James E. Eder

Person

Doylestown, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 11,295,996
- Issue date Apr 5, 2022
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 10,692,783
- Issue date Jun 23, 2020
- KULICKE AND SOFFA, INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile capillary for wire bonding
- Patent number 7,500,591
- Issue date Mar 10, 2009
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-profile capillary for wire bonding
- Patent number 7,320,425
- Issue date Jan 22, 2008
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated flexure mount scheme for dynamic isolation of ultrasonic...
- Patent number 7,137,543
- Issue date Nov 21, 2006
- Kulicke and Soffa Industries, Inc.
- Dominick A. DeAngelis
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Die attach process using cornercube offset tool
- Patent number 6,778,274
- Issue date Aug 17, 2004
- Kulicke & Soffa Investments, Inc.
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Indirect imaging method for a bonding tool
- Patent number 6,712,257
- Issue date Mar 30, 2004
- Kulicke & Soffa Investments, Inc.
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die attach system and process using cornercube offset tool
- Patent number 6,705,507
- Issue date Mar 16, 2004
- Kulicke & Soffa Investments, Inc.
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Indirect imaging system for a bonding tool
- Patent number 6,641,026
- Issue date Nov 4, 2003
- Kulicke & Soffa Investments, Inc.
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cornercube offset tool
- Patent number 6,412,683
- Issue date Jul 2, 2002
- Kulicke & Soffa Investments, Inc.
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20200273759
- Publication date Aug 27, 2020
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20180090395
- Publication date Mar 29, 2018
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20150155211
- Publication date Jun 4, 2015
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-PROFILE CAPILLARY FOR WIRE BONDING
- Publication number 20080210740
- Publication date Sep 4, 2008
- KULICKE AND SOFFA INDUSTRIES, INC.
- James E. Eder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire tensioner for a wire bonder
- Publication number 20060091181
- Publication date May 4, 2006
- Kulicke & Soffa Industries, Inc.
- James E. Eder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated flexure mount scheme for dynamic isolation of ultrasonic...
- Publication number 20060022016
- Publication date Feb 2, 2006
- Dominick A. DeAngelis
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
Low-profile capillary for wire bonding
- Publication number 20050252950
- Publication date Nov 17, 2005
- Kulicke & Soffa Investments, Inc.
- James E. Eder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding apparatus having actuated flame-off wand
- Publication number 20050199677
- Publication date Sep 15, 2005
- Kulicke and Soffa Industries Inc.
- Richard Sadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die attach process using cornercube offset tool
- Publication number 20040012784
- Publication date Jan 22, 2004
- David T. Beatson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die attach system and process using cornercube offset tool
- Publication number 20030019909
- Publication date Jan 30, 2003
- David T. Beatson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Indirect imaging system for a bonding tool
- Publication number 20030019908
- Publication date Jan 30, 2003
- David T. Beatson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Indirect imaging method for a bonding tool
- Publication number 20030019911
- Publication date Jan 30, 2003
- David T. Beatson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

James E. Eder

Person

Patents Grantslast 30 patents

Systems and methods for bonding semiconductor elements

Systems and methods for bonding semiconductor elements

Low-profile capillary for wire bonding

Low-profile capillary for wire bonding

Integrated flexure mount scheme for dynamic isolation of ultrasonic...

Die attach process using cornercube offset tool

Indirect imaging method for a bonding tool

Die attach system and process using cornercube offset tool

Indirect imaging system for a bonding tool

Cornercube offset tool

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

LOW-PROFILE CAPILLARY FOR WIRE BONDING

Wire tensioner for a wire bonder

Integrated flexure mount scheme for dynamic isolation of ultrasonic...

Low-profile capillary for wire bonding

Wire bonding apparatus having actuated flame-off wand

Die attach process using cornercube offset tool

Die attach system and process using cornercube offset tool

Indirect imaging system for a bonding tool

Indirect imaging method for a bonding tool