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James M. Drumm
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Dallas, TX, US
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last 30 patents
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Patent Grant
Solder bump transfer for microelectronics packaging and assembly
Patent number
5,646,068
Issue date
Jul 8, 1997
Texas Instruments Incorporated
Arthur M. Wilson
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Three dimensional assembly of integrated circuit chips
Patent number
5,327,327
Issue date
Jul 5, 1994
Texas Instruments Incorporated
Dean L. Frew
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Assembly of semiconductor chips
Patent number
5,025,306
Issue date
Jun 18, 1991
Texas Instruments Incorporated
Randall E. Johnson
H01 - BASIC ELECTRIC ELEMENTS