James C. K. Lee

Person

Santa Clara County, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sequential multilayer process for using fluorinated hydrocarbons as...
- Patent number 5,387,495
- Issue date Feb 7, 1995
- Digital Equipment Corporation
- James C. K. Lee
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Double-sided hybrid high density circuit board and method of making...
- Patent number 5,072,075
- Issue date Dec 10, 1991
- Digital Equipment Corporation
- James C. K. Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for detachably mounting semiconductors on conductor substrate
- Patent number 5,014,161
- Issue date May 7, 1991
- Digital Equipment Corporation
- James C. K. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector for surface mounting
- Patent number 4,954,873
- Issue date Sep 4, 1990
- Digital Equipment Corporation
- James Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic elastomeric interconnecting system
- Patent number 4,778,950
- Issue date Oct 18, 1988
- Digital Equipment Corporation
- James C. K. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector for surface mounting and method of making thereof
- Patent number 4,754,546
- Issue date Jul 5, 1988
- Digital Equipment Corporation
- James C. K. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating electrical connector for surface mounting
- Patent number 4,729,166
- Issue date Mar 8, 1988
- Digital Equipment Corporation
- James Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip interconnection system and package
- Patent number 4,692,839
- Issue date Sep 8, 1987
- Digital Equipment Corporation
- James C. K. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip interface
- Patent number 4,667,219
- Issue date May 19, 1987
- Trilogy Computer Development Partners, Ltd.
- James C. K. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip module interconnection system
- Patent number 4,667,220
- Issue date May 19, 1987
- Trilogy Computer Development Partners, Ltd.
- James C. K. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging systems with double surface heat dissi...
- Patent number 4,620,215
- Issue date Oct 28, 1986
- Amdahl Corporation
- James C. K. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module construction for semiconductor chip
- Patent number 4,603,345
- Issue date Jul 29, 1986
- Trilogy Computer Development Partners, Ltd.
- James C. K. Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal connection system for semiconductor chip
- Patent number 4,597,029
- Issue date Jun 24, 1986
- Trilogy Computer Development Partners, Ltd.
- Andrzej Kucharek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and electronic array having improved heat dis...
- Patent number 4,292,647
- Issue date Sep 29, 1981
- Amdahl Corporation
- James C. K. Lee
- H01 - BASIC ELECTRIC ELEMENTS

James C. K. Lee

Person

Patents Grantslast 30 patents

Sequential multilayer process for using fluorinated hydrocarbons as...

Double-sided hybrid high density circuit board and method of making...

System for detachably mounting semiconductors on conductor substrate

Electrical connector for surface mounting

Anisotropic elastomeric interconnecting system

Electrical connector for surface mounting and method of making thereof

Method of fabricating electrical connector for surface mounting

Multiple chip interconnection system and package

Semiconductor chip interface

Semiconductor chip module interconnection system

Integrated circuit packaging systems with double surface heat dissi...

Module construction for semiconductor chip

Signal connection system for semiconductor chip

Semiconductor package and electronic array having improved heat dis...