing a semiconductor wafer and method therefor
- Patent number 6,921,323
- Issue date Jul 26, 2005
- Samsung Electronics, Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head of chemical mechanical polishing apparatus and polis...
- Patent number 6,881,135
- Issue date Apr 19, 2005
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing station of a chemical mechanical polishing apparatus
- Patent number 6,840,846
- Issue date Jan 11, 2005
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head of chemical mechanical polishing apparatus and polis...
- Patent number 6,769,973
- Issue date Aug 3, 2004
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Method of fabricating a non-volatile memory device having a tunnel-...
- Patent number 6,709,920
- Issue date Mar 23, 2004
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for polishing a semiconductor wafer and method therefor
- Patent number 6,652,362
- Issue date Nov 25, 2003
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry for chemical mechanical polishing process and method of manu...
- Patent number 6,626,968
- Issue date Sep 30, 2003
- Samsung Electronics Co., Ltd.
- Young-rae Park
- B24 - GRINDING POLISHING
Information Patent Grant
Method for fabricating MOS transistor using selective silicide process
- Patent number 6,383,882
- Issue date May 7, 2002
- Samsung Electronics Co., Ltd.
- Sun-wung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CMP APPARATUS
- Publication number 20150140900
- Publication date May 21, 2015
- Samsung Electronics Co., Ltd.
- Seh Kwang Lee
- B24 - GRINDING POLISHING
Information Patent Application
CMP PAD CONDITIONER, AND METHOD FOR PRODUCING THE CMP PAD CONDITIONER
- Publication number 20140094101
- Publication date Apr 3, 2014
- Samsung Electronics Co., LTD
- Seh Kwang Lee
- B24 - GRINDING POLISHING
Information Patent Application
SINGLE TYPE APPARATUS FOR DRYING A SUBSTRATE AND SINGLE TYPE SYSTEM...
- Publication number 20140000661
- Publication date Jan 2, 2014
- Samsung Electronics Co., Ltd.
- Dong-Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRUSH AND METHOD FOR CLEANING A SUBSTRATE AND SCRUBBER EMPLOYING TH...
- Publication number 20120247508
- Publication date Oct 4, 2012
- Samsung Electronics Co., Ltd.
- Gun-Ig Jeung
- B08 - CLEANING
Information Patent Application
CONDITIONER OF CHEMICAL MECHANICAL POLISHING APPARATUS
- Publication number 20110275289
- Publication date Nov 10, 2011
- K. C. TECH CO., LTD.
- Keon Sik Seo
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING SYSTEM
- Publication number 20110269378
- Publication date Nov 3, 2011
- K. C. TECH CO., LTD.
- Jae Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS
- Publication number 20110217910
- Publication date Sep 8, 2011
- One-Moon CHANG
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING PROCESS AND CHEMICA...
- Publication number 20110217911
- Publication date Sep 8, 2011
- One-Moon CHANG
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING A SEMICONDUCTOR WAFER
- Publication number 20070232209
- Publication date Oct 4, 2007
- Samsung Electronics Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Slurry for chemical mechanical polishing process and method of manu...
- Publication number 20070155178
- Publication date Jul 5, 2007
- Samsung Electronics Co., Ltd.
- Young-rae Park
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus and methods for polishing a semiconductor wafer
- Publication number 20060116056
- Publication date Jun 1, 2006
- Samsung Electronics, Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Carrier head of chemical mechanical polishing apparatus having barr...
- Publication number 20050272346
- Publication date Dec 8, 2005
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD OF CHEMICAL MECHANICAL POLISHING APPARATUS AND POLIS...
- Publication number 20050153635
- Publication date Jul 14, 2005
- Samsung Electronics, Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus and method for treating susbtrates
- Publication number 20050153557
- Publication date Jul 14, 2005
- Chan-Woo Cho
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus for polishing a semiconductor wafer and method therefor
- Publication number 20050136806
- Publication date Jun 23, 2005
- Samsung Electronics, Co., Ltd.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Polishing pad for chemical mechanical polishing apparatus
- Publication number 20040248501
- Publication date Dec 9, 2004
- Jin-Kook Kim
- B24 - GRINDING POLISHING
Information Patent Application
Polishing head of chemical mechanical polishing apparatus and polis...
- Publication number 20040242129
- Publication date Dec 2, 2004
- SAMSUNG ELECTRONICS CO., LTD.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus for polishing a semiconductor wafer and method therefor
- Publication number 20040072517
- Publication date Apr 15, 2004
- SAMSUNG ELECTRONICS CO., LTD.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Slurry for chemical mechanical polishing process and method of manu...
- Publication number 20040033693
- Publication date Feb 19, 2004
- SAMSUNG ELECTRONICS CO., LTD.
- Young-rae Park
- B24 - GRINDING POLISHING
Information Patent Application
Polishing station of a chemical mechanical polishing apparatus
- Publication number 20030236056
- Publication date Dec 25, 2003
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Polishing head of chemical mechanical polishing apparatus and polis...
- Publication number 20030008604
- Publication date Jan 9, 2003
- SAMSUNG ELECTRONICS CO., LTD.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Apparatus for polishing a semiconductor wafer and method therefor
- Publication number 20020098780
- Publication date Jul 25, 2002
- SAMSUNG ELECTRONICS CO., LTD.
- Jae-Phil Boo
- B24 - GRINDING POLISHING
Information Patent Application
Slurry for chemical mechanical polishing process and method of manu...
- Publication number 20020034875
- Publication date Mar 21, 2002
- SAMSUNG ELECTRONICS CO., LTD.
- Young-rae Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for fabricating MOS transistor using selective silicide process
- Publication number 20020025634
- Publication date Feb 28, 2002
- Sun-Wung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a non-volatile memory device having a tunnel-...
- Publication number 20020016041
- Publication date Feb 7, 2002
- SAMSUNG ELECTRONICS CO., LTD.
- Jae-Phil Boo
- H01 - BASIC ELECTRIC ELEMENTS

Jae-Phil Boo

Person

Patents Grantslast 30 patents

Single type apparatus for drying a substrate and single type system...

CMP apparatus

CMP pad conditioner, and method for producing the CMP pad conditioner

Chemical mechanical polishing system

Chemical mechanical polishing apparatus

Polishing pad for chemical mechanical polishing process and chemica...

Conditioner of chemical mechanical polishing apparatus

Carrier head of chemical mechanical polishing apparatus having barr...

Method for polishing a semiconductor wafer

Slurry for chemical mechanical polishing process and method of manu...

Apparatus and method for treating substrates

Apparatus for polishing a semiconductor wafer

Polishing pad for chemical mechanical polishing apparatus

Polishing head of chemical mechanical polishing apparatus and polis...

Apparatus for polishing a semiconductor wafer and method therefor

Polishing head of chemical mechanical polishing apparatus and polis...

Polishing station of a chemical mechanical polishing apparatus

Polishing head of chemical mechanical polishing apparatus and polis...

Method of fabricating a non-volatile memory device having a tunnel-...

Apparatus for polishing a semiconductor wafer and method therefor

Slurry for chemical mechanical polishing process and method of manu...

Method for fabricating MOS transistor using selective silicide process

Patents Applicationslast 30 patents

CMP APPARATUS

CMP PAD CONDITIONER, AND METHOD FOR PRODUCING THE CMP PAD CONDITIONER

SINGLE TYPE APPARATUS FOR DRYING A SUBSTRATE AND SINGLE TYPE SYSTEM...

BRUSH AND METHOD FOR CLEANING A SUBSTRATE AND SCRUBBER EMPLOYING TH...

CONDITIONER OF CHEMICAL MECHANICAL POLISHING APPARATUS

CHEMICAL MECHANICAL POLISHING SYSTEM

CHEMICAL MECHANICAL POLISHING APPARATUS

POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING PROCESS AND CHEMICA...

METHOD FOR POLISHING A SEMICONDUCTOR WAFER

Slurry for chemical mechanical polishing process and method of manu...

Apparatus and methods for polishing a semiconductor wafer

Carrier head of chemical mechanical polishing apparatus having barr...

POLISHING HEAD OF CHEMICAL MECHANICAL POLISHING APPARATUS AND POLIS...

Apparatus and method for treating susbtrates

Apparatus for polishing a semiconductor wafer and method therefor

Polishing pad for chemical mechanical polishing apparatus

Polishing head of chemical mechanical polishing apparatus and polis...

Apparatus for polishing a semiconductor wafer and method therefor

Slurry for chemical mechanical polishing process and method of manu...

Polishing station of a chemical mechanical polishing apparatus

Polishing head of chemical mechanical polishing apparatus and polis...

Apparatus for polishing a semiconductor wafer and method therefor

Slurry for chemical mechanical polishing process and method of manu...

Method for fabricating MOS transistor using selective silicide process

Method of fabricating a non-volatile memory device having a tunnel-...