JaEung Koo

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Gyeonggi-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including interconnections having different st...
- Patent number 11,094,586
- Issue date Aug 17, 2021
- Samsung Electronics Co., Ltd.
- Seung Hoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP method providing reduced thickness variations
- Patent number 7,452,817
- Issue date Nov 18, 2008
- Samsung Electronics Co., Ltd.
- Ilyoung Yoon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230253241
- Publication date Aug 10, 2023
- Samsung Electronics Co., LTD
- Youncheol JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING SINGLE SLURRY CH...
- Publication number 20230215926
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Joongsuk Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20220310594
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- Youncheol Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20200243374
- Publication date Jul 30, 2020
- Samsung Electronics Co., Ltd.
- Seung Hoon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMP method providing reduced thickness variations
- Publication number 20070167014
- Publication date Jul 19, 2007
- Ilyoung Yoon
- H01 - BASIC ELECTRIC ELEMENTS