James M. Wark

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices comprising nickel— and copper—containing inte...
- Patent number 10,446,440
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- Salman Akram
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor devices comprising nickel- and copper-containing inte...
- Patent number 10,062,608
- Issue date Aug 28, 2018
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming interconnects and semiconductor structures
- Patent number 9,640,433
- Issue date May 2, 2017
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 8,669,179
- Issue date Mar 11, 2014
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming interconnects in a semiconductor structure
- Patent number 8,647,982
- Issue date Feb 11, 2014
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 8,502,353
- Issue date Aug 6, 2013
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive vias
- Patent number 8,324,100
- Issue date Dec 4, 2012
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating and filling conductive vias and conductive...
- Patent number 8,294,273
- Issue date Oct 23, 2012
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imagers with optical devices having integral refere...
- Patent number 7,993,944
- Issue date Aug 9, 2011
- Micron Technology, Inc.
- Steven D. Oliver
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 7,956,443
- Issue date Jun 7, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including sloped vias in a substrate and devices including...
- Patent number 7,928,579
- Issue date Apr 19, 2011
- Micron Technology, Inc.
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for fabricating and filling conductive vias and conductive...
- Patent number 7,892,972
- Issue date Feb 22, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures including nickel plated aluminum, c...
- Patent number 7,855,454
- Issue date Dec 21, 2010
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for stacking wire-bonded integrated circuit dice on flip-ch...
- Patent number 7,812,436
- Issue date Oct 12, 2010
- Micron Technology, Inc.
- James M. Wark
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for stacking wire-bonded integrated circuit dice on flip-ch...
- Patent number 7,776,652
- Issue date Aug 17, 2010
- Micron Technology, Inc.
- James M. Wark
- G11 - INFORMATION STORAGE
Information Patent Grant
Device and method for testing integrated circuit dice in an integra...
- Patent number 7,730,372
- Issue date Jun 1, 2010
- Micron Technology, Inc.
- Warren M. Farnworth
- G11 - INFORMATION STORAGE
Information Patent Grant
Spacers for packaged microelectronic imagers and methods of making...
- Patent number 7,723,741
- Issue date May 25, 2010
- Aptina Imaging Corporation
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imagers with optical devices and methods of manufac...
- Patent number 7,709,776
- Issue date May 4, 2010
- Aptina Imaging Corporation
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-wafer interconnects for photoimager and memory wafers
- Patent number 7,683,458
- Issue date Mar 23, 2010
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with permanent polymer stencil and method for...
- Patent number 7,589,010
- Issue date Sep 15, 2009
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for using data regarding manufacturing procedures integrated...
- Patent number 7,561,938
- Issue date Jul 14, 2009
- Micron Technology, Inc.
- Salman Akram
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Device and method for testing integrated circuit dice in an integra...
- Patent number 7,519,881
- Issue date Apr 14, 2009
- Micron Technology, Inc.
- Warren M. Farnworth
- G11 - INFORMATION STORAGE
Information Patent Grant
Microelectronic imagers with optical devices and methods of manufac...
- Patent number 7,504,615
- Issue date Mar 17, 2009
- Aptina Imaging Corporation
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having plate, stacked dice and conductive vias
- Patent number 7,498,675
- Issue date Mar 3, 2009
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant contact pin assembly and card system
- Patent number 7,488,899
- Issue date Feb 10, 2009
- Micron Technology, Inc.
- Kyle K. Kirby
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating semiconductor components with thinned substr...
- Patent number 7,459,393
- Issue date Dec 2, 2008
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imaging units and methods of manufacturing microele...
- Patent number 7,452,743
- Issue date Nov 18, 2008
- Aptina Imaging Corporation
- Steven D. Oliver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic imagers with optical devices having integral refere...
- Patent number 7,429,494
- Issue date Sep 30, 2008
- Micron Technology, Inc.
- Steven D. Oliver
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods for stacking wire-bonded integrated circuit dice on flip-ch...
- Patent number 7,423,339
- Issue date Sep 9, 2008
- Mircon Technology, Inc.
- James M. Wark
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for stacking wire-bonded integrated circuit dice on flip-ch...
- Patent number 7,423,338
- Issue date Sep 9, 2008
- Micron Technology, Inc.
- James M. Wark
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING NICKEL-AND COPPER-CONTAINING INTER...
- Publication number 20180358263
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES
- Publication number 20140154879
- Publication date Jun 5, 2014
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20130295766
- Publication date Nov 7, 2013
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20110233777
- Publication date Sep 29, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONDUCTIVE VIAS
- Publication number 20110136336
- Publication date Jun 9, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING AND FILLING CONDUCTIVE VIAS AND CONDUCTIVE...
- Publication number 20110095429
- Publication date Apr 28, 2011
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20100171217
- Publication date Jul 8, 2010
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTERCONNECTS IN A SEMICONDUCTOR STRUCTURE
- Publication number 20090176362
- Publication date Jul 9, 2009
- Micron Technology, Inc.
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROELECTRONIC IMAGERS WITH OPTICAL DEVICES AND METHODS OF MANUFAC...
- Publication number 20090155949
- Publication date Jun 18, 2009
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR TESTING INTEGRATED CIRCUIT DICE IN AN INTEGRA...
- Publication number 20090027076
- Publication date Jan 29, 2009
- Micron Technology, Inc.
- Warren M. Farnworth
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROELECTRONIC IMAGERS WITH OPTICAL DEVICES HAVING INTEGRAL REFERE...
- Publication number 20080318353
- Publication date Dec 25, 2008
- Steven D. Oliver
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHODS FOR STACKING WIRE-BONDED INTEGRATED CIRCUIT DICE ON FLIP-CH...
- Publication number 20080315435
- Publication date Dec 25, 2008
- Micron Technology, Inc.
- James M. Wark
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS FOR STACKING WIRE-BONDED INTEGRATED CIRCUIT DICE ON FLIP-CH...
- Publication number 20080311702
- Publication date Dec 18, 2008
- Micron Technology, Inc.
- James M. Wark
- G11 - INFORMATION STORAGE
Information Patent Application
THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS
- Publication number 20080111213
- Publication date May 15, 2008
- Micron Technology, Inc.
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for fabricating and filling conductive vias and conductive...
- Publication number 20070184654
- Publication date Aug 9, 2007
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic imagers with optical devices and methods of manufac...
- Publication number 20070170350
- Publication date Jul 26, 2007
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Projected contact structures for engaging bumped semiconductor devices
- Publication number 20070132097
- Publication date Jun 14, 2007
- James M. Wark
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor component having plate, stacked dice and conductive vias
- Publication number 20070132104
- Publication date Jun 14, 2007
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective activation of aluminum, copper, and tungsten structures
- Publication number 20070132105
- Publication date Jun 14, 2007
- Salman Akram
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for testing bumped die
- Publication number 20070090855
- Publication date Apr 26, 2007
- James M. Wark
- G01 - MEASURING TESTING
Information Patent Application
Method for using data regarding manufacturing procedures integrated...
- Publication number 20070088451
- Publication date Apr 19, 2007
- Salman Akram
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Packaged die on PCB with heat sink encapsulant and methods
- Publication number 20070069372
- Publication date Mar 29, 2007
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for testing bumped die
- Publication number 20070063722
- Publication date Mar 22, 2007
- James M. Wark
- G01 - MEASURING TESTING
Information Patent Application
Methods for stacking wire-bonded integrated circuit dice on flip-ch...
- Publication number 20070063326
- Publication date Mar 22, 2007
- James M. Wark
- G11 - INFORMATION STORAGE
Information Patent Application
Methods for stacking wire-bonded integrated circuit dice on flip-ch...
- Publication number 20070063327
- Publication date Mar 22, 2007
- James M. Wark
- G11 - INFORMATION STORAGE
Information Patent Application
Methods for stacking wire-bonded integrated circuit dice on flip-ch...
- Publication number 20070063328
- Publication date Mar 22, 2007
- James M. Wark
- G11 - INFORMATION STORAGE
Information Patent Application
Methods for stacking wire-bonded integrated circuit dice on flip-ch...
- Publication number 20070063229
- Publication date Mar 22, 2007
- James M. Wark
- G11 - INFORMATION STORAGE
Information Patent Application
Microelectronic imaging units and methods of manufacturing microele...
- Publication number 20070045632
- Publication date Mar 1, 2007
- Micron Technology, Inc.
- Steven D. Oliver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sloped vias in a substrate, spring-like deflecting contacts, and me...
- Publication number 20070045857
- Publication date Mar 1, 2007
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making an interposer with contact structures
- Publication number 20070017093
- Publication date Jan 25, 2007
- James M. Wark
- G01 - MEASURING TESTING

James M. Wark

Person

Patents Grantslast 30 patents

Semiconductor devices comprising nickel— and copper—containing inte...

Semiconductor devices comprising nickel- and copper-containing inte...

Methods of forming interconnects and semiconductor structures

Through-wafer interconnects for photoimager and memory wafers

Methods of forming interconnects in a semiconductor structure

Through-wafer interconnects for photoimager and memory wafers

Methods of forming conductive vias

Methods for fabricating and filling conductive vias and conductive...

Microelectronic imagers with optical devices having integral refere...

Through-wafer interconnects for photoimager and memory wafers

Devices including sloped vias in a substrate and devices including...

Methods for fabricating and filling conductive vias and conductive...

Semiconductor device structures including nickel plated aluminum, c...

Methods for stacking wire-bonded integrated circuit dice on flip-ch...

Methods for stacking wire-bonded integrated circuit dice on flip-ch...

Device and method for testing integrated circuit dice in an integra...

Spacers for packaged microelectronic imagers and methods of making...

Microelectronic imagers with optical devices and methods of manufac...

Through-wafer interconnects for photoimager and memory wafers

Semiconductor devices with permanent polymer stencil and method for...

Method for using data regarding manufacturing procedures integrated...

Device and method for testing integrated circuit dice in an integra...

Microelectronic imagers with optical devices and methods of manufac...

Semiconductor component having plate, stacked dice and conductive vias

Compliant contact pin assembly and card system

Method for fabricating semiconductor components with thinned substr...

Microelectronic imaging units and methods of manufacturing microele...

Microelectronic imagers with optical devices having integral refere...

Methods for stacking wire-bonded integrated circuit dice on flip-ch...

Methods for stacking wire-bonded integrated circuit dice on flip-ch...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES COMPRISING NICKEL-AND COPPER-CONTAINING INTER...

METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

METHODS OF FORMING CONDUCTIVE VIAS

METHODS FOR FABRICATING AND FILLING CONDUCTIVE VIAS AND CONDUCTIVE...

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

METHODS OF FORMING INTERCONNECTS IN A SEMICONDUCTOR STRUCTURE

MICROELECTRONIC IMAGERS WITH OPTICAL DEVICES AND METHODS OF MANUFAC...

DEVICE AND METHOD FOR TESTING INTEGRATED CIRCUIT DICE IN AN INTEGRA...

MICROELECTRONIC IMAGERS WITH OPTICAL DEVICES HAVING INTEGRAL REFERE...

METHODS FOR STACKING WIRE-BONDED INTEGRATED CIRCUIT DICE ON FLIP-CH...

METHODS FOR STACKING WIRE-BONDED INTEGRATED CIRCUIT DICE ON FLIP-CH...

THROUGH-WAFER INTERCONNECTS FOR PHOTOIMAGER AND MEMORY WAFERS

Methods for fabricating and filling conductive vias and conductive...

Microelectronic imagers with optical devices and methods of manufac...

Projected contact structures for engaging bumped semiconductor devices

Semiconductor component having plate, stacked dice and conductive vias

Selective activation of aluminum, copper, and tungsten structures

Method and apparatus for testing bumped die

Method for using data regarding manufacturing procedures integrated...

Packaged die on PCB with heat sink encapsulant and methods

Method and apparatus for testing bumped die

Methods for stacking wire-bonded integrated circuit dice on flip-ch...

Methods for stacking wire-bonded integrated circuit dice on flip-ch...

Methods for stacking wire-bonded integrated circuit dice on flip-ch...

Methods for stacking wire-bonded integrated circuit dice on flip-ch...

Microelectronic imaging units and methods of manufacturing microele...

Sloped vias in a substrate, spring-like deflecting contacts, and me...

Method of making an interposer with contact structures