James J. Wang

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Film sensors array and method
- Patent number 10,685,944
- Issue date Jun 16, 2020
- James Jen-Ho Wang
- G01 - MEASURING TESTING
Information Patent Grant
Inductor, transformer, and method
- Patent number 9,799,448
- Issue date Oct 24, 2017
- Power Gold LLC
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit assembly and method therof
- Patent number 9,704,644
- Issue date Jul 11, 2017
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding a pre-assembled unit including a device into a...
- Patent number 9,668,352
- Issue date May 30, 2017
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- James Jen-ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent lighting system
- Patent number 9,282,596
- Issue date Mar 8, 2016
- Power Gold LLC
- James Jen-Ho Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible electronic assembly and method of manufacturing the same
- Patent number 8,998,454
- Issue date Apr 7, 2015
- Sumitomo Electric Printed Circuits, Inc.
- James Jen-Ho Wang
- F21 - LIGHTING
Information Patent Grant
Integrated nano-farad capacitors and method of formation
- Patent number 8,890,287
- Issue date Nov 18, 2014
- Power Gold LLC
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit assembly and method thereof
- Patent number 8,879,276
- Issue date Nov 4, 2014
- Power Gold LLC
- James Jen-Ho Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming quad flat no-lead (QFN) packages
- Patent number 7,713,781
- Issue date May 11, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) packages
- Patent number 7,652,357
- Issue date Jan 26, 2010
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for a Quad Flat No-Lead (QFN) package
- Patent number 7,489,026
- Issue date Feb 10, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device assembly and method for forming
- Patent number 7,132,303
- Issue date Nov 7, 2006
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with strain relieving bump design
- Patent number 6,790,759
- Issue date Sep 14, 2004
- Freescale Semiconductor, Inc.
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device and method of formation
- Patent number 6,646,347
- Issue date Nov 11, 2003
- Motorola, Inc.
- Lei L. Mercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer wax mounting and thinning process
- Patent number 5,256,599
- Issue date Oct 26, 1993
- Motorola, Inc.
- Paul D. Asetta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FILM SENSORS ARRAY AND METHOD
- Publication number 20180114784
- Publication date Apr 26, 2018
- James Jen-Ho Wang
- G01 - MEASURING TESTING
Information Patent Application
FLEXIBLE CIRCUIT ASSEMBLY AND METHOD THEROF
- Publication number 20170186533
- Publication date Jun 29, 2017
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR, TRANSFORMER, AND METHOD
- Publication number 20160163451
- Publication date Jun 9, 2016
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT ASSEMBLY AND METHOD THEROF
- Publication number 20160126010
- Publication date May 5, 2016
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EMBEDDING A PRE-ASSEMBLED UNIT INCLUDING A DEVICE INTO A...
- Publication number 20140268594
- Publication date Sep 18, 2014
- James Jen-Ho WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140268780
- Publication date Sep 18, 2014
- Power Gold LLC
- James Jen-Ho WANG
- F21 - LIGHTING
Information Patent Application
Intelligent lighting system
- Publication number 20140167618
- Publication date Jun 19, 2014
- Power Gold LLC
- James Jen-Ho Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGES
- Publication number 20090152710
- Publication date Jun 18, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING QUAD FLAT NO-LEAD (QFN) PACKAGES
- Publication number 20090004775
- Publication date Jan 1, 2009
- FREESCALE SEMICONDUCTOR, INC.
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for a Quad Flat No-Lead (QFN) package
- Publication number 20080099899
- Publication date May 1, 2008
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chips semiconductor device assemblies and methods for fabrica...
- Publication number 20060108697
- Publication date May 25, 2006
- James Jen Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked semiconductor device assembly and method for forming
- Publication number 20050136558
- Publication date Jun 23, 2005
- James J. Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with strain relieving bump design
- Publication number 20050023680
- Publication date Feb 3, 2005
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor power device and method of formation
- Publication number 20030232493
- Publication date Dec 18, 2003
- Lei L. Mercado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER DEVICE AND METHOD OF FORMATION
- Publication number 20030102563
- Publication date Jun 5, 2003
- Lei L. Mercado
- H01 - BASIC ELECTRIC ELEMENTS

James J. Wang

Person

Patents Grantslast 30 patents

Film sensors array and method

Inductor, transformer, and method

Flexible circuit assembly and method therof

Method of embedding a pre-assembled unit including a device into a...

Intelligent lighting system

Flexible electronic assembly and method of manufacturing the same

Integrated nano-farad capacitors and method of formation

Flexible circuit assembly and method thereof

Methods for forming quad flat no-lead (QFN) packages

Quad flat no-lead (QFN) packages

Methods and apparatus for a Quad Flat No-Lead (QFN) package

Stacked semiconductor device assembly and method for forming

Semiconductor device with strain relieving bump design

Semiconductor power device and method of formation

Semiconductor wafer wax mounting and thinning process

Patents Applicationslast 30 patents

FILM SENSORS ARRAY AND METHOD

FLEXIBLE CIRCUIT ASSEMBLY AND METHOD THEROF

INDUCTOR, TRANSFORMER, AND METHOD

FLEXIBLE CIRCUIT ASSEMBLY AND METHOD THEROF

METHOD OF EMBEDDING A PRE-ASSEMBLED UNIT INCLUDING A DEVICE INTO A...

FLEXIBLE ELECTRONIC ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

Intelligent lighting system

QUAD FLAT NO-LEAD (QFN) PACKAGES

METHODS FOR FORMING QUAD FLAT NO-LEAD (QFN) PACKAGES

Methods and apparatus for a Quad Flat No-Lead (QFN) package

Multi-chips semiconductor device assemblies and methods for fabrica...

Stacked semiconductor device assembly and method for forming

Semiconductor device with strain relieving bump design

Semiconductor power device and method of formation

SEMICONDUCTOR POWER DEVICE AND METHOD OF FORMATION