JaeMin JUNG

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Chip-on-film package and display apparatus including the same
- Patent number 12,230,576
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package with trench to reduce slippage and display dev...
- Patent number 12,148,337
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Han
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Chip on film package and display apparatus including the same
- Patent number 11,842,945
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for semiconductor package, semiconductor package using film an...
- Patent number 9,922,891
- Issue date Mar 20, 2018
- Samsung Electronics Co., Ltd.
- Soyoung Lim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Film for semiconductor package, semiconductor package using film an...
- Patent number 9,576,865
- Issue date Feb 21, 2017
- Samsung Electronics Co., Ltd.
- Soyoung Lim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER CLEANING APPARATUS
- Publication number 20250040693
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- DONGHOON KWON
- A46 - BRUSHWARE
Information Patent Application
FILM PACKAGE
- Publication number 20250022998
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Seunghyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321902
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Narae Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDITIONING APPARATUS
- Publication number 20240269798
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Hyuntae Lee
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTR...
- Publication number 20240244846
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Wonjun PARK
Information Patent Application
NON-VOLATILE MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240224523
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Dongsung Choi
Information Patent Application
FILM PACKAGE AND DISPLAY MODULE INCLUDING SAME
- Publication number 20240204009
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240196618
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Byongju KIM
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME
- Publication number 20240147722
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Byongju Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20240096909
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240090220
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Jaemin JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240081075
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Byongju Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME
- Publication number 20240074195
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Byongju Kim
Information Patent Application
FILM PACKAGE
- Publication number 20230335482
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- Seunghyun CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING...
- Publication number 20230326930
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Seunghyun CHO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
FILM PACKAGE
- Publication number 20230178450
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Sungeun JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230036519
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Sanguk HAN
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20220246530
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20220139799
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AN...
- Publication number 20170125314
- Publication date May 4, 2017
- Samsung Electronics Co., Ltd.
- Soyoung LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AN...
- Publication number 20160197020
- Publication date Jul 7, 2016
- Samsung Electronics Co., Ltd.
- Soyoung LIM
- H01 - BASIC ELECTRIC ELEMENTS

JaeMin JUNG

Person

Patents Grantslast 30 patents

Chip-on-film package and display apparatus including the same

Chip on film package with trench to reduce slippage and display dev...

Chip on film package and display apparatus including the same

Film for semiconductor package, semiconductor package using film an...

Film for semiconductor package, semiconductor package using film an...

Patents Applicationslast 30 patents

WAFER CLEANING APPARATUS

FILM PACKAGE

CHIP-ON-FILM PACKAGE AND MANUFACTURING METHOD THEREOF

CONDITIONING APPARATUS

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTR...

NON-VOLATILE MEMORY DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

FILM PACKAGE AND DISPLAY MODULE INCLUDING SAME

INTEGRATED CIRCUIT DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME

CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICE AND ELECTRONIC SYSTEM INCLUDING THE SAME

FILM PACKAGE

CHIP-ON-FILM SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING...

FILM PACKAGE

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AN...

FILM FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING FILM AN...