James M. Rosson

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Kokomo, IN, US

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Patents Grantslast 30 patents

Information Patent Grant
Process for producing flip chip circuit board assembly exhibiting e...
- Patent number 5,953,814
- Issue date Sep 21, 1999
- Delco Electronics Corp.
- Wayne Anthony Sozansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joint encapsulation material
- Patent number 5,759,730
- Issue date Jun 2, 1998
- Delco Electronics Corporation
- Ralph D. Hermansen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Hot melt epoxy encapsulation material
- Patent number 5,708,056
- Issue date Jan 13, 1998
- Delco Electronics Corporation
- Theresa Renee Lindley
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Hot melt conformal coating materials
- Patent number 5,510,138
- Issue date Apr 23, 1996
- Delco Electronics Corporation
- Henry M. Sanftleben
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hot melt masking materials
- Patent number 5,460,767
- Issue date Oct 24, 1995
- Delco Electronics Corporation
- Henry M. Sanftleben
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL