James L. Voelz

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor assemblies with redistribution structures for die sta...
- Patent number 11,990,446
- Issue date May 21, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-notched substrate packaging and associated systems and methods
- Patent number 11,848,299
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies with redistribution structures for die sta...
- Patent number 11,552,045
- Issue date Jan 10, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge-notched substrate packaging and associated systems and methods
- Patent number 11,482,504
- Issue date Oct 25, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for wafer-level packaging of microelectronic devices and mi...
- Patent number 8,154,126
- Issue date Apr 10, 2012
- Round Rock Research, LLC
- James L. Voelz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming molded standoff structures on integrated circuit...
- Patent number 7,993,977
- Issue date Aug 9, 2011
- Micron Technology, Inc.
- Frank Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for wafer-level packaging of microelectronic devices and mi...
- Patent number 7,772,707
- Issue date Aug 10, 2010
- Round Rock Research, LLC
- James L. Voelz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for wafer-level packaging of microelectronic devices and mi...
- Patent number 7,256,074
- Issue date Aug 14, 2007
- Micron Technology, Inc.
- James L. Voelz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20240321822
- Publication date Sep 26, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20230145473
- Publication date May 11, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE-NOTCHED SUBSTRATE PACKAGING AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20230045144
- Publication date Feb 9, 2023
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE-NOTCHED SUBSTRATE PACKAGING AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20220084977
- Publication date Mar 17, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH INTERNAL THERMAL B...
- Publication number 20220051962
- Publication date Feb 17, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20220052021
- Publication date Feb 17, 2022
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR WAFER-LEVEL PACKAGING OF MICROELECTRONIC DEVICES AND MI...
- Publication number 20110163443
- Publication date Jul 7, 2011
- ROUND ROCK RESEARCH, LLC
- James L. Voelz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC IMAGER PACKAGES AND ASSOCIATED METHODS OF PACKAGING
- Publication number 20090121300
- Publication date May 14, 2009
- Micron Technology, Inc.
- James L. Voelz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING MOLDED STANDOFF STRUCTURES ON INTEGRATED CIRCUIT...
- Publication number 20090011544
- Publication date Jan 8, 2009
- Frank Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for wafer-level packaging of microelectronic devices and mi...
- Publication number 20050280164
- Publication date Dec 22, 2005
- Micron Technology, Inc.
- James L. Voelz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for wafer-level packaging of microelectronic devices and mi...
- Publication number 20050085006
- Publication date Apr 21, 2005
- James L. Voelz
- H01 - BASIC ELECTRIC ELEMENTS

James L. Voelz

Person

Patents Grantslast 30 patents

Semiconductor assemblies with redistribution structures for die sta...

Edge-notched substrate packaging and associated systems and methods

Semiconductor assemblies with redistribution structures for die sta...

Edge-notched substrate packaging and associated systems and methods

Methods for wafer-level packaging of microelectronic devices and mi...

Method of forming molded standoff structures on integrated circuit...

Methods for wafer-level packaging of microelectronic devices and mi...

Methods for wafer-level packaging of microelectronic devices and mi...

Patents Applicationslast 30 patents

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

EDGE-NOTCHED SUBSTRATE PACKAGING AND ASSOCIATED SYSTEMS AND METHODS

EDGE-NOTCHED SUBSTRATE PACKAGING AND ASSOCIATED SYSTEMS AND METHODS

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH INTERNAL THERMAL B...

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

METHODS FOR WAFER-LEVEL PACKAGING OF MICROELECTRONIC DEVICES AND MI...

MICROELECTRONIC IMAGER PACKAGES AND ASSOCIATED METHODS OF PACKAGING

METHOD OF FORMING MOLDED STANDOFF STRUCTURES ON INTEGRATED CIRCUIT...

Methods for wafer-level packaging of microelectronic devices and mi...

Methods for wafer-level packaging of microelectronic devices and mi...