Claims
- 1. A method for positioning a die on a substrate, the method comprising the steps of:providing a cornercube offset tool below an object plane of the substrate, the cornercube offset tool having three internal reflection surfaces; viewing an indirect image of the die through the cornercube offset tool; identifying a feature located on a bottom surface of the die based on the indirect image; and placing the die on the substrate based on the identified feature.
- 2. A method for positioning a die on a substrate, the method comprising the steps of:positioning a plurality of cornercube offset tools below an object plane of the substrate; positioning a first lens between each of the plurality of cornercube offset tools and the die; positioning a second lens between each of the plurality of cornercube offset tools and an optical input device; and viewing a surface of the die through the first lens, the cornercube offset tool, and the second lens.
- 3. A method for use with a bonding machine to place a die on a substrate, the method comprising the steps of:positioning a cornercube offset tool below an object plane of the bonding machine; positioning a lens between i) the vision plane and the cornercube offset tool and ii) between an optical input device and the cornercube offset tool; viewing a portion of a bottom surface of the die through the cornercube offset tool and the lens; and placing the die on the substrate based on the viewed portion of the die.
Parent Case Info
This Application is a divisional of U.S. patent application Ser. No. 10/075,899, filed Feb. 14, 2002, which is a continuation-in-part application of U.S. patent application Ser. No. 09/912,024, filed Jul. 24, 2001, which is now U.S. Pat. No. 6,412,683, issued Jul. 2, 2002.
US Referenced Citations (19)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
09/912024 |
Jul 2001 |
US |
Child |
10/075899 |
|
US |