Number | Name | Date | Kind |
---|---|---|---|
2913632 | Stanton | Nov 1959 | |
3312871 | Seki et al. | Apr 1967 | |
3372310 | Kantor | Mar 1968 | |
3402331 | Rittner | Sep 1968 | |
3430104 | Burgess et al. | Feb 1969 | |
3436604 | Hyltin et al. | Apr 1969 | |
3441805 | Paulson | Apr 1969 | |
3462317 | Baum et al. | Aug 1969 | |
3507766 | Cunningham et al. | Apr 1970 | |
3581385 | Lathrop | Jun 1971 | |
3585712 | Boncuk | Jun 1971 | |
3604989 | Haneta et al. | Sep 1971 | |
3606679 | Schroeder | Sep 1971 | |
3613226 | Haisty et al. | Oct 1971 | |
3634731 | Skogmo | Jan 1972 | |
3643232 | Kilby | Feb 1972 | |
3681134 | Nathanson et al. | Aug 1972 | |
3754170 | Tsuda et al. | Aug 1973 | |
3771217 | Hartman | Nov 1973 | |
3851221 | Beaulieu et al. | Nov 1974 | |
3949274 | Anacker | Apr 1976 | |
4237522 | Thompson | Dec 1980 | |
4525921 | Carson et al. | Jul 1985 | |
4646128 | Carson et al. | Feb 1987 | |
4706166 | Go | Nov 1987 | |
4730232 | Lindberg | Mar 1988 | |
4730238 | Cook | Mar 1988 | |
4801992 | Golubic | Jan 1989 |
Number | Date | Country |
---|---|---|
2515876 | May 1983 | FRX |
Entry |
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Jarvela et al., "Stacked High-Density Multichip Module", IBM Technical Disclosure Bulletin, (vol. 14, No. 10; 3/72; pp. 2896-2897). |