James F. Dormer

Person

Limekiln, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for passively aligning components on semicondu...
- Patent number 6,265,240
- Issue date Jul 24, 2001
- Lucent Technologies, Inc.
- Mindaugas F. Dautartas
- G02 - OPTICS
Information Patent Grant
Bonding of aluminum oxide components to silicon substrates
- Patent number 6,119,921
- Issue date Sep 19, 2000
- Lucent Technologies
- Michael Francis Brady
- G02 - OPTICS
Information Patent Grant
Method for improved metal oxide bonding of optical elements
- Patent number 6,117,794
- Issue date Sep 12, 2000
- Lucent Technologies, Inc.
- James F. Dormer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid guide for electronic devices
- Patent number 6,058,676
- Issue date May 9, 2000
- Lucent Technologies Inc.
- Bruce C. Abraham
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Fabrication of semiconductor devices
- Patent number 6,043,443
- Issue date Mar 28, 2000
- Lucent Technologies Inc.
- Patrick J. Doran
- G01 - MEASURING TESTING
Information Patent Grant
Bonding of aluminum oxide components to silicons substrates
- Patent number 6,034,405
- Issue date Mar 7, 2000
- Lucent Technologies, Inc.
- Michael Francis Brady
- G02 - OPTICS
Information Patent Grant
Method for removing thin, organic materials from semiconductor dies...
- Patent number 5,989,354
- Issue date Nov 23, 1999
- Lucent Technologies, Inc.
- James F. Dormer
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
Optical subassembly
- Publication number 20020130249
- Publication date Sep 19, 2002
- James F. Dormer
- G02 - OPTICS

James F. Dormer

Person

Patents Grantslast 30 patents

Method and apparatus for passively aligning components on semicondu...

Bonding of aluminum oxide components to silicon substrates

Method for improved metal oxide bonding of optical elements

Lid guide for electronic devices

Fabrication of semiconductor devices

Bonding of aluminum oxide components to silicons substrates

Method for removing thin, organic materials from semiconductor dies...

Patents Applicationslast 30 patents

Optical subassembly