James M. Harper

Person

Yorktown Heights, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reduction of silicide formation temperature on SiGe containing subs...
- Patent number 8,125,082
- Issue date Feb 28, 2012
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of silicide formation temperature on SiGe containing subs...
- Patent number 7,384,868
- Issue date Jun 10, 2008
- International Business Machines Corporation
- Cyril Cabral, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retarding agglomeration of Ni monosilicide using Ni alloys
- Patent number 7,271,486
- Issue date Sep 18, 2007
- International Business Machines Corporation
- Cyril Cabral, Jr.
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Retarding agglomeration of Ni monosilicide using Ni alloys
- Patent number 6,905,560
- Issue date Jun 14, 2005
- International Business Machines Corporation
- Cyril Cabral, Jr.
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and structure for controlling the interface roughness of cob...
- Patent number 6,809,030
- Issue date Oct 26, 2004
- International Business Machines Corporation
- Paul David Agnello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for reduction of contact resistance of metal s...
- Patent number 6,753,606
- Issue date Jun 22, 2004
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects with Ti-containing liners
- Patent number 6,503,641
- Issue date Jan 7, 2003
- International Business Machines Corporation
- Cyril Cabral
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Self-aligned silicide process for reduction of Si consumption in sh...
- Patent number 6,444,578
- Issue date Sep 3, 2002
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for controlling the interface roughness of cob...
- Patent number 6,440,851
- Issue date Aug 27, 2002
- International Business Machines Corporation
- Paul David Agnello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflective spatial light modulator array
- Patent number 6,424,388
- Issue date Jul 23, 2002
- International Business Machines Corporation
- Evan George Colgan
- G02 - OPTICS
Information Patent Grant
Method and structure for retarding high temperature agglomeration o...
- Patent number 6,413,859
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnection structure incorporating a metal seed layer
- Patent number 6,399,496
- Issue date Jun 4, 2002
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modification of in-plate refractory metal texture by use of refract...
- Patent number 6,346,175
- Issue date Feb 12, 2002
- International Business Machines Corporation
- Evan George Colgan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and structure for reduction of contact resistance of metal s...
- Patent number 6,331,486
- Issue date Dec 18, 2001
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for self-aligned formation of silicide contacts using metal...
- Patent number 6,323,130
- Issue date Nov 27, 2001
- International Business Machines Corporation
- Stephen Bruce Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper stud structure with refractory metal liner
- Patent number 6,300,236
- Issue date Oct 9, 2001
- International Business Machines Corporation
- James M. E. Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature formation of low resistivity titanium silicide
- Patent number 6,187,679
- Issue date Feb 13, 2001
- International Business Machines Corporation
- Cyril Cabral
- C30 - CRYSTAL GROWTH
Information Patent Grant
Copper interconnection structure incorporating a metal seed layer
- Patent number 6,181,012
- Issue date Jan 30, 2001
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper stud structure with refractory metal liner
- Patent number 6,150,723
- Issue date Nov 21, 2000
- International Business Machines Corporation
- James M. E. Harper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making copper alloys for chip and package interconnections
- Patent number 6,090,710
- Issue date Jul 18, 2000
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloys for chip and package interconnections
- Patent number 6,063,506
- Issue date May 16, 2000
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer metal sandwich with taper and reduced etch bias and met...
- Patent number 5,912,506
- Issue date Jun 15, 1999
- International Business Machines Corporation
- Evan G. Colgan
- G02 - OPTICS
Information Patent Grant
Apparatus for electrochemical mechanical planarization
- Patent number 5,911,619
- Issue date Jun 15, 1999
- International Business Machines Corporation
- Cyprian Emeka Uzoh
- B24 - GRINDING POLISHING
Information Patent Grant
Low temperature formation of low resistivity titanium silicide
- Patent number 5,828,131
- Issue date Oct 27, 1998
- International Business Machines Corporation
- Cyril Cabral
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of electrochemical mechanical planarization
- Patent number 5,807,165
- Issue date Sep 15, 1998
- International Business Machines Corporation
- Cyprian Emeka Uzoh
- B24 - GRINDING POLISHING
Information Patent Grant
Reflective spatial light modulator array
- Patent number 5,706,067
- Issue date Jan 6, 1998
- International Business Machines Corporation
- Evan George Colgan
- G02 - OPTICS
Information Patent Grant
Low temperature selective growth of silicon or silicon alloys
- Patent number 5,634,973
- Issue date Jun 3, 1997
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature selective growth of silicon or silicon alloys
- Patent number 5,595,600
- Issue date Jan 21, 1997
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature selective growth of silicon or silicon a...
- Patent number 5,565,031
- Issue date Oct 15, 1996
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a giant magnetoresistance sensor
- Patent number 5,565,236
- Issue date Oct 15, 1996
- International Business Machines Corporation
- Richard J. Gambino
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
REDUCTION OF SILICIDE FORMATION TEMPERATURE ON SiGe CONTAINING SUBS...
- Publication number 20080246120
- Publication date Oct 9, 2008
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Retarding agglomeration of Ni monosilicide using Ni alloys
- Publication number 20050176247
- Publication date Aug 11, 2005
- International Business Machines Corporation
- Cyril Cabral
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reduction of silicide formation temperature on SiGe containing subs...
- Publication number 20050059242
- Publication date Mar 17, 2005
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for reduction of contact resistance of metal s...
- Publication number 20040195695
- Publication date Oct 7, 2004
- International Business Machines Corporation
- Cyril Cabral,
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Retarding agglomeration of Ni monosilicide using Ni alloys
- Publication number 20040123922
- Publication date Jul 1, 2004
- Cyril Cabral
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method to improve performance of microelectronic circuits
- Publication number 20040038489
- Publication date Feb 26, 2004
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for controlling the interface roughness of cob...
- Publication number 20020182836
- Publication date Dec 5, 2002
- International Business Machines Corporation
- Paul David Agnello
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for retarding high temperature agglomeration o...
- Publication number 20020151158
- Publication date Oct 17, 2002
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-aligned silicide process for reduction of Si consumption in sh...
- Publication number 20020115262
- Publication date Aug 22, 2002
- International Business Machines Corporation
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnects with Ti-containing liners
- Publication number 20020076574
- Publication date Jun 20, 2002
- International Business Machines Corporation
- Cyril Cabral
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD AND STRUCTURE FOR RETARDING HIGH TEMPERATURE AGGLOMERATION O...
- Publication number 20020061636
- Publication date May 23, 2002
- Cyril Cabral
- H01 - BASIC ELECTRIC ELEMENTS

James M. Harper

Person

Patents Grantslast 30 patents

Reduction of silicide formation temperature on SiGe containing subs...

Reduction of silicide formation temperature on SiGe containing subs...

Retarding agglomeration of Ni monosilicide using Ni alloys

Retarding agglomeration of Ni monosilicide using Ni alloys

Method and structure for controlling the interface roughness of cob...

Method and structure for reduction of contact resistance of metal s...

Interconnects with Ti-containing liners

Self-aligned silicide process for reduction of Si consumption in sh...

Method and structure for controlling the interface roughness of cob...

Reflective spatial light modulator array

Method and structure for retarding high temperature agglomeration o...

Copper interconnection structure incorporating a metal seed layer

Modification of in-plate refractory metal texture by use of refract...

Method and structure for reduction of contact resistance of metal s...

Method for self-aligned formation of silicide contacts using metal...

Copper stud structure with refractory metal liner

Low temperature formation of low resistivity titanium silicide

Copper interconnection structure incorporating a metal seed layer

Copper stud structure with refractory metal liner

Method of making copper alloys for chip and package interconnections

Copper alloys for chip and package interconnections

Multi-layer metal sandwich with taper and reduced etch bias and met...

Apparatus for electrochemical mechanical planarization

Low temperature formation of low resistivity titanium silicide

Method of electrochemical mechanical planarization

Reflective spatial light modulator array

Low temperature selective growth of silicon or silicon alloys

Low temperature selective growth of silicon or silicon alloys

Method for low temperature selective growth of silicon or silicon a...

Method of forming a giant magnetoresistance sensor

Patents Applicationslast 30 patents

REDUCTION OF SILICIDE FORMATION TEMPERATURE ON SiGe CONTAINING SUBS...

Retarding agglomeration of Ni monosilicide using Ni alloys

Reduction of silicide formation temperature on SiGe containing subs...

Method and structure for reduction of contact resistance of metal s...

Retarding agglomeration of Ni monosilicide using Ni alloys

Method to improve performance of microelectronic circuits

Method and structure for controlling the interface roughness of cob...

Method and structure for retarding high temperature agglomeration o...

Self-aligned silicide process for reduction of Si consumption in sh...

Interconnects with Ti-containing liners

METHOD AND STRUCTURE FOR RETARDING HIGH TEMPERATURE AGGLOMERATION O...